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Investigation of maximum proton energy for qualified ground based evaluation of single-event effects in SRAM devices

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Nuclear science and Techniques 2019年第3期30卷 97-104页

作者： Zhan-Gang Zhang Yun Huang Yun-Fei En Zhi-Feng Lei Science and Technology on Reliability Physics and Application of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute

Existing standards show a clear discrepancy in the specification of the maximum proton energy for qualified ground-based evaluation of single-event effects,which can range from 180 to 500 MeV. This work finds that the threshold linear energy transfer of a tested device is a critical parameter for determining the maximum proton energy. The inner mechanisms are further revealed. Highenergy deposition events(>10 MeV) in sensitive volumes are attributed to the interaction between protons and the tungsten vias in the metallization layers.

关键词： Proton Single-event effect Threshold LET Monte Carlo simulation

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Research on Phase Consistency of Optical Fiber Delay Module

Research on Phase Consistency of Optical Fiber Delay Module

引用

System reliability and Safety Engineering (SRSE), International Conference on

作者： Wenyuan Liao Shuwang Li Science and Technology on Reliability Physics and Application of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou China

ISBN: (纸本)9781665401616

The optical fiber delay module is mainly used in the optically controlled phased array radar system, which plays a core role in the whole system. Among them, the measurement accuracy of the optical fiber delay and the optical fiber length are key technologies to realize the phase consistency of the module. In this paper, the phase error source and phase consistency control method of optical fiber delay module are analyzed. Further, the high precision phase testing technology and reliability test of optical fiber delay module are carried out. It can be concluded that the combination of fiber fusion taper and optical phase shift can significantly improve the phase accuracy. Meanwhile, the phase consistency of each channel of the fiber delay module is very excellent before and after the test.

关键词： Optical fibers Phased arrays Laser radar Optical variables control reliability engineering Adaptive optics Delays

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A reliability evaluation software for Flip Chip based on failure physics 21

A reliability evaluation software for Flip Chip based on fai...

引用

21st International Conference on electronic Packaging technology, ICEPT 2020

作者： Chen, Si Wu, Qiushi Fu, Zhiwei Huang, Yun Yao, Bin Zhou, Bin Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Guangzhou China South China University of Technology School of Electronic and Information Engineering Guangzhou China

ISBN: (纸本)9781728168265

This paper introduces the flip chip reliability evaluation software developed based on failure physics. Firstly, the system framework of the software is introduced, and then the core algorithm of the software is described. Key parameters such as stress, strain, plastic strain energy density, displacement, acceleration can be extracted, and the service life of the selected structure is obtained through relevant failure physical models. The lifetime of each key structure is used to obtain the lifetime of the whole flip chip device through the competition algorithm of short board effect. An example of Flip chip device reliability evaluation under condition of standard GJB548B-2005 method 1010.1 C temperature cycling was given, it shows that the predicted device life is 207 cycles. © 2020 IEEE.

关键词： Software reliability

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Black equation of the electromigration lifetime for ceramic package with lead bumps and plastic package with lead-free bump 21

Black equation of the electromigration lifetime for ceramic ...

引用

21st International Conference on electronic Packaging technology, ICEPT 2020

ISBN: (纸本)9781728168265

In this study, electromigration accelerated life tests of lead-containing copper pillar bumps in ceramic packages and lead-free copper pillar bumps in plastic packages were carried out at different current densities and ambient temperatures. The electromigration life prediction model based on Black equation was established for the two. The influence index n and activation energy Q of current density of interconnection bumps with two structures were determined through MTTF analysis of samples. Based on the life prediction model, the effects of substrate material, temperature and current density parameters on electromigration life were compared. Finally, considering the influence of Joule heating effect and current crowding effect, the electromigration life prediction models of the two bumps are modified. © 2020 IEEE.

关键词： Electromigration

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Computer transient simulation for dual in-line package through finite element analysis and ANASYS software 3

Computer transient simulation for dual in-line package throu...

引用

3rd International Conference on Electrical, Communication and Computer Engineering, ICECCE 2021

作者： Su, Wei Luo, Wenhao Dong, Xianshan Chen, Si Tomar, Agam Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou China MOE Key Lab of Disaster Forecast and Control in Engineering Guangzhou China School of Mechanics and Construction Engineering Jinan University Guangzhou China Faculty of Engineering and Mathematical Sciences University of Western Australia Australia

The reliability of the DIP package is studied by numerical simulation. Firstly, the DIP package, fixture and metal steel are modeled. Based on this, variable thickness papers are laid on the sample. According to the experiment, corresponding excitation and boundary condition are set. Then, the transient analysis result of DIP package is obtained through numerical simulation. The results show the relation of different thickness papers and acceleration-time curve, which provides a beneficial reference for the optimization of DIP packing. © 2021 Institute of physics Publishing. All rights reserved.

关键词： Transient analysis

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A Low Frequency Fiber Vibration Acceleration Sensor Based on Long Period Fiber Grating and Double-Clamped Beam

SSRN

引用

SSRN 2022年

作者： Zhang, Limu Zhang, Wei Liu, Qishi Sun, Xiaoyan Hu, Youwang Duan, Jian State Key Laboratory of High Performance Complex Manufacturing College of Mechanical and Electrical Engineering Central South University Changsha410083 China Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory Guangzhou510610 China

In this paper, we have designed, fabricated and characterized a fiber sensor for the measurement of low frequency vibration acceleration. The sensor structure based on a double-clamped beam and a long period fiber grating (LPFG) that inscribed in single mode fiber (SMF) by femtosecond laser. The LPFG stick tightly on top surface of the beam and its transmission spectrum changes with beam bending enabling vibration acceleration *** experimental results suggest that the sensor has an accurate and flat frequency response over a certain range of 1.5~10Hz, and the maximum frequency response error measured experimentally is 4.4%. The maximum measurable acceleration is 0.3g and the maximum acceleration sensitivity measured experimentally is 2.8mW/g with a linearity greater than 99.6%. The temperature drift of the sensor is 0.001g/°C and it also has good anti-interference ability and reliability at the same time. © 2022, The Authors. All rights reserved.

关键词： Single mode fibers

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Harmonic response analysis for ball grid array package using computer finite element simulation 3

Harmonic response analysis for ball grid array package using...

引用

3rd International Conference on Electrical, Communication and Computer Engineering, ICECCE 2021

BGA package is selected as the research object in this paper. Workbench (finite elemental analysis tool in ANSYS) is used for harmonic response analysis. The author lays several paper sheets on the sample and builds the finite element model of clamp, ceramic and metal plate. Then, the model analysis is carried out. Based on this, it is converted to harmonic response analysis. According to the results, the author has found that there is no relation between the number of paper sheets and acceleration-frequency result. It promotes the development of electronic packaging reliability. © 2021 Institute of physics Publishing. All rights reserved.

关键词： Finite element method

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Temperature Hysteresis Effect of Q-factor in Vacuum Packaged MEMS Device 21

Temperature Hysteresis Effect of Q-factor in Vacuum Packaged...

引用

21st International Conference on electronic Packaging technology, ICEPT 2020

作者： Dong, Xianshan Huang, Qinwen Lai, Ping Yang, Shaohua Su, Wei Huang, Yun No.5 Electronics Research Institute of the Ministry of Industry and Information Technology Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Guangzhou China

ISBN: (纸本)9781728168265

Vacuum packaging technology is commonly used in MEMS device to improve performance. Yet, the temperature influence of vacuum packaging on the MEMS device is rarely studied. In this paper, temperature hysteresis effect of Q-factor in vacuum packaged MEMS device was studied. The experimental test was carried out, and the mechanism was also investigated. Four kinds of MEMS gyroscope with different pressure were designed, and their temperature characteristic of Q-factor were measured. The results show that the packaged pressure influences the temperature hysteresis of Q-factor greatly, and lower pressure packaging would cause larger temperature hysteresis of Q-factor. This study is helpful for designer to understand the influence of vacuum packaging and improve temperature performance for vacuum packaged MEMS device. © 2020 IEEE.

关键词： Hysteresis

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Impact of yarn on a textile UHF RFID TAG

Impact of yarn on a textile UHF RFID TAG

引用

IEEE International Conference on RFID-technology and applications (RFID-TA)

作者： Raúl Fernández-García Marc Martínez-Estrada Jordi Bonache Albacete Ignacio Gil Chengyang Luo Department of Electronic Engineering Universitat Politècnica de Catalunya Terrassa Spain Department of Electronic Engineering Universitat Autònoma de Barcelona Bellaterra Spain Science and Technology on Reliability Physics and Application of Electronic Components Laboratory Guangzhou China

An embroidered textile UHF RFID is proposed and characterized. The TAGs are based on a ‘T-match’ structure embroidered on a polyester textile substrate with three different conductive yarns. The input impedance and read range performance has been experimentally measured. The results show that the lower the electrical resistance of the yarn, the greater the TAG read range, achieving up to 7.5 meters.

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Evaluation of stress voltage on off-state time-dependent breakdown for GaN MIS-HEMT with SiNx gate dielectric

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Chinese physics B 2020年第10期29卷 444-450页

作者： Tao-Tao Que Ya-Wen Zhao Qiu-Ling Qiu Liu-An Li Liang He Jin-Wei Zhang Chen-Liang Feng Zhen-Xing Liu Qian-Shu Wu Jia Chen Cheng-Lang Li Qi Zhang Yun-Liang Rao Zhi-Yuan He Yang Liu School of Electronics and Information Technology Sun Yat-Sen UniversityGuangzhou 510275China School of Materials Science and Engineering.Sun Yat-Sen University Guangzhou 510275China Science and Technology on Reliability Physics and Application of Electronic Component Laboratory No.5 Electronics Research Institute of the Ministry of Industry and Information TechnologyGuangzhou 510610China

Stress voltages on time-dependent breakdown characteristics of GaN MIS-HEMTs during negative gate bias stress (with VGS 0, VS = 0) are investigated. For negative bias stress, the breakdown time distribution (β) decr... 详细信息

Stress voltages on time-dependent breakdown characteristics of GaN MIS-HEMTs during negative gate bias stress (with VGS < 0, VD = VS = 0) and off-state stress (VG < VTh, VDS > 0, VS = 0) are investigated. For negative bias stress, the breakdown time distribution (β) decreases with the increasing negative gate voltage, while β is larger for higher drain voltage at off-state stress. Two humps in the time-dependent gate leakage occurred under both breakdown conditions, which can be ascribed to the dielectric breakdown triggered earlier and followed by the GaN layer breakdown. Combining the electric distribution from simulation and long-term monitoring of electric parameter, the peak electric fields under the gate edges at source and drain sides are confirmed as the main formation locations for per-location paths during negative gate voltage stress and off-state stress, respectively.

关键词： gallium nitride LPCVD-SiNx MIS-HEMT time-dependent breakdown negative gate bias offstate stress

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