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检索条件"机构=Science and Technology Laboratory on Reliability Physics and Application of Electronic Component"

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Effects of soldering voids on junction to case thermal resistance in applying electrical testing method

Effects of soldering voids on junction to case thermal resis...

引用

International Conference on reliability, Maintainability and Safety,ICRMS

作者： Jincheng You Bin Zhou Ruguan Li Guoyuan Li Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Guangzhou China South China University of Technology Guangzhou Guangdong CN

ISBN: (纸本)9781479966332

Void in solder layer is one of the important factors resulting in semiconductor chip failure due to poor heat dissipation, so the quality of solder layer is essential for heat distribution and reliability in electronic devices. This article is aimed at analyzing the impact of solder layer voids area on junction to case thermal resistance of devices in applying electrical testing method. The thermal resistance was measured by T3Ster (the Thermal Transient Tester) which adopts thermal transient testing technique. To verify the results, this study employed infrared microscope test the samples under the same conditions, and then used FEM (the finite element method) to simulate the relationships between the thermal resistance and voids in solder joint. Results show that the junction to case thermal resistance of the device increases with the increase in solder layer void percentage but without obvious linear relationship. For the same type devices with fine uniformity, the difference of R th (j-c) is mainly caused by diversity in solder layer void area. Conclusions mentioned above can be used to guide the design of derating for military devices.

关键词： Thermal resistance Temperature measurement Junctions electronic packaging thermal management Electrical resistance measurement Finite element analysis

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The reliability study of 0.13μm CMOS process

The reliability study of 0.13μm CMOS process

引用

International Conference on reliability, Maintainability and Safety,ICRMS

作者： Xiaowen Zhang Yunfei En Science and Technology on Reliability Physics and Application of Electronic Component Laboratory CEPREI Tianhe District Guangzhou P.R. China

When the Minimum channel length shrink to 0.13μιη, As the device geometry size scaling down while the operation voltage of the device decreased, but the electric field increase. The current density is still high in interconnect line, various failure mechanisms still exist in the process generation of copper interconnect/low k dielectric integrated, the reliability is still a very important problem. By using accelerated test, the reliability of the main failure mechanisms have been evaluated, the results showed that the lifetimes of main failure mechanism can achieve the requirements of more than 10 years lifetime. In the same time, NBTI effect will become the main failure mechanism in ultra deep sub-micron CMOS process when Minimum channel length becomes less than 0.13 μιη.

关键词： reliability Failure analysis Logic gates Human computer interaction Dielectrics Stress Copper

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Effect of Pb content on shear performance of SnAgCu-xSnPb/Cu mixed solder joint

Effect of Pb content on shear performance of SnAgCu-xSnPb/Cu...

引用

International Conference on (ICEPT) electronic Packaging technology

作者： xin Wangxin Li Xunping Pan Kailin Zhou Bin Jiang Tingbiao School of Mechanical and Electronic Engineering Guilin University of Electronic Technology Guilin China Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Guangzhou China

In this study, the effect of series Pb content on shear performance of SnAgCu-xSnPb/Cu solder joint was investigated. It was found that Pb content influenced the BGA solder joint shear strength significantly. The shear strength as a function of Pb content shows a parabola trend. The shear strength increased with Pb content increased from 0% to 9.22%. Then the shear strength value kept at a high level from 9.22% to 26.49%. However, this trend stopped when Pb content is 29.42% and the shear strength began to decrease. The failure mode is strongly associated with fracture energy. When Pb was imported into Sn3.0Ag0.5Cu/Cu solder joint, the fracture energy (shear work) of solder joint shear test decreased. When Pb content ranges from 4.67% to 37% the fracture energy seemed no obvious difference. Pb content influenced the solidification sequence when the solder joint was cooling down. The solidification sequence is closely related to the microstructure of mixed solder joint.

关键词： Lead Soldering Microstructure Joints reliability electronics packaging Tin

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Data analysis method of the small samples and zero-failure data for space TWT accelerated life test

Data analysis method of the small samples and zero-failure d...

引用

The 15th International Conference on electronic Packaging technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

作者： Fangfang Song Zhenwei Zhou Bin Li Shajin Li Yunfei En School of electron and information South China University of Technology Science and Technology on Re Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Ele

ISBN: (纸本)9781479947065

Space traveling wave tube(TWT)is one kind of microwave vacuum tube for communication,which must have high reliability,high *** life of the space TWT is requested for a long lifetime of 10-15 *** order to shorten the testing process,accelerated aging tests are performed at higher than normal operating temperature and currents of *** in the process of the actual test,the cathode degradation is very slow,the test time is too long for all samples failing to get the lifetime *** order to obtain the lifetime of the long life tube in a short time,it is necessary to investigate a new method which can evaluate the long lifetime through shortterm working *** paper introduced how to solve the zerofailure test data with small *** no failure data in data processing of life test,parameter degradation extrapolation method is used to obtain the failure life *** the expected life of the sample was estimated of each test samples by least-square method for linear fitting and the goodness of fit and the significance testing was done.

关键词： Space traveling wave tube (TWT) accelerated life tests zero-failure data processing

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Influence mechanism of pad type on the shear performance of Sn3.0Ag0.5Cu/Cu solder joint

Influence mechanism of pad type on the shear performance of ...

引用

International Conference on reliability, Maintainability and Safety,ICRMS

作者： Xin Wang Xunping Li Kailin Pan Bin Zhou Tingbiao Jiang Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Guangzhou China School of Mechanical and Electronic Engineering Guilin University of Electronic Technology Guilin China

ISBN: (纸本)9781479966332

The influence mechanism of different pad types (SMD and NSMD) on the shear performance of Sn3.0Ag0.5Cu/Cu solder joint was investigated by experiment and Finite Element Analysis (FEA) method. The shear force of NSMD solder joint was significantly higher than SMD solder joint by using ball shear test method according to JSED22-B117A standard. The difference in shear force was attributed to the different distribution of stress of the solder joint by using different pad type during shear testing. The location of maximum vians stress in solder joint with NSMD pad changed from the right corner of joint to the boundary of substrate and pad with test time going on. However, the maximum stress always located at the right corner of joint and the end of ram for joint with SMD type pad. The different distribution of stress resulted to a distinct failure model of solder joint.

关键词： Soldering Stress Joints reliability Finite element analysis Force Random access memory

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Effective methods for evaluation of high power laser diode quality and reliability

Effective methods for evaluation of high power laser diode q...

引用

International Conference on reliability, Maintainability and Safety,ICRMS

作者： Guoguang Lu Shaofeng Xie Yun Huang Junsheng Cao Science and Technology on Reliability Physics and Application of Electronic Component Laboratory CEPREI Guangzhou China State Key Laboratory of Luminescence and Application Fine Mechanics and Physics Chinese Academy of Science Changchun China

ISBN: (纸本)9781479966332

In this paper, a high power laser diode electrical derivative parameters test instrument is developed, the wavelength range of this instrument is between 400nm to 1300nm, the power range of this instrument is between 1W to 15W. The relationships between the device reliability and the electrical derivative parameters are discussed. Then the measurements of 20 high power 808nm AlGaAs/GaAs laser diodes by using this instrument combined with the aging test results demonstrate that the electrical derivative parameters can use to evaluate the laser diode reliability and quality effectively.

关键词： Diode lasers reliability Junctions Instruments Aging Semiconductor lasers Resistance

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Thermal-structural coupling analysis of electron gun in air-borne TWT

Thermal-structural coupling analysis of electron gun in air-...

引用

International Conference on reliability, Maintainability and Safety,ICRMS

作者： Wei Su Junhua Zhu Renhuai Liu Fangfang Song Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou P. R. China

ISBN: (纸本)9781479966332

This paper provided the thermal and structural analysis of the gun using the ANSYS package. The results of thermal and structural analysis for complex and simple model are compared. The results of thermal analysis are helpful to the optimizing design of electronic gun. The paper also describes the deformation analysis of the electron gun heater components. We calculate the time for the heater to reach temperature stability considering thermal radiation and heat conduction. We get the heater components thermal deformation and stress distribution. The results presented are beneficial to the heater component design of TWT and experimental results validate the simulation. Based on the simulated thermal transient results, the structure and material of the TWT key parts have been optimized to shorten the warm up time and to improve its fast response ability.

关键词： Heating Thermal analysis Finite element analysis Cathodes Heat transfer Mathematical model Stress

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Simulations of single event transient effects in the LM139 voltage comparator

Simulations of single event transient effects in the LM139 v...

引用

International Conference on reliability, Maintainability and Safety,ICRMS

作者： Jianbo Liu Yuan Liu Jinli Cheng Yunfei En Ting Zhang Yujuan He School of Material and Energy Guangdong University of Technology Guangzhou China Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Guangzhou China

ISBN: (纸本)9781479966332

Single event transient effect in the linear voltage comparator is investigated in this paper. The circuit level simulation is performed to analyze the output response of LM139 voltage comparators with single event transients (SETs). Simulation results show that input stage and two current sources are the most sensitive parts to the single event transient effects. The output responses were shown as transient pulses with different width. Based on the simulation results, the susceptive parts of a LM139 voltage comparator are acquired. Furthermore, the results above can also be helpful to further harden designs of linear ICs.

关键词： Transistors Transient analysis Integrated circuit modeling Single event transients Simulation Analytical models Ion beams

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Electromagnetic interference effects in the bipolar voltage comparators

Electromagnetic interference effects in the bipolar voltage ...

引用

International Conference on reliability, Maintainability and Safety,ICRMS

作者： Chengjin Li Yuan Liu Jianbo Liu Aixiang Wei Yunfei En School of Material and Energy Guangdong University of Technology Guangzhou China Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Guangzhou China

ISBN: (纸本)9781479966332

Electromagnetic interference effects in the bipolar voltage comparator was investigated in this paper. By using of bulk current injection (BCI), the coupling current stimulated by high power electromagnetic pulse was simulated. The experimental results shown that the aberrations such as pulse deriving and pulse width altering will come into being in the output waveforms of LM139 after current injection respectively. Furthermore, the coupling effect of pulse deriving and pulse width broadening were observed simultaneously in the higher level current injections.

关键词： EMP radiation effects Transient analysis Monitoring Laser beams Power lasers Semiconductor lasers

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Evaluation of PCB constraint on hermeticity reliability of DC/DC power module by FEA method

Evaluation of PCB constraint on hermeticity reliability of D...

引用

International Conference on reliability, Maintainability and Safety,ICRMS

作者： Ling Zeng Xunping Li Xiaoqi He Guoyuan Li Hengwei Bao Zhangchao Wang Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Guangzhou China East China Research Institute of Microelectronic Hefei China

ISBN: (纸本)9781479966332

The effects of PCB parameters and boundary constraint condition on stress distribution of glass insulator in DC/DC power module are investigated by using finite element analysis. Results show that the constraint condition and thickness of printed circuit board (PCB) have significant effect on the stress of glass insulator compared with the size of PCB. The value of maximum equivalent stress in glass insulator decrease when PCB boundary is constrained. Suitable thickness of PCB would be benefit to alleviate the maximum equivalent stress of glass insulator.

关键词： Glass Insulators Multichip modules reliability Tensile stress Solid modeling

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