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检索条件"机构=Science and Technology Laboratory on Reliability Physics and Application of Electronic Component"

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The popcorn effect of lead and lead-free mixed assembly process in high density plastic packages

The popcorn effect of lead and lead-free mixed assembly proc...

引用

2011 International Symposium on Advanced Packaging Materials, APM 2011

作者： Hong, Xiao Lai, Ping Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Guangzhou Guangdong China 5th Electronics Research Institute of the Ministry of Industry and Information Technology No.110 Dongguanzhuang Rd Guangzhou Guangdong China

ISBN: (纸本)9781467301473

The expansion of integrated circuit applications is driving chip costs down. To respond to the lower price the lower price expectations, manufacturers bring Plastic packages which is cost less expensive packaging solutions. Today although the electronic packaging industry there are still many enterprises were to have lead solder, but this does not preclude the "lead-free" has become the main topic of electronic materials and microelectronics. In this transitional period, lead and lead-free both assemble on the plastic package in the field of application is already unavoidable. Problem existed in lead or lead-free materials, technology, equipment, system compatibility and other issues. The reliability of the plastic package IC is becoming a key concern. The popcorn effect is caused when moisture inside a plastic package turns to steam and expands rapidly during infrared and vapor phase reflow solder process. Under certain conditions, the force from the expanding moisture can cause stresses inside the package. Solder ball inside with lead process and outside with lead-free may result in failure. It is prompted by the melting point of lead and lead-free material is different in the same BGA packaging chip. In most severe cases, the packaging defects and the stress may result in external package cracks. And in this paper, a sample is given that the BGA packaging chip exist void in the die/die attach interface. Capillary phenomenon is present in the package closest to the die attach, and lead to a short circuit between some pins. Pay more attention to the reliability of mixed assembly process is of great value. © 2011 IEEE.

关键词： Moisture

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Comparison of Two Quality Control Models for Short Run Process Based on Bayesian Analysis

Comparison of Two Quality Control Models for Short Run Proce...

引用

2011 International Conference on Quality,reliability,Risk,Maintenance,and Safety Engineering(2011年质量、可靠性、风险、维修性与安全性国际会议暨第二届维修工程国际学术会议 ICQR2MSE 2011)

作者： Qinwen HUANG Wenxiao FANG Jian LIU Science and Technology on Reliability Physics and Application of Electronic Component Laboratory CEPREI Laboratories Guangzhou China

In dealing with the problem of establishing control limits in short run production, Bayesian approach provides a effective way for are short run process control and are particularly attractive. In this paper, two quality control models for short run process are presented based on Bayesian analysis and the two models are compared. Models are focused on normally distributed data. The first way to establish model is through the posterior density of mean and variance of normally distributed data respectively and the second way is through the posterior predictive density. And the results deduced from two different ways are compared.

关键词： SPC Bayesian analysis posterior distribution

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Studies of the degradation mechanisms in high power diode lasers

Studies of the degradation mechanisms in high power diode la...

引用

2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

作者： Lu Guoguang Huang Yun Lei Zhifeng CEPREI Science and Technology on Reliability Physics and Application of Electronic Component LaboratoryGuangzhou 510610 China

The main failure mechanisms of high power diode lasers such as material defects, mirror damage and solder related failures as well as to methods which significantly suppress the occurrence of catastrophic failure and solder related failures are investigated in this paper. Meanwhile, in order to obtain the lifetime data of high power QCM cm-bar arrays, we have set up an automated diode array reliability experiment to examine the characteristics of high power QCW cm-bar arrays over time, and aging test results up to 2.0×109 shots at 25 °C will be reported.

关键词： Diode lasers Degradation reliability Aging Materials Heating Mirrors

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Failure analysis of LEDs

Failure analysis of LEDs

引用

2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

作者： Lu Guoguang Yang Shaohua Lei Zhifeng CEPREI Science and Technology on Reliability Physics and Application of Electronic Component LaboratoryGuangzhou 510610.China

Light-emitting diodes (LEDS) are a strong candidate for the nest-generation general illumination applications. The reliability of LEDs is the key point for its applications, and the main challenges facing the development of high reliable LED is packaging process. In this paper, the overview of state of the art techniques in LED failure analysis is provided, and the main failure modes such as bonding defects, die attaching defects and other defects that caused by poor package process are investigated through some failure analysis cases.

关键词： Light emitting diodes Bonding Materials Failure analysis Packaging Microassembly reliability

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Effect of gate bias on ESD characteristics in NMOS device

Effect of gate bias on ESD characteristics in NMOS device

引用

2011 International Symposium on Advanced Packaging Materials, APM 2011

作者： He, Yujuan En, Yunfei Luo, Hongwei Xiao, Qingzhong Science and Technology on Reliability Physics and Application of Electrical Component Laboratory Guangzhou 510610 China State Key Laboratory of Functional Materials for Informatics Shanghai Institute of Microsystem and Information Technology Chinese Academy of Sciences Shanghai 200050 China

ISBN: (纸本)9781467301473

Oxide trapped charges which were produced in oxide area of MOSFET in the process of using can cause ESD characteristic changed. So the gate forced given bias to Simulate oxide trapped charges. In this paper, TLP test method was used to study the ESD parameters of NMOSFET with various gate biases. It was indicated that the threshold voltage Vt1 and secondary breakdown current It2 first increased and then decreased with the gate voltage increasing, but the maintained Voltage Vsp essentially unchanged. © 2011 IEEE.

关键词： Threshold voltage

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Time domain reflectometry technique for detecting the degradation of solder joints

Time domain reflectometry technique for detecting the degrad...

引用

International Conference on reliability, Maintainability and Safety

作者： Lu, Yudong Yao, Bin Wan, Ming Feng, Jingdong Science and Technology on Reliability Physics Application of Electronic Component Laboratory Guangzhou 510610 China 5th Electronics Research Institute Ministry of Industry and Information Technology Guangzhou 510610 China Key Laboratory of Specially Functional Materials College of Materials Science and Engineering South China University of Technology China

ISBN: (纸本)9781612846644

Solder joints on the Printed-Circuit board (PCB) serve as mechanical and electrical connections. Their function maybe simple, but the reliability of the solder joints may affect the entire device or system. They are usually the weak links when the electronic products are exposed to a variety of load conditions from their operation and storage, such as temperature cycling, vibration, shock and humidity. One of the most important parameters of solder joints is electrical stability. The resistance or impedance will rise as the fracture spreads through the solder joints. The reliability of solder joints is often determined through continuous DC resistance measurement, but it not very accurate and sensitive. In recent years, Time Domain Reflectometry (TDR) technique has been found to be a better alternative that are required for monitoring the degradation of interconnects. A technique for prognosing solder joint degradation using TDR has been presented in this study. At high frequencies, signal propagation is concentrated at the surface of interconnects, a phenomenon known as the skin effect. Degradation of interconnects, such as cracking of solder joints due to fatigue or shock loading, also usually initiates at the surface and propagates inward. Therefore, even a small crack at the surface of a solder joint may change RF impedance. A physical crack initiated at the surface of the solder joints results in the increase of RF impedance and then senses interconnect degradation. This technology would create the opportunity for real-time detection and early warning of interconnect degradation, allow condition-based maintenance, and reduce unplanned downtime. This could bring potentially substantial savings in operation and repair costs, help to reduce the incidence of no trouble found failures due to intermittent contact behavior, and improve product safety and availability. © 2011 IEEE.

关键词： reliability

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Aging Data Analysis for High Power Laser Diodes

Aging Data Analysis for High Power Laser Diodes

引用

作者： Guoguang LU Yun HUANG Yunfei EN Science and Technology on Reliability Physics and Application of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou China

Three groups of lifetime test were completed, according to the statistical knowledge, the degradation model of cm-bars is obtained using the short-term working datas, then we obtain the extrapolated lifetime of cm-bars at 25℃ is 7950 hours (2.86×109 shots), and we also obtain an acceleration factor 1.88 of resulting in a thermal activation energy of Ea=0.21eV using Arrhenius function.

关键词： laser diodes lifetime degradation thermal activation energy acceleration factor

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Accelerated reliability Evaluation for High Density Packaging Integrated Circuits

Accelerated Reliability Evaluation for High Density Packagin...

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作者： Bin YAO Ping LAI Science and Technology on Reliability Physics and Application of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou China

The demand for miniaturization, increased functionality, better performance and lower cost has forced the electronics industry to shift from traditional packaging techniques to advanced high density packaging technologies. As the packaging density increases, the packaging reliability becomes more essential. In this paper, an accelerated reliability test method to evaluate the packaging reliability of high density packaging integrated circuits (Ics) is presented. Differing from the traditional reliability prediction methods, the technology of FIMV (Force current measure voltage) was applied during the reliability test which allowed the reliability performance of Ics to be assessed in real time. It was found that the voltage changed correspondingly for the different stress changing conditions. So it is validated that the use of FIMV technology as an indicator of degradation of packaging property is effective. The experimental results show that thermal cycling stress can affect the adhesion of the interfaces in plastic packaging Ics. Temperature change during the thermal cycling test and the mismatch between the CTEs of the encapsulant and the adjacent material of plastic packaging Ics can lead to thermo-mechancial stresses that can cause delamination or de-adhesion. Additionally it is found that unwanted Au-Al intermetallic compound may form at the bond interface because of the effect of high temperature. The formation of the unwanted Au-Al intermetallic compound will reduce the bond strength and lead to wire bond lift-off finally. At last future research work in this field is suggested.

关键词： accelerated reliability test high density packaging thermal cycling stress delamination Au-Al intermetallic compound

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Experimental Studies of Non-Fickian Moisture Diffusion in Plastic Packages

Experimental Studies of Non-Fickian Moisture Diffusion in Pl...

引用

2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

作者： Shaohua Yang Hailong Liu Science and Technology on Reliability Physics and Application of Electronic Component Laboratory China CPREI Laboratories Guangzhou 510610 China

Moisture penetrating into the polymer and subsequent hygroswelling stress play an important role in the integrity and reliability of plastic electronic packages. In this paper, moisture absorption experiments of four types of plastic encapsulated microcircuits (PEMs) were conducted. Moisture diffusion characteristics of PEMs available by experiments were measured and typical moisture diffusion characteristics were calculated. Fickian second law controls distribution of moisture concentration in plastic packages, and it was found that moisture transport deviations from ideal Fickian behavior under the higher temperature and humidity stresses, which is the so-called non-Fickan diffusion. It was attributed to the "two-stage" sorption. Analysis of moisture diffusion coefficients shows that different packages have values varying largely. Besides, comparing the saturated moisture and vapor concentration, it can be found that the moisture exists with combining state of liquid and vapor in plastic electronic packages, which probably a main cause of non-Fickian moisture diffusion. So the experimental results indicated that it's necessary to measure the moisture diffusion coefficient in plastic electronic packages in order to reduce potential risk during their assembly process and long-term applications.

关键词： Moisture Absorption Plastics Polymers Compounds Moisture measurement

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Process reliability Improvement of Microwave Module

Process Reliability Improvement of Microwave Module

引用

作者： Ping LI Yuan CHEN The Fifth Research Institute of MIIT Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Guangzhou China

Process improvement of a microwave module is introduced in this paper. By orthodoxy experiment, die attach strength an bond strength were optimized, so reliability and process consistence of the batch product were ens... 详细信息

关键词： die attach strength bond strength orthodoxy experiment

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