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International Conference on reliability, Maintainability and Safety,ICRMS

作者： Fangzhou Chen Jiahao Liu Jianyu Wu Hao Zhao Hui Xiao Tao Lu Science and Technology on Reliability Physics and Application of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Guangzhou China Reliability Research and Analysis Center Ceprei Laboratory China Electronic Product Reliability and Environmental Testing Guangzhou China

ISBN: (数字)9798350329988

ISBN: (纸本)9798350329995

This study investigates the influence of residual stress after reflow soldering on the thermal cycling of a ball grid array (BGA). The devices were analyzed after thermal cycling using methods such as macroscopic morphology observation and microscopic structure evolution. The residual stress and strain of an Sn63Pb37/Sn3.0Ag0.5Cu mixed BGA structure were obtained by applying the reflow soldering temperature profile through finite element simulation. Subsequently, temperature cycling loads were applied to the BGA package model after reflow soldering. The thermal fatigue life of the BGA solder joints was predicted using the Darveaux fatigue model based on the strain energy damage. The results showed that considering the residual stress after reflow soldering in the simulation, the equivalent plastic strain was relatively large. The maximum stress was located at the corners where the solder joints contacted the PCB and chip. Microscopic cracks were formed on the interface at the chip-end in critical solder joints. The life prediction indicated that the relatively high residual stress generated during the reflow soldering process had negligible effect on the thermal fatigue performance of the hybrid BGA solder joints.

关键词： Semiconductor device modeling Fatigue Residual stresses Finite element analysis Thermal analysis reliability Plastics Thermal stresses Reflow soldering Strain

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Field-driven merging of polarizations and enhanced electrocaloric effect in BaTiO_(3)-based lead-free ceramics

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Journal of Advanced Ceramics 2022年第11期11卷 1777-1788页

作者： Xiang NIU Xiaodong JIAN Weiping GONG Wei LIANG Xuetian GONG Guangzu ZHANG Shenglin JIANG Kun YU Xiaobo ZHAO Yingbang YAO Tao TAO Bo LIANG Sheng-Guo LU Guangdong Provincial Key Laboratory of Functional Soft Condensed Matter School of Materials and EnergyGuangdong University of TechnologyGuangzhou 510006China Guangdong Provincial Key Laboratory of Electronic Functional Materials and Devices Huizhou UniversityHuizhou 516007China Science and Technology on Reliability Physics and Application of Electronic Component Laboratory The 5th Electronics Research Institute of the Ministry of Industry and Information TechnologyGuangzhou 510610China Dongguan South China Design Innovation Institute Dongguan 523808China School of Optical and Electronic Information Wuhan National Laboratory for OptoelectronicsHuazhong University of Science and TechnologyWuhan 430074China

Solid-state cooling technology based on electrocaloric effect(ECE)has been advanced as an alternative to replace the vapour-compression approach to overcome the releasing of the global warming ***,the development in high ECE materials is still a *** this work,polarization merging strategy was proposed to achieve a large ECE in xBa(Sn_(0.07)Ti_(0.93))O_(3)–(1−x)Ba(Hf_(0.1)Ti_(0.9))O_(3) ferroelectric ceramics,where x=0,0.2,0.4,0.6,0.8,and ***(Sn_(0.07)Ti_(0.93))O_(3) with an orthorhombic phase and Ba(Hf_(0.1)Ti_(0.9))O_(3) with a rhombohedral phase at room temperature were prepared beforehand as precursors,and phase-coexisted xBSnT–(1−x)BHfT ceramics were formed via a solid-state reaction *** coexisting structures were confirmed using the X-ray *** merged polarization was confirmed by the dielectric and ferroelectric *** ECEs were obtained for 0.2BSnT–0.8BHfT ceramics,i.e.,adiabatic temperature change DT=2.16±0.08 K at 80℃and 5 MV/m,and DT=3.35±0.09 K at 80℃and 7 MV/m.

关键词： lead-free ferroelectric microstructure permittivity polarization electrocaloric effect(ECE)

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Fault Diagnosis Algorithm for Power Module Based on A Hybrid Attention Network

Fault Diagnosis Algorithm for Power Module Based on A Hybrid...

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Prognostics and System Health Management Conference (PHM-Qingdao)

作者： Lubin Yu Zhenwei Zhou Yuhang Huang Junbin Liu Shilie He Pengfei Yu Linghui Meng Danni Hong Science and Technology on Reliability Physics and Application of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou China Guangzhou Institute of Technology Xidian University Guangzhou China

Fault diagnosis has a significant contribution to the reliability of the power module, the stability and accuracy of the fault diagnosis algorithm based on single-channel data have major limitations, and existing fault diagnosis algorithms based on multi-channel data have limitations such as insufficient capability of extracting features and low utilization rate of inter-channel correlation information. Therefore, in this paper, a multi-channel fault diagnosis algorithm for power modules based on a hybrid attention network is proposed, aiming at solving the problems of limited fault characterization capability of single-channel data and insufficient feature extraction of existing multi-channel input models. The hybrid attention module of this network adopts a mechanism that combines time attention and channel attention to extract the features of multi-channel data from both channel and time series dimensions of the input data in a holistic manner. The experiments have demonstrated that the hybrid attention network proposed in this paper achieves an accuracy of 99.40% in the multi-channel fault diagnosis test set, which is highly state-of-the-art and practicable, and can provide new ideas and methods for the research in fault diagnosis.

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Research on the reliability of wire bonding in humid environments

Research on the reliability of wire bonding in humid environ...

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13th International Conference on Quality, reliability, Risk, Maintenance, and Safety Engineering (QR2MSE 2023)

作者： X. Zhang X. Ling R. Gao Science and Technology on Reliability Physics and Application of Electronic Component Laboratory 110 DongGuangZhuang Road Guangzhou People's Republic of China

ISBN: (数字)9781839539275

In order to study the reliability of bonding wire under the condition of humidity environment, a testing structure chip was designed and three samples were subjected to humid test at 85°C/85% RH. During the experiment, all three samples showed an increase in leakage current. Through on-site observations, it was found that the leakage current occurred initially, when the experiment continued, the test structure failed due to the detachment of bonding wires from the bonding pad. The failure analysis showed that the surface of the passivation layer between adjacent aluminium pads was covered with impurities, including carbon (C), sodium (Na), aluminium (Al), tungsten (W), and chlorine (Cl) elements. The presence of these conductive elements resulted in leakage between two adjacent aluminium pads on the chip surface that had different electronic potentials. The detachment of bonding wires from the bonding pad is attributed to a chemical reaction caused by vapors. This reaction corrodes the metal aluminium on the bonding pad, leading to the formation of aluminium oxide, causing the gold wire to detach from the pad, and the lifetime of the bonding wire solder joints has been calculated.

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Energy-Efficient Shop Scheduling Using Space-Cooperation Multi-Objective Optimization

IEEE Transactions on Sustainable Computing

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IEEE Transactions on Sustainable Computing 2025年第3期10卷 601-615页

作者： Ding, Jiepin Xia, Jun Yang, Yaning Zhou, Junlong Chen, Mingsong Li, Keqin East China Normal University MoE Engineering Research Center of Software/Hardware Co-Design Technology and Application Shanghai200062 China Ningxia Normal University School of Physics and Electronic Information Engineering Guyuan756500 China Nanjing University of Science and Technology School of Computer Science and Engineering Nanjing210094 China State University of New York Department of Computer Science New PaltzNY12561 United States

Since Industry 5.0 emphasizes that manufacturing enterprises should raise awareness of social contribution to achieve sustainable development, more and more meta-heuristic algorithms are investigated to save energy in manufacturing systems. Although non-dominated sorting-based meta-heuristics have been recognized as promising multi-objective optimization methods for solving the energy-efficient flexible job shop scheduling problem (EFJSP), it is hard to guarantee the quality of the Pareto front (e.g., total energy consumption, makespan) due to the lack of population diversity. This is mainly because an improper individual comparison inevitably reduces population diversity, thus limiting exploration and exploitation abilities during population updates. To achieve efficient population evolution, this paper introduces a novel space-cooperation multi-objective optimization (SCMO) method that can effectively solve EFJSP to obtain scheduling schemes with better trade-offs. By cooperatively evaluating the similarity among individuals in both the decision space and objective space, we propose a space-cooperation population update method based on a three-vector representation that can accurately eliminate repetitive individuals to derive higher-quality Pareto solutions. To further improve search efficiency, we propose a difference-driven local search, which selectively changes the positions of operations with higher differences to search for neighbors effectively. Based on the Taguchi method, we conduct experiments to obtain a suitable parameter combination of SCMO. Comprehensive experimental results show that, compared to state-of-the-art methods, our SCMO method achieves the highest HV and NR and the lowest IGD, with an average of 0.990, 0.952, and 0.001, respectively. Meanwhile, compared to traditional local search approaches, our difference-driven local search obtains twice the HV on instance Mk12 and reduces the solving time from 1521 s to 475 s. © 2016 IEEE.

关键词： Job shop scheduling

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Vias electromigration lifetime reliability evaluation by using focus ion beam method

Vias electromigration lifetime reliability evaluation by usi...

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electronics Packaging technology Conference (EPTC)

作者： Zhang Xiao Wen Lin Xiao Ling Zongbei Dai Gao Rui Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Guangzhou China

ISBN: (纸本)9798350398861

The FIB (Focus Ion Beam) Construction analysis is widely used in FA field, such as evaluating process limitations, debugging, and root cause demonstration. In this paper, we describe the reliability check method of the via by using FIB. Based on the electromigration (EM) test of the vias, the reliability check method of the vias is studied through the influence of void area ratio in the via on the EM lifetime of the via. The results showed that under different operating conditions, the same void area ratio has almost the same influence on the EM lifetime, and with the increase of void area ratio in the via, the EM lifetime of the via decreases, when the lifetime decreases by 20%, the corresponding void area ratio is about 12%, which can be used as the check criteria of the via.

关键词： Electromigration Debugging Lifetime estimation reliability Ion beams electronics packaging

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Vibration reliability Analysis of the Gold Wire Leads of MEMS Inertial Devices

Vibration Reliability Analysis of the Gold Wire Leads of MEM...

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International Conference on reliability, Maintainability and Safety,ICRMS

作者： Yingyu Xu Chunhua He Qinwen Huang CEPREI Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Guangzhou China Guangdong University of Technology School of Computer Guangzhou China

ISBN: (数字)9798350329988

ISBN: (纸本)9798350329995

With the rapid development of the Internet of Things (IoT), MEMS inertial devices are being employed for various applications such as in smart homes, unmanned aerial vehicles, and aerospace. The MEMS inertial devices are exposed to harsh vibration environments, and the deformation of the internal bonding wire may cause reliability issues such as short circuits and fracture failures. The reliability of the gold wire leads of MEMS inertial devices in practice is theoretically analyzed to study the failure mechanisms. The failures caused by the resonance of the wire leads attributed to the mechanical vibration at different temperatures are studied by establishing finite element method models, and the inherent frequency and stress distribution of the wire lead are obtained. The root of the wire lead has the highest stress, and it is the weakest link. Further, the reliability of the wire lead can be improved by increasing its diameter or shortening its length.

关键词： Vibrations Micromechanical devices Gold Simulation Resonant frequency reliability theory Lead reliability engineering Wire Stress

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A Novel Learning Approach to MIMO Networked Control Systems with Uncertain Parameters

A Novel Learning Approach to MIMO Networked Control Systems ...

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Prognostics and System Health Management Conference (PHM-Qingdao)

作者： Hanguang Jia School of Automation Science and Engineering South China University of Technology National Key Laboratory of Science and Technology on Reliability Physics and Application of Electronic Component Guangzhou China

This paper proposes a new learning approach to solve control design problems involving uncertain parameters in MIMO networked control systems. This approach combines neural network technology with control system modeling in real-time through learning and adaptation of data, thereby achieving stability and optimization of network-based control systems. The authors first establish a network-based control model and then improve it by replacing the linear parameters with nonlinear ones. To ensure real-time and stable communication between devices, this method also uses adaptive iterative learning control (AILC) technology and error feedback control technology. A network-based control system is used to verify the effectiveness of the proposed approach. The results show that this approach is effective in achieving sufficient communication between devices, adapting to uncertain parameters, and improving control performance.

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Effects of Porosity on Thermal Resistance Aging at Submicron Silver Interfaces

Effects of Porosity on Thermal Resistance Aging at Submicron...

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International Conference on (ICEPT) electronic Packaging technology

作者： Jian Wang Mowen Zhang Chao Yang Zhiyuan He Zhiwei Fu Jia-Yue Yang School of Energy and Power Engineering Shandong University Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Jinan China Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Guangzhou China School of Energy and Power Engineering Shandong University Science and Technology on Reliability Physics and Application of Electronic Component Laboratory CEPREI Guangzhou China School of Energy and Power Engineering Shandong University Optics & Thermal Radiation Research Center Institute of Frontier and Interdisciplinary Science Shandong University Jinan China

The thermally conductive silver adhesive is widely used as a thermal interface material for thermal management of electronic device packaging. In engineering applications, the evolution of holes inside the silver adhesive interface seriously affects its service life. In this paper, we designed high-temperature accelerated aging experiments for submicron silver adhesive interfaces. The evolution of the pores during interfacial aging was characterized by X-ray scanning and scanning electron microscopy and counting the porosity. The temperature fields of interfaces with different porosities were simulated using finite element simulation. Both experimental and simulation results show that the increase in porosity accelerates the aging of the silver-glue interface. When the porosity is increased to 30%, the simulated equivalent thermal conductivity reduces by 52.50%, and the experimentally tested interfacial thermal resistance increases by 71.58%. The experimental test results of the interfacial thermal resistance are more significant than the simulated results, indicating that porosity is not the only factor influencing accelerated interfacial aging. It provides a theoretical and experimental basis for further research on porosity accelerated aging of silver adhesive interfaces.

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Three-Point Bending Test and Finite Element Analysis of Flexible Termination Multilayer Ceramic Capacitors

Three-Point Bending Test and Finite Element Analysis of Flex...

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International Conference on (ICEPT) electronic Packaging technology

作者： Fangzhou Chen Xiaodong Chen Jiahao Liu Jianyu Wu Hao Zhao Peijiang Liu Zhaoning Sun Wancun Tian Rui Cao Science and Technology on Reliability Physics and Application of Electronic Component Laborator China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou China Reliability Research and Analysis Center (RAC) China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou China China Aerospace Components Engineering Center China Academy of Space Technology Beijing China

ISBN: (数字)9798350353808

ISBN: (纸本)9798350353815

Flexible Termination Multilayer Ceramic Capacitors (FTMLCCs) introduce a flexible electrode layer composed of resin and conductive filler on top of the typical three-layer electrode structure. This flexible layer can absorb significant bending deformation, thus protecting the internal ceramic structure without increasing the capacitor size or compromising its capacitance. In this study, FTMLCC of 1812 product was chosen as the research subject to quantitatively analyze the protective effect of the flexible electrode and the failure mechanism of cracking under bending loads. Simulation analysis was conducted to study the stress and strain distribution of the capacitor after three-point bending. Additionally, bending tests were performed on Multi-layer ceramic capacitors(MLCC) containing flexible electrodes, and a impedance analyzer was employed to address the issue of online monitoring of FTMLCC failures. By combining stress-strain testing to confirm the strain magnitude of the Printed Circuit Board(PCB) during bending, the strain result of PCB in experiments were compared with numerical simulation results to validate the rationality of the numerical model. The failure point of capacitor is located by infrared thermal imaging technology. The electrode structure, the defects of the flexible layer and the failure mode of FTMLCC were studied by metallographic analysis.

关键词： Electrodes Printed circuits Failure analysis Bending Ceramic capacitors Nonhomogeneous media Ceramics

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