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W-band high output power Schottky diode doublers with quartz substrate

Journal of Semiconductors 2013年第12期34卷 77-81页

作者：姚常飞周明罗运生李姣许从海 Science and Technology on Monolithic Integrated Circuits and Modules Laboratory Nanjing Electronic Devices Institute Department of Microwave and Millimeter Wave Modules Nanjing Electronic Devices Institute

W-band quartz based high output power fix-tuned doublers are analyzed and designed with planar Schot- tky diodes. Full-wave analysis is carried out to find diode embedding impedances with a lumped port to model the nonlinear junction. Passive networks of the circuit, such as the low pass filter, the E-plane waveguide to strip transitions, input and output matching networks, and passive diode parts are analyzed by using electromagnetic simulators, and the different parts are then combined and optimized together. The exported S-parameters of the doubler circuit are used for multiply efficiency analysis. The highest measured output power is 29.5 mW at 80 GHz and higher than 15 mW in 76-94 GHz. The highest measured efficiency is 11.5% at 92.5 GHz, and the typical value is 6.0% in 70-100 GHz.

关键词： high output power frequency doubler planar Schottky diode efficiency

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Broadband modeling for InP DHBT over 0.2 – 220 GHz

Broadband modeling for InP DHBT over 0.2 – 220 GHz

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International Conference on Solid-State and integrated Circuit technology

作者： Zhijiang Zhou Jun Liu Lingling Sun Wei Cheng Haiyan Lu Science and Technology on Monolithic Integrated Circuit and Modules Laboratory Nanjing Electronic Devices Institute Nanjing China The Key Laboratory for RF Circuits and Systems of Ministry of Education Hangzhou Dianzi University Hangzhou China

ISBN: (纸本)9781479932849

Extraction and verification of small signal equivalent circuit for InP/InGaAs DHBT up to G-band (140 to 220 GHz) is presented in this paper. Based on Π-topology small-signal model, the model parameters are extracted from measured S-parameters directly. Analytical and approximation approach used in this paper allows reducing numbers of model parameters for low frequency analysis. In order to extend the model to higher frequencies, extrinsic parameters are determined using both analytical and optimization methods. The model is verified by comparing the modeled parameters to measured parameters. The investigation results show that the excellent agreements between the measured and simulated data are obtained in the frequency range of 0.2 to 220 GHz.

关键词： Abstracts Analytical models Calibration Scattering parameters Indium phosphide Microwave FET integrated circuits Microwave integrated circuits

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A millimeter wave 11W GaN MMIC power amplifier

A millimeter wave 11W GaN MMIC power amplifier

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IEEE Asia-Pacific Conference on Antennas and Propagation (APCAP)

作者： Xuming Yu Wei Hong Weibo Wang Hongqi Tao Chunjiang Ren State Key Laboratory of Millimeter Wave Southeast University Nanjing P. R. China Science and Technology on Monolithic Integrated Circuits and Modules Laboratory Nanjing P. R. China

ISBN: (纸本)9781479943531

A 11 W high power amplifier for millimeter wave application is reported in this paper. The monolithic three-stage amplifier has been realized using a 0.15 μm T-gate field plated AlGaN/GaN high electron mobility transistors (HEMTs) in a microstrip transmission line technology on 3-inch SiC substrate. Saturated output power of 40.5 dBm and peak power-added-efficiency of 20% were measured at 29 GHz with the pulsed DC supply voltage of 24 V. Across the 28-31 GHz range, the amplifier delivers output power above 39.3 dBm with power added efficiency over 15%.

关键词： Gallium nitride Power amplifiers HEMTs MODFETs MMICs Millimeter wave technology Microwave amplifiers

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Observation of polarization pinning effect in PZT/AlGaN/GaN heterostructure

Observation of polarization pinning effect in PZT/AlGaN/GaN ...

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IEEE Conference on Electron Devices and Solid-State Circuits

作者： Yuechan Kong Jianjun Zhou Tangsheng Chen Wenbo Luo Lanzhong Hao Huizhong Zeng Science and Technology on Monolithic Integrated Circuits and Modules Laboratory Nanjing Electronic Devices Institute Nanjing P. R. China State key laboratory of electronic thin films and integrated devices University of Electronics Science and Technology of China Chengdu P. R. China

ISBN: (纸本)9781479923366

PZT/AlGaN/GaN metal-ferroelectric-semiconductor (MFS) heterostructure is fabricated and characterized by C-V measurement. A distinct asymmetric shift of C-V curve is observed that when the up-sweep (from negative to positive) starting voltage increases from -10 V to -18 V, the C-V curve shifts positively with the threshold voltage varying from -2.4 V to 1.1 V, whereas the down-sweep (from positive to negative) C-V curve hardly move with different starting voltage. The field-history dependent polarization effect of ferroelectrics is involved into a self-consistent calculation, by which the nature of the asymmetric C-V curve shift is disclosed to be the polarization pinning effect of the underlying AlGaN layer. The results take an insight into the interface polarization coupling in GaN-based MFS structure for memory device applications.

关键词： Gallium nitride TV Capacitance-voltage characteristics

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Low insertion loss GHz GaN SAW device fabricated on self-standing GaN substrate

Low insertion loss GHz GaN SAW device fabricated on self-sta...

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IEEE Asia-Pacific Conference on Antennas and Propagation (APCAP)

作者： Jianjun Zhou Liang Li Haiyan Lu Cen Kong Yuechan Kong Tangsheng Chen Chen Chen Xiaoyu Wang Haodong Wu Science and Technology on Monolithic Integrated Circuits and Modules Laboratory Nanjing Electronic Devices Institute Nanjing P. R. China Key Laboratory of Modern Acoustics Nanjing University Nanjing P. R. China

ISBN: (纸本)9781479943531

A GHz SAW device with two face-to-face interdigitated transducers (IDTs) was fabricated on self-standing semi-insulating GaN substrate. Using an advanced e-beam lithographical techniques, the IDTs with 0.5μm wide fingers and spacing have been fabricated on self-standing GaN substrate. On wafer measurement of the S parameters have demonstrated the operation at approximately 2 GHz with 10dB insertion loss.

关键词： Gallium nitride Surface acoustic wave devices Substrates Insertion loss Loss measurement HEMTs MODFETs

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A submicron InGaAs/InP double heterojunction bipolar transistor with ft and fmax of 280GHz

A submicron InGaAs/InP double heterojunction bipolar transis...

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2013 International Conference on Precision Mechanical Instruments and Measurement technology, ICPMIMT 2013

作者： Zhao, Yan Cheng, Wei Wang, Yuan Gao, Han Chao Lu, Hai Yan Science and Technology on Monolithic Integrated Circuits and Modules Laboratory Nanjing Electronic Devices Institute Nanjing China

ISBN: (纸本)9781629933405

A submicron InGaAs/InP DHBT fabricated using triple mesa structure and BCB planarization technology is presented. All processes are on 3-inch wafers. The DHBT with emitter area of 0.7×10μm2 exhibits a current cutoff frequency ft and a maximum oscillation frequency fmax both of 280GHz. The breakdown voltage is more than 4V. The high speed InGaAs/InP DHBT with comparable high breakdown voltage is promising for voltage controlled oscillator (VCO) and mixer applications at W band or even higher frequencies. © 2013 Trans Tech Publications Ltd, Switzerland.

关键词： Indium phosphide

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4.5kV SiC JBS diodes

4.5kV SiC JBS diodes

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2013 International Conference on Precision Mechanical Instruments and Measurement technology, ICPMIMT 2013

作者： Tao, Yong Hong Huang, Run Hua Chen, Gang Bai, Song Li, Yun Science and Technology on Monolithic Integrated Circuits and Modules Laboratory Nanjing Electronic Devices Institute Nanjing 210016 China

High voltage 4H-SiC junction barrier schottky (JBS) diode with breakdown voltage higher than 4.5 kV has been fabricated. The doping level and thickness of the N-type drift layer and the device structure have been performed by numerical simulations. The thickness of the device epilayer is 50 μm, and the doping concentration is 1.2×1015 cm-3. A floating guard rings edge termination has been used to improve the effectiveness of the edge termination technique. The diodes can block a reverse voltage of at least 4.5 kV, and the on-state current density was 80 A/cm2 at VF =4 V. © 2013 Trans Tech Publications Ltd, Switzerland.

关键词： Silicon carbide

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High breakdown voltage GaN HEMT device fabricated on self-standing GaN substrate

High breakdown voltage GaN HEMT device fabricated on self-st...

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2013 International Conference on Precision Mechanical Instruments and Measurement technology, ICPMIMT 2013

作者： Zhou, Jian Jun Li, Liang Lu, Hai Yan Kong, Ceng Kong, Yue Chan Chen, Tang Sheng Science and Technology on Monolithic Integrated Circuits and Modules Laboratory Nanjing Electronic Devices Institute Nanjing 210016 China

In this letter, a high breakdown voltage GaN HEMT device fabricated on semi-insulating self-standing GaN substrate is presented. High quality AlGaN/GaN epilayer was grown on self-standing GaN substrate by metal organic chemical vapor deposition. A 0.8μm gate length GaN HEMT device was fabricated with oxygen plasma treatment. By using oxygen plasma treatment, gate forward working voltage is increased, and a breakdown voltage of more than 170V is demonstrated. The measured maximum drain current of the device is larger than 700 mA/mm at 4V gate bias voltage. The maximum transconductance of the device is 162 mS/mm. In addition, high frequency performance of the GaN HEMT device is also obtained. The current gain cutoff frequency and power gain cutoff frequency are 19.7 GHz and 32.8 GHz, respectively. A high fT-LG product of 15.76 GHz&bullμm indicating that homoepitaxy technology is helpful to improve the frequency performance of the device. © 2013 Trans Tech Publications Ltd, Switzerland.

关键词： Aluminum gallium nitride

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Simulation, fabrication and characterization of 4500v 4H-SiC normallyoff VJFET

Simulation, fabrication and characterization of 4500v 4H-SiC...

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2013 International Conference on Precision Mechanical Instruments and Measurement technology, ICPMIMT 2013

作者： Huang, Run Hua Chen, Gang Bai, Song Li, Rui Li, Yun Tao, Yong Hong Science and Technology on Monolithic Integrated Circuits and Modules Laboratory Nanjing China Nanjing Electronic Devices Institute Nanjing China

Simulation, Fabrication and characteristics of high voltage, normally-off JFETs in 4HSiC are presented. The devices were built on ND= 1.0×1015 cm-3 doped 50μm thick n-type epilayer grown on a n+ 4H-SiC. Parameters of edge termination have been optimized by simulations. Its blocking voltage exceeds 4500V at gate bias VG = -6V and forward drain current is in excess of 3A at gate bias VG = 3V and drain bias VD = 5V corresponding a current density of 80A/cm2. © 2013 Trans Tech Publications Ltd, Switzerland.

关键词： Silicon carbide

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Fabrication of L band 4H-SiC SiT devices

Fabrication of L band 4H-SiC SiT devices

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2013 International Conference on Precision Mechanical Instruments and Measurement technology, ICPMIMT 2013

作者： Chen, Gang Jiang, Hao Zhong, Shi Chang Bai, Song Science and Technology on Monolithic Integrated Circuits and Modules Laboratory Nanjing 210016 China Nanjing Electronic Device Institute Nanjing 210016 China

Silicon carbide (SiC) static induction transistors (SITs) were fabricated using homegrown epi structures. The gate is a recessed gate - bottom contact (RG - B). The mesa space designed is 2.5 μm and the gate channel is 1.0 μm. The developed devices adopted a p-type Al ion implanted gate and power performance was improved by decreased leakage current and enhanced break-down voltage. The lift-off with assistant dielectric, dense gate recess etching, high temperature anneals and PECVD passivation process technologies are adopted. One cell has 200 source fingers and each source finger width is 50 μm. 0.5 mm SiC SIT yield a current density of 110 mA/mm at a drain voltage of 50 V. A maximum current density of 160 mA/mm was achieved with Vd = 80V, and the maximum transconductance is 40mS/mm. The device blocking voltage with a gate bias of -12 V was 400 V. Packaged 2 × 2-cm devices were evaluated using amplifier circuits designed for class AB operations. A total power output in excess of 70 W was obtained with a power density of 17.5 W/cm and gain of 5.5 dB at L band 1 GHz under pulse 100μs and cycle ratio 1% RF operation and 80V drain to source voltage. © 2013 Trans Tech Publications Ltd, Switzerland.

关键词： Drain current

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