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检索条件"机构=School of Microelectronics and State Key Laboratory of ASIC and System"
948 条 记 录,以下是141-150 订阅
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The Power of Graph Signal Processing for Chip Placement Acceleration  24
The Power of Graph Signal Processing for Chip Placement Acce...
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43rd International Conference on Computer-Aided Design, ICCAD 2024
作者: Liu, Yiting Zhou, Hai Wang, Jia Yang, Fan Zeng, Xuan Shang, Li School of Computer Science Fudan University Shanghai China Department of ECE Northwestern University Evanston United States Department of ECE IIIinois Institute of Technology Chicago United States State Key Lab of ASIC & System Microelectronics Department Fudan University Shanghai China
Placement is a critical task with high computation complexity in VLSI physical design. Modern analytical placers formulate the placement objective as a nonlinear optimization task, which suffers a long iteration time.... 详细信息
来源: 评论
Millimeter-Wave AlGaN/GaN HEMTs/Si Operated on 12V for 5G RF Handset Applications  16
Millimeter-Wave AlGaN/GaN HEMTs/Si Operated on 12V for 5G RF...
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16th IEEE International Conference on Solid-state and Integrated Circuit Technology, ICSICT 2022
作者: Liu, Dong-Sheng Wang, Peng Jiang, Yi-Zhou Huang, Wei Xiao, Zhi-Qiang Yang, Hong-Qiang Zhang, Wei. Fudan University State Key Laboratory of Asic and System Shanghai Institute of Intelligent Electronics & Systems School of Microelectronics Shanghai200433 China Wuxi Microelectronics Scientific and Research Center Wuxi214035 China University of Electronic Science and Technology of China The State Key Laboratory of Electronic Thin Films and Integrated Devices Chengdu610054 China
In this paper, a RF AlGaN/GaN high electron mobility transistor (HEMT) based on low voltage application of 5G RF handset, firstly fabricated on high-resistive silicon substrate is introduced, which uses Ni/Au as T-sha... 详细信息
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Characterization of Reliabilities of 22 nm UTBB FDSOI Ring Oscillators  16
Characterization of Reliabilities of 22 nm UTBB FDSOI Ring O...
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16th IEEE International Conference on Solid-state and Integrated Circuit Technology, ICSICT 2022
作者: Cai, Chang Zhao, Kai Yu, Jian Chen, Gengsheng Shen, Mingjie Ning, Bingxu Yu, Jun Fudan University State Key Laboratory of Asic and System Shanghai China Fudan Microelectronics Co. Ltd. Shanghai China Zhangjiang Fudan International Innovation Center China
In this paper, the Ring Oscillators (ROs) with inverters, 8 (or 16) dividers, and 3-level buffers are fabricated in a 22 nm Ultra-Thin Body and Buried oxide (UTBB) Fully Depleted Silicon on Insulator (FDSOI) technolog... 详细信息
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Investigation of the Structural, Electronic, Optical, and Interface Properties of the Two-Dimensional Dion-Jacobson Perovskite BDA(MA)Mg2I7 for Lead-Free Solar Cells using Density Functional Theory  4
Investigation of the Structural, Electronic, Optical, and In...
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4th International Conference on New Energy and Power Engineering, ICNEPE 2024
作者: Traore, Aboubacar Li, Xing Molang, Cai School of New Energy North China Electric Power University State Key Laboratory of Alternate Electrical Power System With Renewable Energy Sources Beijing Key Laboratory of Novel Thin-Film Solar Cells Beijing China Chinese Academy of Sciences Institute of Microelectronics Beijing China
Two-dimensional (2D) Dion-Jacobson (DJ) perovskites are known for their exceptional optical properties and superior stability, surpassing those of traditional three-dimensional (3D) perovskites. However, the toxicity ... 详细信息
来源: 评论
The Electrical-thermal Coupling Modeling about Large Periphery RF GaN HEMT on Si employing by Through Wafer Via Structure  16
The Electrical-thermal Coupling Modeling about Large Periphe...
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16th IEEE International Conference on Solid-state and Integrated Circuit Technology, ICSICT 2022
作者: Wei, Zhen-Tao Jiang, Yi-Zhou Wang, Ying-Sheng Huang, Wei Xiao, Zhi-Qiang Zhang, Wei Fudan University State Key Laboratory of Asic and System Shanghai Institute of Intelligent Electronics & Systems School of Microelectronics Shanghai200433 China Nanjing Electronic Device Institute Nanjing210016 China Wuxi Microelectronics Scientific and Research Center Wuxi214035 China
Non-uniform thermal distribution affects about large periphery GaN HEMT based on through-via structure is analyzed in the paper. According to the self-heating effect and heat dissipation issues of Si-based GaN HEMT RF... 详细信息
来源: 评论
Laser-guided acoustic tweezers
arXiv
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arXiv 2022年
作者: Wang, Qing Chen, Shuhan Zhou, Jia Riaud, Antoine State Key Laboratory of ASIC and System School of Microelectronics Fudan University Shanghai200433 China
Acoustic tweezers1-3 can manipulate microscopic objects and cells independently of the optical4,5, magnetic6,7 and electrical properties 8,9 of the objects or their medium. However, because ultrasonic waves are attenu... 详细信息
来源: 评论
Periodic Analysis of Adaptive LMS Filter in TIADC
Periodic Analysis of Adaptive LMS Filter in TIADC
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International Conference on asic
作者: Jiankun Li Zepeng Lin Fan Ye College of Microelectronics Fudan University Shanghai China State Key Laboratory of ASIC and System Fudan University Shanghai China
A periodic analysis of LMS adaptive filter in TI-ADC is presented. TI-ADC is a efficient technique to reach high sampling frequency but mismatches among different sub-ADCs influence its performance. LMS adaptive filte...
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DASP: Defect and Dopant ab-initio Simulation Package
arXiv
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arXiv 2022年
作者: Huang, Menglin Zheng, Zhengneng Dai, Zhenxing Guo, Xinjing Wang, Shanshan Jiang, Lilai Wei, Jinchen Chen, Shiyou State Key Laboratory of ASIC and System School of Microelectronics Fudan University Shanghai 200433 China
In order to perform automated calculations of defect and dopant properties in semiconductors and insulators, we developed a software package, Defect and Dopant ab-initio Simulation Package (DASP), which is composed of... 详细信息
来源: 评论
In-memory computing to break the memory wall
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Chinese Physics B 2020年 第7期29卷 28-48页
作者: Xiaohe Huang Chunsen Liu Yu-Gang Jiang Peng Zhou State Key Laboratory of ASIC and System School of MicroelectronicsFudan UniversityShanghai 200433China School of Computer Science Fudan UniversityShanghai 200433China
Facing the computing demands of Internet of things(IoT)and artificial intelligence(AI),the cost induced by moving the data between the central processing unit(CPU)and memory is the key problem and a chip featured with... 详细信息
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Heavy ion‑induced MCUs in 28nm SRAM‑based FPGAs:upset proportions,classifications,and pattern shapes
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Nuclear Science and Techniques 2022年 第12期33卷 128-137页
作者: Shuai Gao Xin‑Yu Li Shi‑Wei Zhao Ze He Bing Ye Li Cai You‑Mei Sun Guo‑Qing Xiao Chang Cai Jie Liu Institute of Modern Physics Chinese Academy of SciencesLanzhou 730000China University of Chinese Academy of Sciences Beijing 100049China School of Physics and Electronic Information Engineering Jining Normal UniversityUlanqab 012000China State Key Laboratory of ASIC and System Fudan UniversityShanghai 201203China
For modern scaling devices,multiple cell upsets(MCUs)have become a major threat to high-reliability field-programmable gate array(FPGA)-based ***,both performing the worst-case irradiation tests to provide the actual ... 详细信息
来源: 评论