检索结果-内蒙古大学图书馆

International Conference on Sensing, Diagnostics, Prognostics, and Control (SDPC)

作者： Pengfei Yu Jiao Wang Junliang Wan Qiang-ming Cai Laboratory of Science and Technology on Reliability Physics and Application of Electronic Component Guangzhou China China Electronic Products Reliability and Environmental Test Institute Guangzhou China School of Information Engineering Southwest University of Science and Technology Mianyang China

ISBN: (数字)9798350388855

ISBN: (纸本)9798350388862

Fault prediction is an important research field for power supply status management. Choosing an appropriate algorithm has a significant impact on the effectiveness of prediction. This article uses Deep Belief Network (DBN) to predict the device efficiency degradation of an isolated flyback DC-DC converter. Deep Belief Network (DBN) can be seen as a stack of a series of Restricted Boltzmann Machines (RBMs). The final prediction error (RMSE) is 0.00039. The results indicate that DBN has a relatively small error in predicting device efficiency degradation in DC-DC devices. The advantage of DBN is that DBN can perform fault prediction on complex power systems without establishing a physical model. It is convenient to research fault prediction only based on mathematical models.

关键词： Degradation Performance evaluation Deep learning Accuracy Power supplies DC-DC power converters Predictive models Prediction algorithms Mathematical models Sensors

来源：评论

学校读者我要写书评

暂无评论

Experimental Investigation on Avalanche Robustness of SiC MOSFETs in the Aging Process 4

Experimental Investigation on Avalanche Robustness of SiC MO...

引用

4th International Conference on Power and Energy technology, ICPET 2022

作者： Li, Kaiwei Sun, Pengju Wu, Shuo He, Zhiyuan Chongqing University State Key Laboratory of Power Transmission Equipment and System Security and New Technology Chongqing China China Electronic Product Reliability and Environmental Testing Research Institute Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Guangzhou China

ISBN: (数字)9781665480796

ISBN: (纸本)9781665480796

In this paper, the long-term avalanche energy withstanding ability of commercial 1.7-kV 4H-SiC MOSFETs in the process of bipolar degradation is systematically evaluated and analyzed. The test benches are constructed for bipolar degradation tests and unclamped inductive switching (UIS) tests. The experimental results show that the on-resistance of devices appears significant increment with the increasing stress time. Tacking the increment of on resistance as the indicator, the SiC MOSFETs are divided into three aging degrees, and the avalanche withstand energy decreases gradually with the aging of the devices. Moreover, the safe avalanche operation area (SOA) is established in the aging process. © 2022 IEEE.

关键词： Silicon carbide

来源：评论

学校读者我要写书评

暂无评论

TDR technology Detects Solder Joint Cracking of BGA Packaged Device

TDR Technology Detects Solder Joint Cracking of BGA Packaged...

引用

International Conference on (ICEPT) electronic Packaging technology

作者： Xiaowen Zhang Xiaoling Lin Long Wei Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Ministry of Industry and Information Technology Electronics Fifth Research Institute Guangzhou China

ISBN: (数字)9798350353808

ISBN: (纸本)9798350353815

in the package of a device, when a pulse or step signal is send into the device though the pins, a part of the transmitted signal will be reflected if there is a discontinuity in the package. In this paper, the TDR (Time Domain Reflectometry) technology is used to quickly determine a solder joint Open failure within the BGA package. The characteristic impedance the transmission line of the failing solder joint is compared to the characteristic impedance of the transmission line of a bare package (without die attachment) and a “golden” unit. And the solder joint Open failure has been successfully detected by using TDR, The non-destructive testing of CT and the analysis of solder joint cross section proved that the failure sample was caused by the creep fracture of the solder joint of the device, which then caused the open circuit failure of the device. So it is verified that TDR method can be used to quickly test whether a crack/Open failure is within the package.

关键词： Power transmission lines Creep Failure analysis Reflectometry Pins Impedance Soldering

来源：评论

学校读者我要写书评

暂无评论

A New Probe with High Sensitivity and Dual Components Measurement

A New Probe with High Sensitivity and Dual Components Measur...

引用

International Conference on Microwave and Millimeter Wave technology Proceedings

作者： Lei Wang Rong Zhou Hongyue Wang Zhangming Zhu Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Electronic Product Reliability and Environmental Testing Research Institute GuangZhou China School of Microelectronics Xidian University Xi'an Shaanxi China

ISBN: (数字)9798350389968

ISBN: (纸本)9798350389975

A new electromagnetic probe with dual electromagnetic field components measurement and high detection sensitivity is presented in this work. It is well known that a traditional If-shaped loop probe is often utilized to simultaneously test two electric- and magnetic-field components. However, the If-shaped loop has an obvious drawback, which is that the electric-field sensitivity is much lower than the magnetic-field sensitivity. For the purpose of increasing the electric-field sensitivity, a pair of long strips is inserted into the V-shaped loop to increase the electric-field sensitivity in the presented probe. Moreover, some vias fences are used to prevent the undesired electromagnetic modes. For the purpose of verifying the outstanding feature of the probe, a simulated model is given and simulated on a four-layers PCB, and characterized by a standard microstrip line. By combining the long strips and If-shaped loop, the presented probe not only could measure two electric- and magnetic-field components at the same time, but also has a higher detection sensitivity, which could improve measurement accuracy and save measurement time.

关键词： Microwave measurement Strips Sensitivity Magnetic field measurement Millimeter wave measurements Electric variables measurement Time measurement

来源：评论

学校读者我要写书评

暂无评论

Research on IC-LOGO Extraction Algorithm Based on Deep Semantic Segmentation Network

Research on IC-LOGO Extraction Algorithm Based on Deep Seman...

引用

IEEE International Conference on Artificial Intelligence and Computer applications (ICAICA)

作者： Yue Zhao Mingfeng Guan Jun Luo Qiuzhen Zhang Science and Technology on Reliability Physics and Application of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou China Testing Center of Electronic Components China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou China

ISBN: (数字)9798350377255

ISBN: (纸本)9798350377262

Considering the characteristics of the logo and character areas being intertwined, along with the variability in size and irregularity in shape of logos within integrated circuit (IC) identification images, this paper propose a logo extraction algorithm based on a deep semantic segmentation network. Initially, preprocessing and data augmentation techniques are employed to facilitate the creation of an IC identification dataset, alongside the establishment of a semantic segmentation dataset specifically for the LOGO area. Subsequently, network models including DeepLabv3+, U-Net, PSPNet, and HRNet are trained and validated to identify the optimal model for IC logo extraction. The experimental results indicate that the deep semantic segmentation network demonstrates effective segmentation performance in the extraction of integrated circuit logos, with the HRNet model achieving high segmentation accuracy and an average intersection-over-union ratio of 80%.

关键词： Accuracy Shape Semantic segmentation Computational modeling Termination of employment Computer applications Inspection Feature extraction Data augmentation Integrated circuit modeling

来源：评论

学校读者我要写书评

暂无评论

Effect of Packaging on the Marine Fiber Optic Acoustic Sensitive Components

Effect of Packaging on the Marine Fiber Optic Acoustic Sensi...

引用

International Conference on (ICEPT) electronic Packaging technology

作者： Shuwang Li Jianfei Wang Yuebo Liu Mo Chen Wenyuan Liao Guoguang Lu Science and Technology on Reliability Physics and Application of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou China College of Meteorology and Oceanology National University of Defense Technology Changsha China

ISBN: (数字)9798350353808

ISBN: (纸本)9798350353815

Packaging is an extremely important part of marine fiber optic acoustic sensitive components, both for effective isolation from seawater and for highly sensitive acoustic detection. It is essential to study the effect of packaging on marine fiber optic acoustic sensitive components, particularly those designed for long-term deployment in the high hydrostatic pressures of seawater. In order to analyze the possible effects of packaging, a hydrostatic pressure simulator is employed to simulate the actual subsea operating environment of fiber optic acoustic sensitive components. Unfortunately, it is difficult to effectively analysis the relevant changes in the traditional method such as testing the overall optical insertion loss of fiber optic acoustic sensitive components. In this paper, we propose an innovative method to accurately monitor the fiber optic change inside the fiber optic acoustic sensitive component by adopting the advanced distributed fiber optic strain testing technique, thus to provide a technical means for analysis. In detail, we built an experimental setup as described above and conducted practical test experiments using unpackaged and packaged samples, respectively. Firstly, we tested the strain performance of unpackaged sample under different hydrostatic pressures, and the experimental results found that the test curves showed good symmetry, and under hydrostatic pressure, the optical fiber appeared to have a periodic change, and the strain amplitude of the optical fiber gradually increased with the increase of the pressure. The strain region was relatively flat, and the transition region was smooth. Further, we tested the strain performance of the packaged samples under different hydrostatic pressures, and the experimental results revealed that although the optical fiber appeared to change periodically under hydrostatic pressure, and the strain amplitude of the optical fiber gradually increased with the increase of the pressure, the test curves a

关键词： Optical fibers Optical fiber losses Optical fiber sensors Ultraviolet sources Failure analysis Packaging Acoustics

来源：评论

学校读者我要写书评

暂无评论

Characterization of contamination degradation of mems accelerometer comb structures

Characterization of contamination degradation of mems accele...

引用

IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

作者： Jinchuan Chen Xiao Wen Yingyu Xu Qinwen Huang Wanchun Ren Chunhua He Southwest University of Science and Technology Mianyang China Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou China School of Computer Guangdong University of Technology Guangzhou China

ISBN: (数字)9798350359831

ISBN: (纸本)9798350359848

The effect of organic contamination on the sensitive comb structure of accelerometers in microelectromechanical systems (MEMS) is hardly involved in the original MEMS reliability study, because the existing technology can guarantee chip packaging in the absence of contamination, but with the advancement and popularity of multi-chip packaging technology, some chip devices may have organic substances volatilised and have an effect on the strength of the comb structure of accelerometer devices, thus affecting the service life of the devices. However, with the progress and popularity of multi-chip packaging technology, some of the chip devices may have volatilisation of organic substances, which may affect the strength of the acceleration sensor comb, and thus the service life of the device. In this paper, the theoretical derivation and experimental verification method to complete the study, and in the organic pollution test, organic substances will mainly have an impact on the strength of the comb structure of the acceleration sensor, so this paper focuses on the comb structure before and after the organic pollution of the strength of the change. The results of the experimental study show that the strength of the comb structure of the MEMS device decreases to a certain extent after the contamination compared with that before the contamination. This research result provides a theoretical basis for finding the failure inducing factors in the MEMS failure mode and predicting the device life.

关键词： Micromechanical devices Accelerometers Microelectromechanical systems Degradation Pollution Nanoelectromechanical systems Life estimation

来源：评论

学校读者我要写书评

暂无评论

Improving electrical and thermal properties synchronously via introducing CsPbBr_(3)QDs into higher manganese silicides

引用

Journal of Materials science & technology 2022年第16期111卷 279-286页

作者： Qing Wang Zhiliang Li Xiaofeng Yang Xin Qian Linjuan Guo Jianglong Wang Dan Zhang Shu-Fang Wang Key Laboratory of High-precision Computation and Application of Quantum Field Theory of Hebei Province College of Physics Science and TechnologyHebei UniversityBaoding 071002China Hebei Key Lab of Optic-Electronic Information and Materials College of Physics Science and TechnologyHebei UniversityBaoding 071002China

Higher manganese silicide(HMS)is a P-type medium temperature thermoelectric(TE)material,which has attracted widespread attention over the past few decades due to its remarkable mechanical properties,excellent chemical and thermal stability,as well as the non-toxicity,abundance and competitive *** peak power factor(PF)of HMS is as high as~1.50×10^(-3)W m^(-1)K^(-2)because of its intrinsic high electrical conductivity and Seebeck ***,the thermal conductivity of HMS is also high,resulting in relatively low z T *** nano-dispersion in the matrix is one of the most effective methods to enhance the TE properties via reducing the lattice thermal conductivity significantly without drastic changes on the other *** this study,Cs Pb BrQDs with uniform size were synthesized and introduced into HMS *** PF(at 823 K)was enhanced to 1.71×10^(-3)W m^(-1)K^(-2),which is improved 14.0%approximately compared with that of pure HMS owing to the combined effect of element doping and energy *** lattice thermal conductivity(at 823 K)decreased from 2.56W mKto 1.99 W mKsynchronously(~22.0%)due to the intensive phonon scattering caused by Cs doping,and the embedding of Pb riched CsPbBr_(3)QDs and Pb QDs.A maximum z T value of 0.57(823 K)is achieved in Cs Pb BrQDs/HMS composites,which is 36.0%higher than that of pure ***,for other TE materials,it is also feasible to improve the TE properties via introducing metastable quantum dots.

关键词： Thermoelectric material Higher manganese silicide Quantum dot Figure of merit Inclusion

来源：评论

学校读者我要写书评

暂无评论

Research on Phase Consistency of Optical Fiber Delay Module 3

Research on Phase Consistency of Optical Fiber Delay Module

引用

3rd International Conference on System reliability and Safety Engineering, SRSE 2021

作者： Liao, Wenyuan Li, Shuwang Science and Technology on Reliability Physics and Application of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou China

ISBN: (纸本)9781665401609

The optical fiber delay module is mainly used in the optically controlled phased array radar system, which plays a core role in the whole system. Among them, the measurement accuracy of the optical fiber delay and the optical fiber length are key technologies to realize the phase consistency of the module. In this paper, the phase error source and phase consistency control method of optical fiber delay module are analyzed. Further, the high precision phase testing technology and reliability test of optical fiber delay module are carried out. It can be concluded that the combination of fiber fusion taper and optical phase shift can significantly improve the phase accuracy. Meanwhile, the phase consistency of each channel of the fiber delay module is very excellent before and after the test. © 2021 IEEE.

关键词： Optical fibers

来源：评论

学校读者我要写书评

暂无评论

4.9 GHz A1-mode Lamb Wave Resonator based on Partially Released LN Film

4.9 GHz A1-mode Lamb Wave Resonator based on Partially Relea...

引用

International Conference on electronics technology (ICET)

作者： Zhuo Zhang Ting-Yang Zhang Qin-Wen Huang Shao-Hua Yang Xiao-Sheng Zhang Cheng Tu School of Electronic Science and Engineering University of Electronic Science and Technology of China Chengdu China Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou China

This work presents a 4.9 GHz ${A}_{1}$ -mode Lamb wave resonator (LWR) based on partially released Z-cut lithium niobate (LN) thin film, which is aimed at application of 5G communication in N79 band. The designed LWR utilizes the horizontal electric field for efficient excitation of first-order antisymmetric (A 1 ) mode in the acoustic cavity made of LN film. The fabrication process for the designed LWR is described and validated. The measured results show that the partially released devices achieve large electromechanical coupling coefficient (k$_{t}^{2}$=27%), which is comparable to that of reported fully released devices. The measured results are in good agreement with the finite element (FE) simulations. The presented partially released LWRs show prospect to improve the mechanical robustness of such devices without much sacrifice to performance.

关键词：

来源：评论

学校读者我要写书评

暂无评论

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案：

请选择收藏分类：

通借通还

建议与咨询 留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案： 新增检索档案 确定 取消

请选择收藏分类： 新增自定义分类 确定 取消

通借通还

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

请选择保存的检索档案：

请选择收藏分类：