检索结果-内蒙古大学图书馆

您好，读者！请登录

内蒙古大学图书馆

首页
概况
党建
资源
服务
科研支持
- 论文收录引用证明
- 科技查新
知识产权
档案馆
帮助

咨询与建议

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

您的常用邮箱：*

您的手机号码：*

问题描述：

当前已输入0个字，您还可以输入200个字

全部搜索
期刊论文
图书
学位论文
标准
纸本馆藏
外文资源发现
数据库导航
超星发现

高级检索

时间限定

出版年份：

文献类型

图书期刊文献学位论文多媒体

馆藏选择

电子馆藏纸本馆藏

核心期刊

全部期刊 SCI 收录期刊 SSCI 收录期刊 EI 收录期刊 CSCD 收录期刊 CSSCI 收录期刊

语言

中文英文

文献类型

期刊文献图书学位论文标准纸本馆藏

帮助

文字说明：

T=题名（书名、题名），A=作者（责任者），K=主题词，P=出版物名称，PU=出版社名称，O=机构（作者单位、学位授予单位、专利申请人），L=中图分类号，C=学科分类号，U=全部字段，Y=年（出版发行年、学位年度、标准发布年）

检索规则说明：

AND代表“并且”；OR代表“或者”；NOT代表“不包含”；(注意必须大写,运算符两边需空一格)

检索范例：

范例一：(K=图书馆学 OR K=情报学) AND A=范并思 AND Y=1982-2016
范例二：P=计算机应用与软件 AND (U=C++ OR U=Basic) NOT K=Visual AND Y=2011-2016

分类表

所选分类

>> <<

限定检索结果

文献类型

402 篇 会议
95 篇 期刊文献

馆藏范围

497 篇 电子文献
0 种 纸本馆藏

日期分布

学科分类号

215 篇 工学
- 145 篇 电子科学与技术（可...
- 67 篇 材料科学与工程（可...
- 66 篇 电气工程
- 39 篇 计算机科学与技术...
- 35 篇 化学工程与技术
- 31 篇 冶金工程
- 29 篇 软件工程
- 28 篇 仪器科学与技术
- 25 篇 机械工程
- 20 篇 光学工程
- 18 篇 动力工程及工程热...
- 16 篇 力学（可授工学、理...
- 16 篇 信息与通信工程
- 14 篇 控制科学与工程
- 12 篇 核科学与技术
- 11 篇 安全科学与工程
- 8 篇 交通运输工程
- 8 篇 航空宇航科学与技...
- 5 篇 轻工技术与工程
- 3 篇 生物工程
123 篇 理学
- 90 篇 物理学
- 37 篇 化学
- 29 篇 数学
- 7 篇 统计学（可授理学、...
- 3 篇 生物学
- 2 篇 地质学
- 2 篇 系统科学
22 篇 管理学
- 20 篇 管理科学与工程(可...
1 篇 经济学
1 篇 医学

主题

67 篇 reliability
32 篇 stress
30 篇 degradation
20 篇 failure analysis
19 篇 logic gates
18 篇 soldering
15 篇 junctions
14 篇 electromigration
13 篇 packaging
12 篇 thermal resistan...
12 篇 gallium nitride
12 篇 silicon
12 篇 mathematical mod...
11 篇 resistance
11 篇 lead
11 篇 heating
10 篇 temperature
10 篇 simulation
10 篇 threshold voltag...
10 篇 reliability engi...

机构

64 篇 science and tech...
63 篇 science and tech...
23 篇 school of electr...
21 篇 science and tech...
18 篇 science and tech...
18 篇 science and tech...
16 篇 school of mechan...
12 篇 science and tech...
11 篇 china electronic...
10 篇 science and tech...
9 篇 university of ch...
8 篇 reliability phys...
8 篇 the science and ...
8 篇 moe key lab of d...
7 篇 school of electr...
7 篇 school of materi...
7 篇 ceprei science a...
7 篇 school of inform...
6 篇 south china univ...
6 篇 beijing universi...

作者

40 篇 yunfei en
35 篇 yun huang
35 篇 bin zhou
23 篇 wei su
20 篇 guoguang lu
17 篇 yuan liu
17 篇 shaohua yang
16 篇 si chen
16 篇 huang yun
15 篇 fangfang song
15 篇 zhiyuan he
15 篇 ping lai
14 篇 renhuai liu
14 篇 lei zhifeng
13 篇 yuan chen
13 篇 xiaoqi he
13 篇 bin yao
13 篇 yang shaohua
13 篇 lu guoguang
13 篇 yun-fei en

语言

479 篇 英文
11 篇 中文
7 篇 其他

检索条件"机构=Science and Technology Laboratory on Reliability Physics and Application of Electronic Component"

共 497 条记录，以下是461-470 订阅

全选清除本页清除全部题录导出标记到"检索档案"

详细简洁

排序：

Static thermal resistance test and simulation analysis technology for hybrid microcircuit

Static thermal resistance test and simulation analysis techn...

引用

International Symposium on Advanced Packaging Materials

作者： Bin Zhou Xueli Qi Science and Technology on Reliability Physics and Application of Electronic Component Laboratory CEPREI Guangzhou China School of Electronic and Information Engineering South China University of Technology Guangzhou China

The miniaturization of packaging volume for hybrid microcircuit and the increasing of dissipated power for chip make its junction case thermal resistance parameters become the focus of people's study and attention. The thermal resistance sample was designed based on a new embedded copper enhance case and static measurement was used, transient temperature response curve of internal die was showed by testing, thermal resistance - heat capacity network model was obtained through numerical deconvolution, the thermal resistance of internal structures were analyzed, which was compared with the theory calculation result of 45° method, and the effect of each layer structure on overall junction case thermal resistance was analyzed. In addition, heat dissipation performance was studied by comparative analysis between new case and original cold rolled steel case. Finally, temperature distribution and junction case thermal resistance of new hybrid circuit module were studied by finite element simulation. The results showed that the thermal resistance value of new embedded copper packaging case decreased about 50% in contrast to cold rolled steel case. Decreasing overall internal resistance of microcircuit need improves the heat dissipation performance of case, meanwhile, the effect of each layer structure on whole internal thermal resistance should be decreased as much as possible.

关键词： Thermal resistance Junctions Packaging Thermal analysis electronic packaging thermal management Materials

来源：评论

学校读者我要写书评

暂无评论

Pre-designed Prognostic cells for host circuits reliability monitoring

Pre-designed Prognostic cells for host circuits reliability ...

引用

2011 International Conference on Electric Information and Control Engineering, ICEICE 2011

作者： Lu, Yu-Dong En, Yun-Fei Luo, Hong-Wei Wan, Ming Natl. Key Lab. of Sci. and Technology on Reliability Physics and Application of Electronic Component 5th Electronics Research Institute Ministry of Industry and Information Technology Guangzhou 510610 China Key Laboratory of Specially Functional Materials College of Materials Science and Engineering South China University of Technology Guangzhou 510640 China

ISBN: (纸本)9781424480395

CMOS integrated circuits have certain defined failure mechanisms that can contribute to end-of-life failure. These failure mechanisms include time dependent dielectric breakdown, electromigration, hot carrier injection and so on. All of these common failure modes are far worse at geometries below 0.18 m. The traditional reliability predictions for integrated circuits are inaccurate because they do not account for the actual environments that the circuits are subjected to in its life cycle. Prognostics is a method that enables monitoring the state of reliability of a product in real time, and therefore can be used to provide advance warning of a failure, to provide condition based maintenance and to help in IC design and development. Pre-designed Prognostic cells are incorporated into integrated circuits to provide advance warning of failure for specific wear-out failure mechanisms. The time to failure of these prognostic cells can be pre-calibrated with respect to the time to failure of the host circuit. The accurate failure prediction and the remaining luseful life for specfic failure mechanism were achieved from the prognostic cell with the proper prognostic distance. © 2011 IEEE.

关键词： reliability

来源：评论

学校读者我要写书评

暂无评论

Optimal Buffering Resources Allocation of On-Chip Networks with Finite Buffers

Optimal Buffering Resources Allocation of On-Chip Networks w...

引用

International Workshop on Intelligent Networks and Intelligent Systems (ICINIS)

作者： Li-Wei Wang Science and Technology on Reliability Physics and Application of Electronic Component Laboratory The 5th Electronics Research Institute Ministry of Industry and Information Technology Guangzhou China

A novel buffer allocation algorithm for deterministically-routed and wormhole-switched network-on-chip (NoC) with finite size buffers is proposed. Based on a analytical model, the algorithm can assess the performance bottleneck of all the NoC routers. When the total buffer budget is fixed, according to the traffic characteristics of the target application, the proposed algorithm automatically allocates the buffer depth for each input channel in different routers. The simulation results show that, by using the proposed algorithm, better system performance and lower average packet latency can be achieved compared to the uniform assignment of buffering resources which has been widely adopted in current NoC design.

关键词： Resource management System-on-a-chip Analytical models System performance Mathematical model Routing Queueing analysis

来源：评论

学校读者我要写书评

暂无评论

A power analysis based approach to detect Trojan circuits

A power analysis based approach to detect Trojan circuits

引用

International Conference on Quality, reliability, Risk, Maintenance, and Safety Engineering (ICQR2MSE)

作者： Li-Wei Wang Hong-Wei Luo School of Electronic and Information Engineering South China University of Technology Guangzhou China Science and Technology on Reliability Physics and Application of Electronic Component Laboratory CEPREI Laboratories Guangzhou China

Because of globalization of the semiconductor industry, the IC fabrication is increasingly outsourced. This poses a significant risk for integrated circuits (ICs) used for security critical applications. Attackers can maliciously alter the ICs during fabrication in untrusted foundries. In the case of ICs bought externally, they may have hidden functions that users would never know. These malicious alterations and hidden functions are also referred to as “Hardware Trojan”. It is extremely difficult to discover such Trojan circuits using conventional testing strategies. In this paper, we propose a nondestructive, power analysis based Trojan detection approach which is able to detect Trojan circuits in the presence of large noise. The approach is validated using 90nm FPGA (Xilinx Spartan-3E) chips. Experimental results with a 64-bit Data Encryption Standard (DES) cipher circuit show that Trojans which are 2 orders of magnitude smaller than the DES circuit can be detected by using statistic signal processing techniques.

关键词： Trojan horses Hardware Field programmable gate arrays Power measurement Payloads

来源：评论

学校读者我要写书评

暂无评论

The Effect of Thermal Stress on High Density Packaging Integrated Circuits

The Effect of Thermal Stress on High Density Packaging Integ...

引用

2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

作者： Bin Yao Ping Lai Jian Liu Xiaosi Liang Science and Technology on Reliability Physics and Application of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute No.110 Dongguanzhuang Rd Guangzhou Guangdong P.R. China

The trend of electronics industry is toward advanced high density packaging technologies. The reliability of integrated circuits (ICs) which is significantly affected by thermal stress has become more essential as the packaging density increases. In this paper, an accelerated thermal reliability test method for evaluating the packaging reliability of ICs which includes hot step, cold step and rapid thermal cycling test is presented. The technology of FIMV (Force current measure voltage) was applied during the reliability test as an indicator of degradation of packaging property, which allowed the reliability performance of ICs to be assessed in real time. The experimental results showed that the thermal stress resulted in the degradation of interfacial adhesion of plastic packaging ICs. Because of the temperature changing during the rapid thermal test, the strain and stress due to the coefficient of thermal expansion (CTE) mismatch between the encapsulant and the adjacent materials could contribute to delamination or de-adhesion. In some cases it was directly linked to a failure if some severe defects occured because of delamination, such as wire bond lift-off or fracture. Crack in die attach adhesive based on the same failure mechanism was also found. Additionally, unwanted brittle Au-Al intermetallic compound was detected at the bond interface because of the effect of high temperature. The formation of the Au-Al intermetallic compound led to the increase of electrical resistance and the weakening of bond strength which resulted in bond lift-off finally. At last future research work in this field is suggested.

关键词： reliability electronic packaging thermal management Thermal stresses Packaging Stress Delamination Compounds

来源：评论

学校读者我要写书评

暂无评论

Effect of substrate material on thermal reliability of high-power electronic packaging device

Effect of substrate material on thermal reliability of high-...

引用

2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

作者： Fang fang Song Ping Lai Science and Technology on Reliability Physics and Application of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute No. 110 Dongguanzhuang Rd. Tianhe District 510610 Guangzhou china

Thermal performance and reliability are necessary to be considered for high-power electronic packaging device design. In this paper, the thermal characteristic of one kind of packaging device was studied using FEM and experimentation, for phase shifter. The model for thermal condition of phase shifter was established. The top junction temperature obtained by simution shows tendency as tested experiment results, verifying the correctness of the simulation model and method used. The relation of relative temperature rising to different substrate thickness and material is studied by *** quantitative relations of these parameters and temperature provided a theoretical basis for the thermal design and reliability estimate, the optimization of parameters and the reliability improvement of phase shifter.

关键词： Substrates electronic packaging thermal management Thermal analysis Phase shifters Junctions reliability

来源：评论

学校读者我要写书评

暂无评论

A Study of Solder Joint Degradation and Detection Using RF Impedance Analysis

A Study of Solder Joint Degradation and Detection Using RF I...

引用

2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

作者： Bin Yao Yudong Lu Ming Wan Science and Technology on Reliability Physics and Application of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute No.110 Dongguanzhuang Rd Guangzhou Guangdong P.R. China

The trend of many types of electronic products is toward higher operating frequencies. At high frequencies, the signal propagation is concentrated at the surface of interconnects, which is known as the skin effect. Therefore, even a samll crack at the surface of a solder joint may directly influence the performance of high speed electronic assemblies. Degradation of solder joints, such as cracking due to fatigue or stress, generally initiates at the surface where the strain range is maximized, and propagates inward. Traditional DC resistance measurements are not able to sense partial cracks in solder joints. RF impedance analysis, which is capable of detecting small cracks, offers an improved means of monitoring the degradation of solder joints of high speed electronic products. In this study, RF impedance changes are used as an early indicator of degradation of solder joints, due to the skin effect, compared with DC resistance measurements. Impedance-controlled circuit boards on which surface mount components were soldered have been developed. Partially and entirely cracked solder joints were produced for test in advance. The RF impedance was observed to increase in response to partial cracking of the solder joint, while the DC resistance did not indicate any anomalies. The technique of RF impedance analysis shows potential as a prognostic tool that can provide advanced warning of impending failures of solder joint. At last future research work in this field is suggested.

关键词： Soldering Impedance Radio frequency Degradation Resistance Monitoring Time domain analysis

来源：评论

学校读者我要写书评

暂无评论

Weld technology reliability analysis of Cathode in Vacuum Tube

Weld Technology Reliability analysis of Cathode in Vacuum Tu...

引用

2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

作者： Xian-long Feng Shajin Li Fang fang Song Shiji Yu Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Chi Institutes of Electronics No.110 Dongguanzhuang Rd. Tianhe District 510610 Guangzhou china

Influence of weld technology on reliability and life to cathode in vacuum tube was studied by requests of microwave tube. The quality of weld technology quite affects the emission capability of cathode. The mode of weld quite affects thermal efficiency of cathode in vacuum tube. Thermal efficiency of cathode can increase availably by changing the weld technology on the heat transfer path. Thermal analysis and optimization design of cathode module for vacuum tube was carried out with the FEM in order to obtain required cathode temperature with lower heat power. The weld mode quite affects the cathode heat power, for example, the cathode heat power can reduce 28.6 ％ with 8+8 laser spot welding. We have also built the life test system of TWT's electron gun structure of 8 +8 laser spot welding, using this life test system, up to 30 years life of cathode is forecasted.

关键词： Cathodes Welding Electron tubes reliability Thermal analysis Resistance heating

来源：评论

学校读者我要写书评

暂无评论

New SEC-DED-DAEC codes for multiple bit upsets mitigation in memory

New SEC-DED-DAEC codes for multiple bit upsets mitigation in...

引用

IFIP International Conference on Very Large Scale Integration (VLSI-SoC)

作者： Zhu Ming Xiao Li Yi Luo Hong Wei Microelectronics Center Harbin Institute of Technology Harbin China Reliability Physics and Application Technology of Electrical Component National Key Laboratory of Science and Technology Guangzhou China

Nowadays, multiple bit upsets (MBUs) have been widely investigated in memories. Conventional single error correction and double error detection (SEC-DED) codes are capable of correcting one error and detecting all possible double errors. However, they may not provide adequate protection against MBUs. This paper proposes new single-error-correction, double-error-detection double-adjacent-error-correction (SEC-DED-DAEC) codes to mitigate radiation or noise source induced MBUs in memories. The proposed SEC-DED-DAEC codes are obtained from conventional SEC-DED codes according to the mathematics model established in this paper. They can detect and correct all adjacent double bit errors and assure a lower miscorrection probability for non-adjacent double bit errors compared with other SEC-DED-DAEC codes. Furthermore, the redundancy bits of the proposed scheme are the same as those of conventional SEC-DED codes. This means that the increase of correct-capability do not cause additional hardware overhead for the memory system. Finally, the experiment results reveal that the proposed scheme reduces the miscorrection probability of non-adjacent double bit errors by 12% compared to the best known SEC-DED-DAEC codes. Moreover, compared to the well known BCH codes, the proposed scheme reduces 40% hardware redundancy and keeps an acceptable reliability.

关键词： Vectors Mathematical model Equations reliability Decoding Logic gates

来源：评论

学校读者我要写书评

暂无评论

Design EG-LDPC codes for soft error mitigation in memory

Design EG-LDPC codes for soft error mitigation in memory

引用

Academic International Symposium on Optoelectronics and Microelectronics technology (AISOMT)

作者： Xiao Li Yi Zhu Ming Zhang Yan Jing Luo Hong Wei Microelectronics Center Harbin Institute of Technology Harbin China Reliability Physics and Application Technology of Electrical Component National Key Laboratory of Science and Technology Guangzhou China

As the feature sizes of integrated circuits decreasing, single event transient (SET) in combinational circuits can not been ignored any longer. In this paper, a novel fault-secure scheme for memory has been proposed by studying the structural features of Euclidean Geometry-Low Density Parity Check (EG-LDPC) codes. The proposed fault-secure scheme can tolerate transient faults both in the storage cell and in the encoder and decoder, using the parallel majority decoding and the feedback loop structure. In order to improve the decoding speed, an algorithm is presented, which can reduce the majority decoding of EG-LDPC codes into two steps. Furthermore, the proposed scheme can suit ordinary data width (e.g., 2 n bits) in memory. Finally, the correcting capability and the reliability of the proposed scheme are analyzed. The experiment results reveal that the Mean Time to Failure (MTTF) of the proposed scheme is 419%, 104% and 118% compared with that of Hamming code, Matrix code and Reed-Muller code, respectively.

关键词： Decoding Vectors Circuit faults Parity check codes Generators reliability Detectors

来源：评论

学校读者我要写书评

暂无评论

没有更多数据了...

全选清除本页清除全部题录导出标记到“检索档案”

共50页 << < 41 42 43 44 45 46 47 48 49 50 > >>

检索报告对象比较合并检索0

隐藏清空

合并搜索

回到顶部

执行限定条件

内容：

评分：

请选择保存的检索档案：

请选择收藏分类：

订阅名称：

通借通还

温馨提示：

图书名称：

借书校区：

取书校区：

手机号码：

邮箱地址：

一卡通帐号：

电话和邮箱必须正确填写，我们会与您联系确认。

联系人：

所在院系：

联系邮箱：

联系电话：

内蒙古自治区呼和浩特市赛罕区大学西街235号邮编: 010021

建议与咨询 留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案： 新增检索档案 确定 取消

请选择收藏分类： 新增自定义分类 确定 取消

通借通还

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

请选择保存的检索档案：

请选择收藏分类：