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12th International Conference on Quality, reliability, Risk, Maintenance, and Safety Engineering, QR2MSE 2022

作者： Yu, Pengfei Wang, Gang Huang, Yun Huang, Chuangmian Lu, Guoguang School of Electric Power Engineering South China University of Technology Guangzhou China Laboratory of Science and Technology on Reliability Physics and Application of Electronic Component China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou China Technology and Planning Office China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou China

ISBN: (纸本)9781839538360

Supercapacitors are new types of electrical energy storage components with an electric double layer. Ageing characteristics, lifetime and reliability evaluation are of great significance for quality evaluation and rational use. This paper focused on the pseudo-failure calendar lifetime distribution and reliability evaluation of supercapacitors. High-temperature accelerated calendar ageing test of supercapacitors is carried out, and equivalent series resistance and capacitance were tested. Pseudo-lifetime is calculated and distribution is fitted. Fitting results showed that the pseudo-lifetime of supercapacitors is more in line with Weibull distribution. Finally, the reliability curve and its bounds with 95% confidence are made, as a result of the reliability evaluation of supercapacitors. © 2022 IEEE.

关键词： Supercapacitor

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Effect of Packaging on the Marine Fiber Optic Acoustic Sensitive components

Effect of Packaging on the Marine Fiber Optic Acoustic Sensi...

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International Conference on (ICEPT) electronic Packaging technology

作者： Shuwang Li Jianfei Wang Yuebo Liu Mo Chen Wenyuan Liao Guoguang Lu Science and Technology on Reliability Physics and Application of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou China College of Meteorology and Oceanology National University of Defense Technology Changsha China

ISBN: (数字)9798350353808

ISBN: (纸本)9798350353815

Packaging is an extremely important part of marine fiber optic acoustic sensitive components, both for effective isolation from seawater and for highly sensitive acoustic detection. It is essential to study the effect of packaging on marine fiber optic acoustic sensitive components, particularly those designed for long-term deployment in the high hydrostatic pressures of seawater. In order to analyze the possible effects of packaging, a hydrostatic pressure simulator is employed to simulate the actual subsea operating environment of fiber optic acoustic sensitive components. Unfortunately, it is difficult to effectively analysis the relevant changes in the traditional method such as testing the overall optical insertion loss of fiber optic acoustic sensitive components. In this paper, we propose an innovative method to accurately monitor the fiber optic change inside the fiber optic acoustic sensitive component by adopting the advanced distributed fiber optic strain testing technique, thus to provide a technical means for analysis. In detail, we built an experimental setup as described above and conducted practical test experiments using unpackaged and packaged samples, respectively. Firstly, we tested the strain performance of unpackaged sample under different hydrostatic pressures, and the experimental results found that the test curves showed good symmetry, and under hydrostatic pressure, the optical fiber appeared to have a periodic change, and the strain amplitude of the optical fiber gradually increased with the increase of the pressure. The strain region was relatively flat, and the transition region was smooth. Further, we tested the strain performance of the packaged samples under different hydrostatic pressures, and the experimental results revealed that although the optical fiber appeared to change periodically under hydrostatic pressure, and the strain amplitude of the optical fiber gradually increased with the increase of the pressure, the test curves a

关键词： Optical fibers Optical fiber losses Optical fiber sensors Ultraviolet sources Failure analysis Packaging Acoustics

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Field-driven merging of polarizations and enhanced electrocaloric effect in BaTiO_(3)-based lead-free ceramics

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Journal of Advanced Ceramics 2022年第11期11卷 1777-1788页

作者： Xiang NIU Xiaodong JIAN Weiping GONG Wei LIANG Xuetian GONG Guangzu ZHANG Shenglin JIANG Kun YU Xiaobo ZHAO Yingbang YAO Tao TAO Bo LIANG Sheng-Guo LU Guangdong Provincial Key Laboratory of Functional Soft Condensed Matter School of Materials and EnergyGuangdong University of TechnologyGuangzhou 510006China Guangdong Provincial Key Laboratory of Electronic Functional Materials and Devices Huizhou UniversityHuizhou 516007China Science and Technology on Reliability Physics and Application of Electronic Component Laboratory The 5th Electronics Research Institute of the Ministry of Industry and Information TechnologyGuangzhou 510610China Dongguan South China Design Innovation Institute Dongguan 523808China School of Optical and Electronic Information Wuhan National Laboratory for OptoelectronicsHuazhong University of Science and TechnologyWuhan 430074China

Solid-state cooling technology based on electrocaloric effect(ECE)has been advanced as an alternative to replace the vapour-compression approach to overcome the releasing of the global warming ***,the development in high ECE materials is still a *** this work,polarization merging strategy was proposed to achieve a large ECE in xBa(Sn_(0.07)Ti_(0.93))O_(3)–(1−x)Ba(Hf_(0.1)Ti_(0.9))O_(3) ferroelectric ceramics,where x=0,0.2,0.4,0.6,0.8,and ***(Sn_(0.07)Ti_(0.93))O_(3) with an orthorhombic phase and Ba(Hf_(0.1)Ti_(0.9))O_(3) with a rhombohedral phase at room temperature were prepared beforehand as precursors,and phase-coexisted xBSnT–(1−x)BHfT ceramics were formed via a solid-state reaction *** coexisting structures were confirmed using the X-ray *** merged polarization was confirmed by the dielectric and ferroelectric *** ECEs were obtained for 0.2BSnT–0.8BHfT ceramics,i.e.,adiabatic temperature change DT=2.16±0.08 K at 80℃and 5 MV/m,and DT=3.35±0.09 K at 80℃and 7 MV/m.

关键词： lead-free ferroelectric microstructure permittivity polarization electrocaloric effect(ECE)

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Research on the reliability of wire bonding in humid environments

Research on the reliability of wire bonding in humid environ...

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13th International Conference on Quality, reliability, Risk, Maintenance, and Safety Engineering (QR2MSE 2023)

作者： X. Zhang X. Ling R. Gao Science and Technology on Reliability Physics and Application of Electronic Component Laboratory 110 DongGuangZhuang Road Guangzhou People's Republic of China

ISBN: (数字)9781839539275

In order to study the reliability of bonding wire under the condition of humidity environment, a testing structure chip was designed and three samples were subjected to humid test at 85°C/85% RH. During the experiment, all three samples showed an increase in leakage current. Through on-site observations, it was found that the leakage current occurred initially, when the experiment continued, the test structure failed due to the detachment of bonding wires from the bonding pad. The failure analysis showed that the surface of the passivation layer between adjacent aluminium pads was covered with impurities, including carbon (C), sodium (Na), aluminium (Al), tungsten (W), and chlorine (Cl) elements. The presence of these conductive elements resulted in leakage between two adjacent aluminium pads on the chip surface that had different electronic potentials. The detachment of bonding wires from the bonding pad is attributed to a chemical reaction caused by vapors. This reaction corrodes the metal aluminium on the bonding pad, leading to the formation of aluminium oxide, causing the gold wire to detach from the pad, and the lifetime of the bonding wire solder joints has been calculated.

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A Fault Diagnosis Method for Power electronic Circuits Based on GADF Coding and Channel Split Residual Network

A Fault Diagnosis Method for Power Electronic Circuits Based...

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International Conference on Sensing, Diagnostics, Prognostics, and Control (SDPC)

作者： Linghui Meng Jinyang Xie Zhenwei Zhou Yiqiang Chen Science and Technology on Reliability Physics and Application of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou China School of Electrical Engineering Beijing Jiaotong University Beijing China

ISBN: (数字)9798350388855

ISBN: (纸本)9798350388862

With the objective to achieve an accurate diagnosis of commonly encountered fault problems in power electronic circuits and to prevent the occurrence of catastrophic failures, a soft fault diagnosis model for dc-dc converter based on the gram angle difference filed (GADF) and the channel split residual network (CSRN) is proposed. Firstly, the original fault data is coded by GADF to generate the fault data set. Secondly, channel split preprocessing (CSP) and Darwinian selection mechanism (DSM) are introduced to enhance the residual network and further construct the CSRN. CSP emphasizes the important channel features in the fault feature images by achieving a brute-force enhancement of the channel information and highlighting subtle features. DSM retains the key features and removes the secondary features during network training. The GADF-CSRN diagnosis model proposed in this paper is verified by the fault data collected from a dc-dc converter. The result showed that a diagnosis accuracy of 97.92% is achieved, surpassing the accuracy of conventional method by at least 1.85%, while exhibiting better noise resistance.

关键词： Fault diagnosis Training Resistance Accuracy DC-DC power converters Power electronics Sensors Circuit faults Integrated circuit modeling Residual neural networks

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Research on IC-LOGO Extraction Algorithm Based on Deep Semantic Segmentation Network

Research on IC-LOGO Extraction Algorithm Based on Deep Seman...

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IEEE International Conference on Artificial Intelligence and Computer applications (ICAICA)

作者： Yue Zhao Mingfeng Guan Jun Luo Qiuzhen Zhang Science and Technology on Reliability Physics and Application of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou China Testing Center of Electronic Components China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou China

ISBN: (数字)9798350377255

ISBN: (纸本)9798350377262

Considering the characteristics of the logo and character areas being intertwined, along with the variability in size and irregularity in shape of logos within integrated circuit (IC) identification images, this paper propose a logo extraction algorithm based on a deep semantic segmentation network. Initially, preprocessing and data augmentation techniques are employed to facilitate the creation of an IC identification dataset, alongside the establishment of a semantic segmentation dataset specifically for the LOGO area. Subsequently, network models including DeepLabv3+, U-Net, PSPNet, and HRNet are trained and validated to identify the optimal model for IC logo extraction. The experimental results indicate that the deep semantic segmentation network demonstrates effective segmentation performance in the extraction of integrated circuit logos, with the HRNet model achieving high segmentation accuracy and an average intersection-over-union ratio of 80%.

关键词： Accuracy Shape Semantic segmentation Computational modeling Termination of employment Computer applications Inspection Feature extraction Data augmentation Integrated circuit modeling

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Investigation of Heavy-Ion Induced Degradation and Catastrophic Burnout Mechanism in Sic Diode

SSRN

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SSRN 2024年

作者： Zhang, Hong Peng, Chao Ma, Teng Zhang, Zhan-Gang He, Yu-Juan Li, Bin Lei, Zhi-Feng Science and Technology on Reliability Physics and Application of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou510610 China School of Microelectronics South China University of Technology Guangzhou510610 China

Irradiation experiment and simulation of 205-MeV Ge ion and 283-MeV I ion were used to analyze the single event leakage current (SELC) and the single event burnout (SEB) mechanism of SiC diode. Under two selected heavy ion irradiations, the ampere-magnitude pulse current were generated along with the occurrence of SEB. The SEB area was found to cover the anode metal, epitaxial layer and substrate in microscopic analysis, which resulted in damage to the forward and reverse characteristics of device. Devices were irradiated by 205-MeV Ge ion with a fluence of 5×106 n·cm-2, under 200 V and 300 V reverse bias voltages, the breakdown voltage were degraded by 70% and 82% respectively. The anode contacts of SELC devices had local fractures and displacements, which led to the degradation of breakdown characteristics. Combined Monte Carlo simulation and TCAD simulation, the SEB critical temperature appeared near the anode contact firstly when the two selected heavy ions were incident. When the two selected heavy ions were incident from Schottky and Ohmic contacts at a bias voltage of 200 V, excessive temperature in local areas and temperature differences between different anode materials caused the fractures and displacements of anode contact. © 2024, The Authors. All rights reserved.

关键词： Heavy ions

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A New Resonant Composite Probe for Near-field Scanning

A New Resonant Composite Probe for Near-field Scanning

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International Conference on Microwave and Millimeter Wave technology Proceedings

作者： Duan Nie Rui-Qi Wang Lei Wang School of Electronic Information and Artificial Intelligence Shaanxi University of Science and Technology Xi’an China Science and Technology on Reliability Physics and Application of Electronic Component Laboratory CEPREI Guangzhou

In this article, a new wideband resonant probe with two orthogonal magnetic-field measurement features is proposed. The resonant magnetic-field probe consists of two orthogonal shorted sensing loops, two transmission lines with two outputs, a pair of LC resonant circuits, a shorted via, a connected via, and two rows of coaxial via fences. The LC resonant circuits including a pair of shorted stubs as additional inductor and open stubs as additional capacitor are used to excite resonant mode. The connected and shorted vias are used to form the orthogonal sensing loops. In order to verify the design rationality, the proposed probe is optimized, manufactured, and measured. The simulated results reveal the proposed probe could simultaneously test two orthogonal magnetic-field components at 1.575 GHz.

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Vias electromigration lifetime reliability evaluation by using focus ion beam method

Vias electromigration lifetime reliability evaluation by usi...

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electronics Packaging technology Conference (EPTC)

作者： Zhang Xiao Wen Lin Xiao Ling Zongbei Dai Gao Rui Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Guangzhou China

ISBN: (纸本)9798350398861

The FIB (Focus Ion Beam) Construction analysis is widely used in FA field, such as evaluating process limitations, debugging, and root cause demonstration. In this paper, we describe the reliability check method of the via by using FIB. Based on the electromigration (EM) test of the vias, the reliability check method of the vias is studied through the influence of void area ratio in the via on the EM lifetime of the via. The results showed that under different operating conditions, the same void area ratio has almost the same influence on the EM lifetime, and with the increase of void area ratio in the via, the EM lifetime of the via decreases, when the lifetime decreases by 20%, the corresponding void area ratio is about 12%, which can be used as the check criteria of the via.

关键词： Electromigration Debugging Lifetime estimation reliability Ion beams electronics packaging

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Characterization of contamination degradation of mems accelerometer comb structures

Characterization of contamination degradation of mems accele...

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IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

作者： Jinchuan Chen Xiao Wen Yingyu Xu Qinwen Huang Wanchun Ren Chunhua He Southwest University of Science and Technology Mianyang China Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou China School of Computer Guangdong University of Technology Guangzhou China

ISBN: (数字)9798350359831

ISBN: (纸本)9798350359848

The effect of organic contamination on the sensitive comb structure of accelerometers in microelectromechanical systems (MEMS) is hardly involved in the original MEMS reliability study, because the existing technology can guarantee chip packaging in the absence of contamination, but with the advancement and popularity of multi-chip packaging technology, some chip devices may have organic substances volatilised and have an effect on the strength of the comb structure of accelerometer devices, thus affecting the service life of the devices. However, with the progress and popularity of multi-chip packaging technology, some of the chip devices may have volatilisation of organic substances, which may affect the strength of the acceleration sensor comb, and thus the service life of the device. In this paper, the theoretical derivation and experimental verification method to complete the study, and in the organic pollution test, organic substances will mainly have an impact on the strength of the comb structure of the acceleration sensor, so this paper focuses on the comb structure before and after the organic pollution of the strength of the change. The results of the experimental study show that the strength of the comb structure of the MEMS device decreases to a certain extent after the contamination compared with that before the contamination. This research result provides a theoretical basis for finding the failure inducing factors in the MEMS failure mode and predicting the device life.

关键词： Micromechanical devices Accelerometers Microelectromechanical systems Degradation Pollution Nanoelectromechanical systems Life estimation

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