检索结果-内蒙古大学图书馆

SSRN 2023年

作者： Huang, Shu Jiang, Yunfeng Sheng, Jie Agyenim-Boateng, Emmanuel Song, Yunjian Liu, Qiang Zhu, Mingliang Hu, Yongxiang School of Mechanical Engineering Jiangsu University Zhenjiang212013 China Department of Mechanical Engineering Koforidua Technical University KF-981 Koforidua Ghana Key Laboratory of CNC Equipment Reliability Ministry of Education Jilin University Changchun130015 China Key Laboratory of Pressure Systems and Safety Ministry of Education School of Mechanical and Power Engineering East China University of Science and Technology Shanghai200237 China State Key Lab of Mechanical System and Vibration School of Mechanical Engineering Shanghai Jiao Tong University Shanghai200240 China

In order to investigate the hydrogen permeation behavior of 316L stainless steel during the microstructural evolution induced by laser peening (LP), an electrochemical hydrogen charging system for initial hydrogen charging of LPed and non-LPed specimen was developed. Afterwards, the microhardness, residual stress and microstructures of the samples were determined and analyzed. Finally, electrochemical hydrogen permeation experiments were undertaken to verify LP's influence on hydrogen permeation parameters of 316L. The results showed that LP reduced the hydrogen-induced hardening rate of the alloy and additionally invoked high magnitude compressive residual stress (CRS) on its surface. At the layer close to the face of the specimen, grain refinement rate was as high as 56.18%, which was accompanied by the appearance of high-density dislocations. Compared with the non-LPed sample, the hydrogen permeation time increased significantly, and the saturation current density in steady state hydrogen permeation also decreased gradually. Additionally, the coefficient of hydrogen diffusion and hydrogen trap density of 316L stainless steel under LP were theoretically calculated on experimental basis, and the relationship between its microstructure and hydrogen permeation kinetics were as well studied. © 2023, The Authors. All rights reserved.

关键词： Austenitic stainless steel

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Spintronic Terahertz Polarization Programmable System for Information Encoding

SSRN

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SSRN 2023年

作者： Li, Hongqing Jiang, Yunqing Zhang, Xiaoqiang Zhang, Fan Xiao, Yongguang Tang, Minghua Zhao, Zhenyang Xu, Yong Liu, Fengguang Zhao, Weisheng School of Materials Science and Engineering Xiangtan University Hunan Xiangtan411105 China School of Integrated Circuit Science and Engineering Hefei Innovation Research Insititute Beihang University Beijing100191 China Anhui High Reliability Chips Engineering Laboratory Hefei230013 China Shandong Dongyi Photoelectric Instruments Co. Ltd Yantai264670 China Shandong Dongyi Institute of Optoelectronic Technology for Industry Yantai264670 China Beijing Advanced Innovation Center for Big Data and Brain Computing China

Terahertz (THz) wave as an important electromagnetic wave has been increasingly applied in wireless communication and imaging sensing technology. It has been an increasingly practical application. Ultra-high data rates in communication technology push toward a broadband, controllable polarization, and multiple transmission channels signal sources. Here, we propose a programmable polarization spintronics terahertz source (PP-STS), in which contains a controllable polarization spintronic THz emitter and a microcontroller unit. The PP-STS not only can generate THz waves with wide frequency bandwidth, but also has the function of switching the orthogonal linear polarization state of the generated THz waves flexibly. By coding the microcontroller unit, the designed PP-SPS can directly program the orthogonal linear polarization states as a series of information to transmit. To achieve the interconversions between digital codes and the THz polarization information, an optimum matching THz polarization beam splitter (THz-PBS) is also designed via simulations and experiments. The THz-PBS, as a decoder, can accurately split the transverse electric (TE) and transverse magnetic (TM) modes into two THz detectors. At last, a coding and decoding prototype system of spintronic THz polarization is built by integrating the PP-STS, the THz-PBS and two THz detectors. The send and receive information with high speed and accuracy are verified in this prototype system as well. We believe that our work takes THz applications for multiplexing communications one step further and sheds light on commercializing the PP-STS with exciting manufacturing lines for efficient and economical THz polarization technology. © 2023, The Authors. All rights reserved.

关键词： Microcontrollers

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Spintronic Terahertz Polarization Programmable System for Information Encoding

SSRN

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SSRN 2023年

关键词： Microcontrollers

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Spintronic Terahertz Polarization Programmable System for Information Encoding

SSRN

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SSRN 2023年

关键词： Microcontrollers

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Spintronic Terahertz Polarization Programmable System for Information Encoding

SSRN

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SSRN 2023年

作者： Li, Hongqing Jiang, Yunqing Zhang, Xiaoqiang Zhang, Fan Xiao, Yongguang Tang, Minghua Zhao, Zhenyang Xu, Yong Liu, Fengguang Zhao, Weisheng Beijing Advanced Innovation Center for Big Data and Brain Computing China School of Materials Science and Engineering Xiangtan University Hunan Xiangtan411105 China School of Integrated Circuit Science and Engineering Hefei Innovation Research Insititute Beihang University Beijing100191 China Anhui High Reliability Chips Engineering Laboratory Hefei230013 China Shandong Dongyi Photoelectric Instruments Co. Ltd Yantai264670 China Shandong Dongyi Institute of Optoelectronic Technology for Industry Yantai264670 China

关键词： Microcontrollers

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Top-k contrast order-preserving pattern mining

arXiv

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arXiv 2023年

作者： Wu, Youxi Meng, Yufei Li, Yan Guo, Lei Zhu, Xingquan Fournier-Viger, Philippe Wu, Xindong School of Artificial Intelligence Hebei University of Technology Tianjin300401 China Shijiazhuang University of Applied Technology Shijiazhuang050081 China School of Economics and Management Hebei University of Technology Tianjin300401 China State Key Laboratory of Reliability and Intelligence of Electrical Equipment Hebei University of Technology Tianjin300401 China Department of Computer & Electrical Engineering and Computer Science Florida Atlantic University FL33431 United States Shenzhen University Shenzhen China Research Center for Knowledge Engineering The Zhejiang Lab Hangzhou311121 China

Recently, order-preserving pattern (OPP) mining, a new sequential pattern mining method, has been proposed to mine frequent relative orders in a time series. Although frequent relative orders can be used as features to classify a time series, the mined patterns do not reflect the differences between two classes of time series well. To effectively discover the differences between time series, this paper addresses the top-k contrast OPP (COPP) mining and proposes a COPP-Miner algorithm to discover the top-k contrast patterns as features for time series classification, avoiding the problem of improper parameter setting. COPP-Miner is composed of three parts: extreme point extraction to reduce the length of the original time series, forward mining, and reverse mining to discover COPPs. Forward mining contains three steps: group pattern fusion strategy to generate candidate patterns, the support rate calculation method to efficiently calculate the support of a pattern, and two pruning strategies to further prune candidate patterns. Reverse mining uses one pruning strategy to prune candidate patterns and consists of applying the same process as forward mining. Experimental results validate the efficiency of the proposed algorithm and show that top-k COPPs can be used as features to obtain a better classification performance. Copyright © 2023, The Authors. All rights reserved.

关键词： Time series

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Failure mechanism analysis on copper-filled TSV interposer based on transient thermal mechanical stress simulation 29

Failure mechanism analysis on copper-filled TSV interposer b...

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29th European Safety and reliability Conference, ESREL 2019

作者： Chen, Yuan Zhang, Peng Su, Wei Huang, Hongzhong Lai, Ping Lin, Xiaoling En, Yunfei Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Fifth Electronics Research Institute Ministry of Industry and Information Technology China School of Mechanical and Electrical Engineering University of Electronic Science and Technology of China China Analysis and Test Center South China University of Technology China

ISBN: (纸本)9789811127243

With the development of 3D integrated packaging, Through Silicon Via (TSV) has become one of the most promising technologies in 3D stacking package. TSV three-dimensional integrated device will gradually fail under the joint effect of thermal mechanical stress, electrical stress and other stress, which will greatly affect the reliability of the TSV three-dimensional device. In this paper, the reliability of TSV interposer under thermal cycling stress is analyzed. The thermo-structural coupling model under the thermal cycling stress of typical TSV interposer is established. In addition, thermal cycling experiment has been performed to verify the simulation results. The physical failure mechanism of the copper-filled TSV is confirmed by the transient thermal mechanical stress simulation analysis. It is found that the failure modes are related to the stress distribution and displacement form of TSV. The simulation results are in good correspondence with the experimental results. © 2019 European Safety and reliability Association. Published by Research Publishing, Singapore.

关键词： Finite element method

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Spintronic Terahertz Polarization Programmable System for Information Encoding

SSRN

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SSRN 2023年