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Asia-Pacific Conference on Microwave

作者： Jialin Cai Jie Wang Chao Yu Haiyan Lu Jun Liu Lingling Sun Ministry of Education Hangzhou Dianzi University Hangzhou China State Key Laboratory of Millimeter Waves Southeast University Nanjing China The Science and Technology on Monolithic Integrated Circuits and Modules Laboratory Nanjing Electronic Devices Institute Nanjing China

In this paper, a frequency domain, nonlinear, behavioral model for RF power transistors, based on an artificial neural network (ANN), is proposed and validated. The model is identified using the back-propagation algorithm from the incident and scattered wave data of the RF transistor. The model has been extracted and validated on Cree GaN HEMT device. Both simulation and measurement examples are presented. Compared with existing nonlinear transistor behavioral models, which are all input-power dependent, the new model is able to effectively predict the behavior of a transistor over the entire Smith chart, at different levels of input power with only a single set of model coefficients.

关键词： Radio frequency integrated circuit modeling Microwave amplifiers Microwave communication Microwave FETs

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Suppression of Short Channel Effects in Hydrogen- Terminated Diamond MISFETs Using an Al2 O3 / HfO2 Stacked Passivation Layer

Suppression of Short Channel Effects in Hydrogen- Terminated...

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Asia-Pacific Conference on Microwave

作者： Zhihao Chen Xinxin Yu Shuman Mao Yu Fu Jianjun Zhou Yuechan Kong Tangsheng Chen Ruimin Xu Bo Yan Yuehang Xu School of Electronic Science and Engineering University of Electronic Science and Technology of China Chengdu China Research Center of Integrated Circuits and Systems Yangtze Delta Region Institute (Huzhou) University of Electronic Science and Technology of China Huzhou China Science and Technology on Monolithic Integrated Circuits and Modules Laboratory Nanjing Electronic Devices Institute Nanjing China

The short channel effects (SCEs) are mainly caused by the generated insufficient depletion region under the gate, which can severely reduce the reliability of devices. In this paper, the effects are analyzed by the proposed metal-insulator-semiconductor (MIS) capacitance model and can be suppressed by the applied high-k upper passivation layer (UPL). To verify the proposed model, the hydrogen-terminated diamond MIS field-effect transistors (C-H diamond MISFETs) with a 40-/100-$\mathrm{nm} \,\mathrm{Al}_{2} \mathrm{O}_{3} / \mathrm{HfO}_{2}$ stacked passivation layer were fabricated. Benefiting from the 100 -nm-thick HfO 2 UPL, the SCEs are suppressed and a high on/off ratio of $\sim 1 \times 10^{9}$ is achieved in the C-H diamond MISFET even a low aspect ratio of 7.5 for the first time. A cut-off frequency (${f}_{\mathrm{T}})$ of 6.1GHz and maximum oscillation frequency $\left(f_{\max }\right.$) of 11.1GHz were also obtained. The above results indicate that C-H diamond MISFETs with a high-k UPL in this work are promising in the high reliability and high frequency applications.

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Improvement of low temperature GaN Interlayer on the property of the two-dimensional electron gas in AlGaN/GaN heterostructure

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Rengong Jingti Xuebao/Journal of Synthetic Crystals 2013年第7期42卷 1406-1409页

作者： Zhang, Dong-Guo Li, Zhong-Hui Peng, Da-Qing Dong, Xun Li, Liang Ni, Jin-Yu Science and Technology of Monolithic Integrated and Modules Circuits Laboratory Nanjing Electronic Devices Institute Nanjing 210016 China

The AlGaN/GaN two-dimensional electron gas material on sapphire substrate was grown by low-pressure MOCVD method, and the influence of the 2DEG transport property from the low-temperature GaN layer which was inserted in the GaN growth was investigated. Properties of the samples were studied by AFM and Hall measurement. The results indicated that the LT-GaN interlayer could improve the roughness of the surface, and obviously raise the electron mobility in the 2DEG. Hall measurement revealed that the mobility of 2110 cm2/V·s at room temperature could be achieved when the growth temperature of LT-GaN was 860°C.

关键词： III-V semiconductors

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Measurement and modeling techniques for InP-based HBT devices to 220GHz

Measurement and modeling techniques for InP-based HBT device...

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IEEE Conference on Electron Devices and Solid-State circuits

作者： Haiyan Lu Wei Cheng Zhijiang Zhou Oupeng Li Bin Niu Yuechan Kong Tangsheng Chen Science and Technology on Monolithic Integrated Circuits and Modules Laboratory Nanjing Electronic Devices Institute Nanjing China The Key Laboratory for RF Circuits and Systems of Ministry of Education Hangzhou Dianzi University Hangzhou China Fundamental Science on EHF Laboratory University of Electronic Science and Technology of China Chengdu China

ISBN: (纸本)9781509018314

In this paper a measurement method for InP-Based HBT devices to 220GHz is presented. S-parameters are de-embedded using TRL calibration structures (70-220GHz) fabricated on-wafer. The results shown in this paper are characterized at 75-110GHz and 140-220GHz. Good agreement between the low and high frequency measurement is achieved demonstrating the capability of TRL calibration in S-parameters extraction. Small signal equivalent circuit for InP DHBT up to 220GHz is also demonstrated. Excellent agreements between measured and simulated data are obtained in the frequency range of 0.2 to 220 GHz. A six-stage amplifier MMIC designed based on the HBT model is also presented. Measurement results show that the small signal gain of the amplifier is greater than 15 dB over 140-190 GHz.

关键词： Conferences Electron devices Solid state circuits

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A 100MS/s Pipeline ADC Without Calibration In 0.18µm CMOS technology

A 100MS/s Pipeline ADC Without Calibration In 0.18µm CMOS T...

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International Conference on Microwave and Millimeter Wave technology Proceedings

作者： Yi Zhang Yaqin Liu Hongliang Xia Lei Yang Yang Wang Youtao Zhang Yufeng Guo College of Integrated Circuit Science and Engineering Nanjing University of Posts and Telecommunications Nanjing China National and Local Joint Engineering Laboratory of RF Integration and Micro-Assembly Technology Nanjing China State Key Laboratory of Millimeter Waves Nanjing China Science and Technology on Monolithic Integrated Circuits and Modules Laboratory Nanjing China Nanjing GuoBo Electronics Co. Ltd Nanjing China Nanjing Vocational University of Industry Technology Nanjing China

ISBN: (纸本)9781665482271

Based on SMIC 180nm CMOS process and 1.8/3.3V power supply voltage, a high-speed pipeline ADC is designed in this paper. After a comprehensive consideration of conversion rate and accuracy, the pipelined architecture is finally determined to be $\boldsymbol{3.5}\mathbf{b}\boldsymbol{\times 3+5}\mathbf{b.}$ The redundant calibration technology is adopted between each stage to reduce the influence of comparator offset on ADC accuracy. To reduce power consumption and area, SHA-less sampling is adopted. The traditional bootstrap switch is improved to dynamically change the substrate potential so as to reduce the influence of leakage in SHA-less sampling circuit. The post-simulation results shows that the high-speed pipeline ADC designed in this paper can reach 9.97-bit ENOB and 67.76 dB SFDR under the sampling frequency of 100MS/s and input signal frequency of Nyquist, the overall power consumption is about 390mW, and the overall area of the layout is 4.56mm 2 .

关键词： Microwave integrated circuits Power demand Pipelines Layout Voltage Microwave circuits Calibration

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Low insertion loss GHz GaN SAW device fabricated on self-standing GaN substrate

Low insertion loss GHz GaN SAW device fabricated on self-sta...

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IEEE Asia-Pacific Conference on Antennas and Propagation (APCAP)

作者： Jianjun Zhou Liang Li Haiyan Lu Cen Kong Yuechan Kong Tangsheng Chen Chen Chen Xiaoyu Wang Haodong Wu Science and Technology on Monolithic Integrated Circuits and Modules Laboratory Nanjing Electronic Devices Institute Nanjing P. R. China Key Laboratory of Modern Acoustics Nanjing University Nanjing P. R. China

ISBN: (纸本)9781479943531

A GHz SAW device with two face-to-face interdigitated transducers (IDTs) was fabricated on self-standing semi-insulating GaN substrate. Using an advanced e-beam lithographical techniques, the IDTs with 0.5μm wide fingers and spacing have been fabricated on self-standing GaN substrate. On wafer measurement of the S parameters have demonstrated the operation at approximately 2 GHz with 10dB insertion loss.

关键词： Gallium nitride Surface acoustic wave devices Substrates Insertion loss Loss measurement HEMTs MODFETs

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100GHz Static Frequency Divider Based on 0.5μm InP/InGaAs DHBT

100GHz Static Frequency Divider Based on 0.5μm InP/InGaAs D...

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IEEE International Conference on Communication Problem-Solving

作者： Bin Niu Wei Cheng You-Tao Zhang Yuan Wang Hai-Yan Lu Long Chang Jun-Ling Xie Science and Technology on Monolithic Integrated Circuits and Modules Laboratory Nanjing Electronic Devices Institute

A static divide-by-2 frequency divider based on InP/InGaAs DHBT technology is presented. On chip thin film resistor and capacitor were integrated. Two levels of interconnect were developed. Composite collector design ... 详细信息

ISBN: (纸本)9781467365451

关键词： frequency dividers Static frequency divider Double heterojunction bipolar transistors Capacitors FILM RESISTORS THIN FILM RESISTORS

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Low Temperature Fine Pitch Au-In Solid Liquid Inter Diffusion Bonding for Wafer Level Packaging

Low Temperature Fine Pitch Au-In Solid Liquid Inter Diffusio...

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International Conference on (ICEPT) Electronic Packaging technology

作者： Jiayun Dai Fei Wang Lida Xu Desheng Zhao Ping Han Tangshen Chen National Laboratory of Solid State Microstructure Nanjing University Science and Technology on Monolithic Integrated Circuits and Modules Laboratory Nanjing Electronic Devices Institute Nanjing China Nano Fabrication Facility Suzhou Institute of Nanotech and Nano-bionics Suzhou China

ISBN: (数字)9781728168265

ISBN: (纸本)9781728168272

A low temperature fine pitch wafer scale bonding process through Au-In solid liquid inter diffusion bonding is discussed in this paper. 20 μm fine pitch gold and indium miro-bumps with 10 μm diameter are fabricated on two oxidized silicon wafers. Then the wafer bonding process is accomplished at 180 °C with less than 2 μm alignment accuracy. Daisy chains of nearly 2500 interconnects with a fixed contact size of 10×10 μm 2 connected successfully. Besides, there is no significant change of the daisy chain resistance after temperature cycling test. An average die shear strength of more than 20 MPa is also achieved. This work shows great potential of Au-In solid liquid inter diffusion bonding for future high density wafer level packaging and heterogeneous integration.

关键词： Bonding Gold Silicon Wafer bonding Indium Surface morphology Resistance

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High-Performance Monolayer WS2 Field-effect Transistors on High-κ Dielectrics

High-Performance Monolayer WS2 Field-effect Transistors on H...

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The 6th International Conference on Nanoscience & technology, China 2015

作者： Yang Cui Run Xin Zhihao Yu Yiming Pan Zhun-Yong Ong Xiaoxu Wei Junzhuan Wang Yun Wu Tangsheng Chen Yi Shi Baigeng Wang Yong-Wei Zhang Gang Zhang Xinran Wang National Laboratory of Solid State Microstructures School of Electronic Science and Engineeringand Collaborative Innovation Center of Advanced MicrostructuresNanjing University School of Physics Nanjing University Institute of High Performance Computing Science and Technology on Monolithic Integrated Circuits and Modules Laboratory Nanjing Electronic Device Institute

WS2 is an attractive two-dimensional semiconductor material for electronic and optoelectronic device applications due to its high phonon limited mobility compared to other transition metal dichalcogenides. The measured field-effect mobility thus far, however, is much smaller than theoretical predictions, dominated by extrinsic factors including charge traps and impurities. Here, we report that the combination of high-quality Al2O3 dielectric substrate and thiol chemistry passivation could effectively reduce the interface traps and Coulomb impurities, leading to a significant improvement of device performances. Especially, metallic transport is observed at higher carrier density and low temperature. Moreover, through repairing sulfur vacancies, record high mobility is reached at room temperature(83 cm2V-1s-1) and low temperature(337 cm2V-1s-1). Furthermore, we develop a theoretical model for explaining charge transport in the monolayer WS2. Our work provides a viable route towards studying intrinsic charge transport in monolayer WS2 devices.

关键词： tungsten disulfide(WS2),transition metal dichalcogenides(TMDs),mobility,interface

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Threshold Voltage Stability Enhancing technology for p-GaN HEMTs Using Hybrid Gate Structure

IEEE Electron Device Letters

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IEEE Electron Device Letters 2022年 1-1页

作者： Zhang, Chi Li, Mingfei Li, Sheng Liu, Siyang Wang, Denggui Lu, Weihao Ma, Yanfeng Liu, Mengli Wei, Jiaxing Zhang, Long Zhou, Jianjun Bai, Song Sun, Weifeng National ASIC System Engineering Research Centre Southeast University Nanjing China Science and Technology on Monolithic Integrated Circuits and Modules Laboratory Nanjing Electronic Devices Institute Nanjing China State Key Laboratory of Wide-Bandgap Semiconductor Power Electronic Devices Nanjing Electronic Devices Institute Nanjing China

A novel hybrid gate p-GaN power high-electron mobility transistor (Hyb-HEMT) technology is proposed in this work to effectively enhance threshold voltage (Vth) stability without significant gate leakage current (Igss) degradation. In this device concept, gate structure consists of spaced ohmic-type p-GaN metal dots and Schottky-type p-GaN metal. Charge storage effect can be alleviated through a free-carrier “discharge path” induced by ohmic-type p-GaN region, thus enhancing the Vth stability. The surrounding geometry distribution of Schottky-type p-GaN metal can take full advantage of depletion region, ensuring a relatively low Igss. It is experimentally demonstrated that hybrid gate structure can successfully suppress Vth shift within only 0.03V under 1200s DC drain/gate bias stress and the activation energy (EA) of proposed Hyb-HEMT is only 0.59eV, which indicates Hyb-HEMT owns shallower traps, leading to easier discharge of the induced stored charges. Meanwhile, experimental results and the mix-mode simulation prove that no carrier injection or trapping effect occurs in p-GaN layer after repetitive reverse freewheeling stress for the Hyb-HEMT device. IEEE

关键词： Threshold voltage

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