Currently, 200 mm wafer foundry companies are beginning to explore production feasibility under ground rules smaller than 0.11 μm while maintain the cost advantages of KrF exposure tool systems. The kl factor under 0...
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Currently, 200 mm wafer foundry companies are beginning to explore production feasibility under ground rules smaller than 0.11 μm while maintain the cost advantages of KrF exposure tool systems. The kl factor under 0.11 μm at 248 nm illumination will be below 0.35, which means the process complexity is comparable with 65 nm at 193 nm illumination. In this paper, we present our initial study in the CD process window, mask error factor and CD through pitch performance at the 0.09 μm ground rule for three critical layers--gate poly, metal and contact. The wafer data in the process window and optical proximity will be analyzed. Based on the result, it is shown that the KrF tool is fully capable of sub 0.11 μm node mass production.
The reaction mechanisms of Al(CH3 )3 (TMA) adsorption on H-passivated GeSi(100)-2 × 1 surface are investigated with density functional theory. The Si-Ge and Ge-Ge one-dimer cluster models are employed to re...
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The reaction mechanisms of Al(CH3 )3 (TMA) adsorption on H-passivated GeSi(100)-2 × 1 surface are investigated with density functional theory. The Si-Ge and Ge-Ge one-dimer cluster models are employed to represent the GeSi(100)-2 × 1 surface with different Ge compositions. For a Si-Ge dimer of a H-passivated SiGe surface, TMA adsorption on both Si-H^* and Ge-H^* sites is considered. The activation barrier of TMA with the Si-H^* site (1.2eV) is higher than that of TMA with the Ge-H^* site (0.91 eV), which indicates that the reaction proceeds more slowly on the Si-H^* site than on the Ge-H^* site. In addition, adsorption of TMA is more energetically favorable on the Ge-Ge dimer than on the Si-Ge dimer of H-passivated SiGe.
We report the chemical self-assembly growth of Au nanocrystals on atomic-layer-deposited HfO2 films aminosilanized by (3-Aminopropyl)-trimethoxysilane aforehand for memory applications. The resulting Au nanocrystals...
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We report the chemical self-assembly growth of Au nanocrystals on atomic-layer-deposited HfO2 films aminosilanized by (3-Aminopropyl)-trimethoxysilane aforehand for memory applications. The resulting Au nanocrystals show a density of about 4 × 10^11 cm^-2 and a diameter range of 5-8nm. The metal-oxide-silicon capacitor with double-layer Au nanocrystals embedded in HfO2 dielectric exhibits a large C - V hysteresis window of 11.9 V for ±11 V gate voltage sweeps at 1MHz, a flat-band voltage shift of 1.5 V after the electrical stress under 7 V for 1ms, a leakage current density of 2.9 × 10^-8 A/cm^-2 at 9 V and room temperature. Compared to single-layer Au nanocrystals, the double-layer Au nanocrystals increase the hysteresis window significantly, and the underlying mechanism is thus discussed.
We developed a simplified nanofabrication process for imprint templates by fast speed electron beam lithography(EBL) and a dry etch technique on a SiNx substrate,intended for large area *** this end,the highly sensi...
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We developed a simplified nanofabrication process for imprint templates by fast speed electron beam lithography(EBL) and a dry etch technique on a SiNx substrate,intended for large area *** this end,the highly sensitive chemically amplified resist(CAR),NEB-22,with negative tone was *** EBL process first defines the template pattern in NEB-22,which is then directly used as an etching mask in the subsequent reactive ion etching(RIE) on the SiNx to form the desired *** properties of both e-beam lithography and dry etch of NEB-22 were carefully studied,indicating significant advantages of this process with some drawbacks compared to when Cr was used as an etching ***,our results open up a good opportunity to fabricate high resolution imprint templates with the prospect of wafer scale manufacturing.
The electrical levels of defects of high- k dielectric Zr O2 films deposited with different oxygen fluxes have been investigated using x-ray diffraction, x-ray photoelectron spectroscopy, and spectroscopic ellipsometr...
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We demonstrate electrically-pumped room-temperature continuous-wave lasing in InP-based microdisks lasers with threshold current of 5mA. A defect on the disc circumference is used to extract the light and to achieve h...
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We demonstrate electrically-pumped room-temperature continuous-wave lasing in InP-based microdisks lasers with threshold current of 5mA. A defect on the disc circumference is used to extract the light and to achieve high quality single mode operation.
Multilayers of poly(p-xylyleneviologen) (PXV) and calf thymus DNA were constructed on the gold surface by layer-by-layer (LBL) method. The assembly process was examined by quartz crystal microbalance (QCM) measurement...
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A n atomic-layer-deposited Al2O3/HfO2/Al2O3 (A/H/A) tunnel barrier is in vestigated for Co nanocrystal memory capacitors. Compared to a single Al2O3 tunnel barrier, the A/H/A barrier can significantly increase the h...
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A n atomic-layer-deposited Al2O3/HfO2/Al2O3 (A/H/A) tunnel barrier is in vestigated for Co nanocrystal memory capacitors. Compared to a single Al2O3 tunnel barrier, the A/H/A barrier can significantly increase the hysteresis window, i.e., an increase by 9 V for ±12 V sweep range. This is attributed to a marked decrease in the energy barriers of charge injections for the A/H/A tunnel barrier. Further, the Co-nanocrystal memory capacitor with the A/H/A tunnel barrier exhibits a memory window as large as 4.1 V for 100 μs program/erase at a low voltage of ±7 V, which is due to fast charge injection rates, i.e., about 2.4× 10^16 cm^-2 s^-1 for electrons and 1.9× 1016 cm^-2 s^-1 for holes.
As metal - oxide - semiconductor field-effect transistors (MOSFETs) down scaling progresses into the nanometer regime, quantum mechanical effects are becoming more and more significant. In this work, a model for the s...
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As metal - oxide - semiconductor field-effect transistors (MOSFETs) down scaling progresses into the nanometer regime, quantum mechanical effects are becoming more and more significant. In this work, a model for the surrounding-gate (SG) nMOSFET is developed. The Schro¿dinger equation is solved analytically and some of the results are verified via simulations. We find that the percentage of the electrons with a lighter conductivity mass increases as the temperature decreases, or as the gate voltage reduces. These imply that low temperature and low gate voltage will enhance the electron effective mobility, which is good for the device performance.
Since low-density parity-check codes have near-capacity decoding performance and very high decoding throughput, they have been employed as FEC coding scheme in many transmission standards for wireless communication, s...
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Since low-density parity-check codes have near-capacity decoding performance and very high decoding throughput, they have been employed as FEC coding scheme in many transmission standards for wireless communication, such as IEEE 802.22n, IEEE 802.16e, DVB-S2, and DTMB. This trend triggers the need for so-called multi-standard LDPC decoders. In this paper, a flexible architecture that supports multiple code rates, variable block sizes and is code independent for block-LDPC codes is proposed, based on rearranged TPMP algorithm,. By implementing a dynamically reconfigurable RPPU, our proposed architecture can be configured into row update or column update mode by time-division multiplexing. Consequently, the decoder achieves a high area and power efficiency. To verify our proposed architecture, a novel LDPC decoder which supports IEEE802.16e standard has been implemented. The results on a 0.18 um CMOS process show that the decoder occupies an area of approximately 13.7 mm 2 and runs correctly at an maximum operating frequency of 110 MHz, resulting in 98 Mbps decoding throughput.
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