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Corrigendum to “Entropy generation and optimization of laminar convective heat transfer and fluid flow in a microchannel with staggered arrays of pin fin structure with tip clearance” [Energy Convers. Manage. 94 (2015) 493–504]

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Energy Conversion and Management 2015年 98卷 544-544页

作者： Zhongyuan Shi Tao Dong Institute of Applied Micro-Nano Science and Technology Chongqing Technology and Business University 19 Xuefu Ave. Nan’an District Chongqing China Chongqing Engineering Laboratory for Detection Control and Integrated System Chongqing Technology and Business University 19 Xuefu Ave. Nan’an District Chongqing China Department of Micro and Nano Systems Technology (IMST) Faculty of Technology and Maritime Sciences (TekMar) Buskerud and Vestfold University College (HBV) Raveien 215 3184 Borre Norway

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Low temperature Si/Si wafer direct bonding using a plasma activated method

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Journal of Zhejiang University-science C(Computers and Electronics) 2013年第4期14卷 244-251页

作者： Dong-ling LI Zheng-guo SHANG Sheng-qiang WANG Zhi-yu WEN National Key Laboratory of Fundamental Science of Novel Micro/Nano Device and System Technology Chongqing University MOE Key Laboratory of Optoelectronic Technology & Systems Chongqing University Microsystem Research Center Chongqing University

Manufacturing and integration of micro-electro-mechanical systems （MEMS） devices and integrated circuits （ICs） by wafer bonding often generate problems caused by thermal properties of materials. This paper presents a low temperature wafer direct bonding process assisted by 02 plasma. Silicon wafers were treated with wet chemical cleaning and subsequently activated by 02 plasma in the etch element of a sputtering system. Then, two wafers were brought into contact in the bonder followed by annealing in N2 atmosphere for several hours. An infrared imaging system was used to detect bonding defects and a razor blade test was carried out to determine surface energy. The bonding yield reaches 90%--95% and the achieved surface energy is 1.76 J/m2 when the bonded wafers are annealed at 350 ~C in N2 atmosphere for 2 h. Void formation was systematically observed and eli-mination methods were proposed. The size and density of voids greatly depend on the annealing temperature. Short O2 plasma treatment for 60 s can alleviate void formation and enhance surface energy. A pulling test reveals that the bonding strength is more than 11.0 MPa. This low temperature wafer direct bonding process provides an efficient and reliable method for 3D integration, system on chip, and MEMS packaging.

关键词： Low temperature Wafer direct bonding O2 plasma activation Surface energy Void formation

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Outage Analysis of Dual-Hop Transmission with Buffer Aided Amplify-and-Forward Relay

Outage Analysis of Dual-Hop Transmission with Buffer Aided A...

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IEEE Vehicular technology Conference

作者： Guan-Xing Li Chen Dong Dong Liu Guangtao Li Yonghui Zhang China Mobile Group Liaoning Ltd. School of ECS University of Southampton CAS Key Laboratory of Technology in Geo-spatial Information Processing and Application System University of Science and Technology of China RF Micro Devices Co. Ltd.

ISBN: (纸本)9781479944484

A new packet-selection based transmission scheme is proposed on a dual-hop link with buffer aided amplify-and-forward relay, where the relay with a buffer can record the channel information of source-relay hop and store the received packets. In order to satisfy the constraint of equivalent end-to-end SNR, the relay may pick up a packet in the buffer to transmit, with consideration of the channel statuses of both the source-relay hop and the relay-destination hop. Therefore, by adjusting the packet transmission order in the relay, the outage probability can be decreased in the proposed transmission scheme. Both theoretical analyses and simulation results show that the proposed scheme outperforms traditional ones by a significant margin of 2-4 dB gain in terms of outage probability.

关键词： Relays Signal to noise ratio Fading Tin Delays Wireless communication Buffer storage

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Visual Monitoring of micro Crack Propagation via Luminescence Enhancement

Visual Monitoring of Micro Crack Propagation via Luminescenc...

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The 2nd International Conference on Structural Health Monitoring and Integrity Management(第二届国际结构健康监测与完整性管理会议)

作者： ZHAO Zi-ming LUAN Wei-ling TU Shan-tung Juergen J.Brandner The Key Laboratory of Safety Science of Pressurized System(MOE) School of Mechanical and Power EngineeringEast China University of Science and Technology(ECUST)ShanghaiChina Institute for Micro Process Engineering(IMVT)Karlsruhe Institute of Technology(KIT)Campus NorthHermann-von-Helmholtz-Platz 176344 Eggenstein-LeopoldshafenGermany

A visualization method to monitor micro metal crack propagation is presented in this *** a real-time non-contact micro crack detection method,it can provide a visualization signal by the enhanced photoluminescence int... 详细信息

关键词： micro crack luminescence enhancement visualization quantum dots

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Electrocaloric Effect of P(VDF-TrFE)/SrTiO_3 Bilayer Thin Films

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Communications in Theoretical Physics 2013年第1期59卷 117-120页

作者：邱建华丁建宁袁宁一王秀琴 Center for Low-Dimensional Materials Micro-Nano Devices and SystemChangzhou University School of Material Science and Engineering Jiangsu University Jiangsu Key Laboratory for Solar Cell Materials and Technology

A phenomenological thermodynamic theory is applied to investigate the effect of misfit strgin and electric field on the electrocaloric effect of P（VDF-TrFN）/SrTiO3 bilayer thin films. Theoretical results indicate that the low electric field results in the decrease of the average polarization with the increase of the relative thickness of SrTi03 layer, and the high electric field has an opposite effect on it. Moreover, the electroealoric effect strongly depends on the electric field. The low electric field and the small field change can lead to a maximum of the electrocaloric effect, meanwhile the high electric field or the large field change results in the opposite trend.

关键词： bilayer thin film polymer electrocaloric effect

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The plastic and creep behavior of silicon microstructure at high temperature

The plastic and creep behavior of silicon microstructure at ...

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2013 17th International Conference on Solid-State Sensors, Actuators and microsystems, TRANSDUCERS and EUROSENSORS 2013

作者： Yao, S.K. Xu, D.H. Xiong, B. Wang, Y.L. Science and Technology on Micro-system Laboratory Shanghai Institute of Microsystem and Information Technology Chinese Academy of Sciences Shanghai China

ISBN: (纸本)9781467359818

This paper presents an experimental method to investigate the plastic and creep behavior of single crystal silicon (SCS) microstructure at high temperature. The relationship between plastic deformation and structure dimensions is demonstrated, and the creep curve of microstructure is firstly reported. The plastic and creep behavior of SCS microstructure, which consists of a square diaphragm with a center boss and a vacuum cavity, was investigated by measuring the deformation of the microstructure after undergoing a series of high temperature processes. The experiment results show that the plastic deformation is in inverse ratio to the cube of the diaphragm thickness. The obvious creep was observed at 1100°C. The creep rate decreased with time and then became nearly constant. © 2013 IEEE.

关键词： Plastic deformation

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A feature extraction method for wheeled and tracked vehicle classification based on geologic model

A feature extraction method for wheeled and tracked vehicle ...

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2013 5th International Conference on Computational and Information sciences, ICCIS 2013

作者： Zhou, Qianwei Li, Baoqing Xie, Dongfeng Kuang, Zhijun Yuan, Xiaobin Science and Technology on Micro-System Laboratory Shanghai China Wireless Sensor Network Laboratory Shanghai Institute of Microsystem and Infromation Technology Shanghai China University of Chinese Academy of Sciences Beijing China

ISBN: (纸本)9780769550046

Seismic signal is widely used in ground vehicle classification due to its inherent characteristics. But the generalization accuracy of classifier is heavily degraded due to different underlying geologies. To overcome the weakness of the seismic signal, a feature extraction method is proposed in this paper. The extracted feature is the cepstrum of the seismic signal whose logarithmic power spectrum density will be preprocessed to suppress the geology related components, which is based on the special characteristics of the employed geologic model, before further calculations. The efficiency of the proposed feature is verified with a mixed database taking from our field experiments and SensIT project. © 2013 IEEE.

关键词： Extraction

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Phase transition behaviors and thermal conductivity of Ge doped Sb2Te thin films for phase-change random access memory

Phase transition behaviors and thermal conductivity of Ge do...

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2013 3rd International Conference on Mechanics, Simulation and Control, ICMSC 2013

作者： Bai, Su Yuan Tang, Zhe Nan Huang, Zheng Xing Gu, Yi Feng School of Physics and Electronic Technology Liaoning Normal University China School of Electronic Science and Technology Dalian University of Technology China Laboratory of Nanotechnology Shanghai Institute of Micro-system and Information Technology Chinese Academy of Sciences China

ISBN: (纸本)9783037857885

The Ge doped Sb2Te thin films Ge2Sb2Te5, Ge0.15Sb2Te and Ge0.61Sb2Te) were deposited by magnetron co-sputtering using Ge and Sb2Te targets. Ge doping effect on the phase transition behaviors and thermal conductivity of the composite films was investigated. Ge0.61Sb2Te thin films have higher crystallization temperature (~200°C), larger crystallization activation energy (~3.28 eV), better data retention(~120.8 °C for 10 years) and lower thermal conductivity (~0.23 W/mK). Ge0.61Sb2Te thin films is considered to be a promising storage medium for phase change random access memory due to its better thermal stability and lower power consumption. © (2013) Trans Tech Publications, Switzerland.

关键词： Thermal conductivity

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Size-tunable synthesis of ferroelectric KNbO3 nanowires

Size-tunable synthesis of ferroelectric KNbO3 nanowires

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Nanophotonics, Nanoelectronics and Nanosensor, N3 2013

作者： Xu, Cheng-Yan Ding, Su He, Kai Li, Yang Zhen, Liang School of Materials Science and Engineering Harbin Institute of Technology Harbin 150001 China MOE Key Laboratory of Micro-system and Micro-structures Manufacturing Harbin Institute of Technology Harbin 150001 China Department of Materials Science and Engineering University of Maryland College Park MD 20742 United States

We report a simple and time-saving hydrothermal approach for the synthesis of singlecrystalline KNbO3 nanowires with tunable widths, starting from KNb3O8 nanobelts, and the ferroelectric properties of individual nanow... 详细信息

ISBN: (纸本)9781557529763

关键词： Niobium compounds

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A novel square silicon nanohole structure: Fabrication and antireflective property

A novel square silicon nanohole structure: Fabrication and a...

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2013 International Conference on Materials for Renewable Energy and Environment, ICMREE 2013

作者： Ding, J.N. Zhang, F.Q. Yuan, N.Y. Cheng, G.G. Wang, X.Q. Center of Micro/Nano Science and Technology Jiangsu University Zhenjiang Jiangsu212013 China Center of Low-Dimension Materials Micro/Nano Device and System Changzhou Univerisity Angzhou Jiangsu China Jiangsu Laboratory for Solar Cell Materials and Technology Changzhou213164 China

ISBN: (纸本)9781479933365

In this paper, a novel square silicon nanoholes light-trapping structure of solar cells was prepared by improved electroless etching method, which is different from the irregular nanoholes and round nanoholes reported earlier by corrosion method in the silicon substrate. We analyzed the formation process of this structure and found that the concentration of nitric acid silver in the solution can determine the formation of the square nanoholes. Moreover, we demonstrated that the longer etching time, the deeper the silicon nanoholes. This square silicon nanohole arrays could suppress the reflection drastically over a wide spectral band width ranging from 300 to 1100 nm. © 2013 IEEE.

关键词： Silicon

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