36°/Y-cut lithium niobate (LiNbO 3 ) single crystals have been patterned by means of Inductively Coupled Plasma (ICP) deep etching to create ultrasonic arrays resonating in the frequency range of 100-200 MHz. The...
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ISBN:
(纸本)9781424492909
36°/Y-cut lithium niobate (LiNbO 3 ) single crystals have been patterned by means of Inductively Coupled Plasma (ICP) deep etching to create ultrasonic arrays resonating in the frequency range of 100-200 MHz. The limitation of etching aspect ratio and the minimum pitch are explored under the optimized ICP parameters. The experimental results demonstrate that the minimum pitch could be obtained at about 25 μm, equivalent to a pitch of 1.6 λ, with a kerf depth of 16 μm. Focusing Ion Beam (FIB) technique is also studied to etch LiNbO 3 crystals. The aspect ratio is up to as high as 6. A pitch of 0.5 λ can be obtained for a 100 MHz half-kerfed LiNbO 3 array.
In this work, an approach for copper atomic layer deposition (ALD) via reduction of Cu x O films was investigated regarding applications in ULSI interconnects, like Cu seed layers directly grown on diffusion barriers ...
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In this work, an approach for copper atomic layer deposition (ALD) via reduction of Cu x O films was investigated regarding applications in ULSI interconnects, like Cu seed layers directly grown on diffusion barriers (e. g. TaN) or possible liner materials (e. g. Ru or Ni) as well as non-ferromagnetic spacer layers between ferromagnetic films in GMR sensor elements, like Ni or Co. The thermal Cu x O ALD process is based on the Cu (I) β-diketonate precursor [( n Bu 3 P) 2 Cu(acac)] and a mixture of water vapor and oxygen (“wet O 2 ”) as co-reactant at temperatures between 100 and 130°C. Highly efficient conversions of the Cu x O to metallic Cu films are realized by a vapor phase treatment with formic acid (HCOOH), especially on Ru substrates. Electrochemical deposition (ECD) experiments on Cu ALD seed/Ru liner stacks in typical interconnect patterns are showing nearly perfectly filling behavior. For improving the HCOOH reduction on arbitrary substrates, a catalytic amount of Ru was successful introduced into the Cu x O films during the ALD with a precursor mixture of the Cu (I) β-diketonate and an organometallic Ru precursor. Furthermore, molecular and atomic hydrogen were studied as promising alternative reducing agents.
The antiferroelectrics is antiparallel orientations of neighboring dipoles accompanying an antiferroelectric-ferroelectric (AFE-FE) transition under a high field. However, the ferroelectric domains are unstable and ea...
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In this submission, we present the characterization of a silicon electro-optical modulator using Mach-Zehnder interferometer structure. We characterize the transmission spectra upon various DC and RF voltage supplies ...
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In this submission, we present the characterization of a silicon electro-optical modulator using Mach-Zehnder interferometer structure. We characterize the transmission spectra upon various DC and RF voltage supplies with different input optical power. We show the slope efficiency dependence on the optical input power. We also measured the spur-free dynamic range of the modulator using two-tone method, showing an optical power dependent SFDR with maximum value of ~ 7.5 dBc.
The dielectric capacitance of ferroelectric thin films decreases continuously with time above 1 s under the voltage, which is generally explained in terms of defect-related physics. For the better understanding of und...
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The dielectric capacitance of ferroelectric thin films decreases continuously with time above 1 s under the voltage, which is generally explained in terms of defect-related physics. For the better understanding of underlying physics, we delved into the capacitance degradation with time short into a nanosecond order at 77.6 K. The typical feature of the degradation is steplike at around 70 μs. Consequently, we measured the imprint profile in the similar time scale, where the coercive voltage shows a steplike jump at the same time. This suggests the common physics of charge injection responsible for the above two processes.
For the integration of high-density ferroelectric random access memories, each memory cell can be formed at the cross point of a plate line and a common node electrode, where the ferroelectric film is continuous betwe...
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A high performance plasmonic thermal emitter with narrow bandwidth emission property were proposed and fabricated. This emitter is based on a metal coated two-dimensional (2D) photonic crystal of air holes in a silico...
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F-doped SiOCN films with low dielectric constant have been prepared using SiH4, C2F6 and N2O as reactants by PECVD, and characterized by X-ray photoelectron spectroscopy (XPS), capacitance -voltage (C-V) and current-v...
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PIN tunneling field effect transistor (TFET) is one of the most promising devices due to its low sub-threshold swing. In this paper, using TCAD simulation, we investigate the doping and structure dependence of the ele...
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The Ferroelectricity maintained in ultrathin films could suffer from bad polarization retention due to epitaxial stresses and interfacial effects. It makes a great difference to incorporate ultrathin PZT films with a ...
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