Total dose irradiation effects of partially depleted SOI MOSFETs are studied under 10 keV X-ray exposure. Results show that the front-gate characteristics do not change significantly during irradiation. An anomalous k...
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Total dose irradiation effects of partially depleted SOI MOSFETs are studied under 10 keV X-ray exposure. Results show that the front-gate characteristics do not change significantly during irradiation. An anomalous kink is observed in the back-gate logarithmic curve of both nMOS and pMOS, which is attributed to charged traps at the buried oxide/top silicon (BOX/SOI) interface during irradiation. Two-dimensional numerical simulation using MEDICI supports this conclusion.
The thermal shock experiment of Au-Al bonding has been carried *** mechanical characteristics,structure morphology and electrical characteristics degradation mechanism have also been *** cracks were observed in the bo...
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The thermal shock experiment of Au-Al bonding has been carried *** mechanical characteristics,structure morphology and electrical characteristics degradation mechanism have also been *** cracks were observed in the bonding interface,and the bonding ioints also showed good mechanical characteristics with pull stress of 3.0 to 12.0 *** to high temperature,the Au-Al intermetallic compound Au5Al2 with high resistibility was formed,which ultimately led to electrical *** the samples that were fabricated on the basis of the present technique,the bonding reliability has been *** has been found that the lifespan rule obeys the Weibull distribution,and at a high temperature of 150℃ under 95%confidence level,the estimated results are η=547 h,m=*** a room temperature environment,the Au-Al bonding samples' lifespan has also been predicted on the basis of the rule of reliability *** result shows that the lifespan is about 20 years,while the reliability degree is 90%.
Based on Robust Design (Taguchi Method) and Finite Element Method (FEM), the thermo-mechanical reliability of Plastic Ball Grid Array (PBGA) solder joint subject to an accelerated thermal cycling test condition is stu...
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Based on Robust Design (Taguchi Method) and Finite Element Method (FEM), the thermo-mechanical reliability of Plastic Ball Grid Array (PBGA) solder joint subject to an accelerated thermal cycling test condition is ***...
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Based on Robust Design (Taguchi Method) and Finite Element Method (FEM), the thermo-mechanical reliability of Plastic Ball Grid Array (PBGA) solder joint subject to an accelerated thermal cycling test condition is *** PCB size, substrate thickness, die coefficient of thermal expansion (CTE), and solder joint CTE et al, 8 different control factors are considered for a Robust Design towards enhancement of the thermal fatigue resistance of solder joint by using a mixed-level orthogonal array. From the results, importance of these factors on the thermo-mechanical reliability of PBGA solder joint is ranked. The best parameter combination is A1B2C3D1E2F1G3H1, in which the substrate CTE, solder joint CTE, the thickness of substrate, die CTE are the most important. The optimal design, after the comparative experiment with ANN (artificial neural network) and conformation experiment, has remarkable enhancement in thermo-mechanical reliability compared with the original design.
Nowadays, the bonding reliability of electrically conductive adhesives (ECAs) has become one of the difficulties in its application. Aiming at the ECAs bonding' major failure modes, the accordant test structure an...
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Nowadays, the bonding reliability of electrically conductive adhesives (ECAs) has become one of the difficulties in its application. Aiming at the ECAs bonding' major failure modes, the accordant test structure and reliability evaluation experiment was developed. Then the mechanical properties and degradation mechanism of electrical properties for ECAs bonding were studied. The result showed that ECAs bonding had a good resistance to temperature dependent stress with a shear force ranging from 3.25 to 5.35 kg. Based on a combination of morphology and theory analysis, the failure mechanism of ECAs bonding was deeply discussed, and then some reasonable methods to improve the performance of ECAs bonding were presented. Finally the ECAs bonding reliability at present technical level was evaluated.
Vibration capability and reliability is necessarily to be considered for electroniccomponents designIn this paper, the vibration characteristics of electroniccomponents were studied using FEM, for example, gridded e...
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Vibration capability and reliability is necessarily to be considered for electroniccomponents designIn this paper, the vibration characteristics of electroniccomponents were studied using FEM, for example, gridded electron gunThe dynamical mode of girded electron gun was establishedModal frequency and model obtained by simulation shows tendency as tested experiment results, verifying the correctness of the simulation model and method usedThe Parameters showed an inherent property of structure, which provided a theoretical basis for production design, the optimization of parameters and the vibration-resistance reliability improvement of microwave tubeIn the aspects of electroniccomponents reliability analysis, the variations of production capability parameters under various stress environments can be gained by FEM simulation technology to evaluate environment adaptability and reliability.
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