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2012 International Conference on Quality, reliability, Risk, Maintenance, and Safety Engineering & The 3rd International Conference on Maintenance Engineering (2012质量,可靠性,风险,维修性及安全性工程国际会议(QR2MSE 2012 & ICME 2012))

作者： Li-Wei Wang Hong-Wei Luo Science and Technology on Reliability Physics and Application of Electronic Component Laboratory CEPREI Laboratories Guangzhou China

The reliability and robustness of Intellectual Properties (IPs) are the keys to the success of the modern System on Chip (SoC) ***,it is very important to implement a rigid IP evaluation platform to ensure the reliability of IPs in the SoC design *** this paper,we introduce major aspects of IP reliability and present a XML schema based metric model which is able to describe reliability characteristics of IP *** evaluation platform is implemented based on the metric *** experimental results on three open source IPs demonstrate that the evaluation platform can assess IP reliability quantitatively and locate its bottleneck.

关键词： intellectual property reliability evaluation

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Aging Data Analysis Methods Based on Short-Term Aging Test

Aging Data Analysis Methods Based on Short-Term Aging Test

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作者： Guoguang Lu Yun Huang Yunfei En Science and Technology on Reliability Physics and Application of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute Guang Zhou P.R.China

ISBN: (纸本)9781467307864

Lifetime is a key parameter for electronic products using,and how to obtain the lifetime by using a short-term aging data has become an international *** this paper,a new aging data analysis method will be introduced,and three groups of aging data for high power laser diodes will be as a case to expound this *** aging test time will be greatly decreased by using this method.

关键词： lifetime aging test laser diode thermal activation energy acceleration factor

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SU-E-T-19: Monte Carlo Simulation of XHA600D 6MV Linear Accelerator

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Medical physics 2013年第6PART10期40卷 207-207页

作者： Y Dai H Lin B Wu J Cai X Pei R Cao C Chen School of Electronic Science & Application Physics Hefei University of Technology Hefei China Institute of Nuclear Energy Safety Technology Chinese Academy of Sciences Hefei China

Purpose: A Monte Carlo model of XHA600D 6MV Linac is built, which provides the tool to validate and analyses the beam feature for ARTS (Accurate Radiotherapy System). Methods: Monte Carlo method is a useful tool to build the Linac model for an accurate TPS. This work uses BEAMnrc and DOSXYZnrc to model XHA600D Linac. The simulation is divided into three parts: the first part is the accelerator fixed part for different fields, which includes from the target to the mirror. This part PSF (phase space file) is very important to ensure the precision of the following simulation. Thus the largest PSF is simulated without variance reduced techniques except for the high electron cut-off (1MeV) to ensure the efficiency of recorded particles. The second part is the beam adjustable part including JAW and MLC to form different fields. A set of PSFs is obtained to store the different field information. The third part is the phantom simulation irradiating by the 2th PSF using DOSXYZnrc. The energy of the incident mono-energy electron is adjusted by matching the simulation to the measured PDD and OAR for 10cmx10cm field, as well as referring to other fields, such as 5cmx5cm and 20cmx20cm. Results: After many iterations of trial and error, the optimized 6 MV is ensured for XHA600D 6MV. A Gaussian beam profile (with σ = 1 mm, FHWH= 0.0 MeV) is used for the incident electron beam at the target surface. The difference is under 2%/3mm for in the field and in the penumbra. An irregular field forming by MLC also is simulated. Conclusion: This work builds a Monte Carlo model of XHA600D 6MV Linac to provide the tool for the dose validation and the beam feature analysis for ARTS.

关键词： Linear accelerators Phase space methods Monte Carlo methods Multileaf collimators Mirrors Radiation therapy Electron beams

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SU-E-T-21: A Grid Intensity-Based Dose Algorithm to Realize MLC Irregular and Inhomogeneous Field Modeling for Monte Carlo Clinical application

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Medical physics 2013年第6PART10期40卷 207-207页

作者： H Lin J Cai Y Dai J Jing X Pei R Cao C Chen School of Electronic Science & Application Physics Hefei University of Technology Hefei China Institute of Nuclear Energy Safety Technology Chinese Academy of Sciences Hefei China

Purpose: A grid intensity-based dose algorithm to realize MLC irregular-inhomogeneous field modeling is presented for Monte Carlo clinical application in ARTS (Accurate Radiotherapy System). Methods: Linac modeling actually is a multi-parameter optimization process, and especially depends on the composition and structure detail provided by venders. Maybe a real accelerator use could be substituted by an irregular-inhomogeneous photon surface source with a compensatory contaminative electron source. MLC intensity map is regarded as many grid gather. The source photon is randomly sampled until its original grid intensity more than zero. The source particle weight is just equal to the grid intensity. The transmission direction of the source particle is decided by SID and MLC position just like a point source irradiation. The measurement data of a set of regular fields are used to commission a XH600D 6MV Linac. The 10cm*10cm field PDD is used to affirm the photon energy spectrum. Their half OARs at iso-center surface of multiple regular fields are projected to MLC underside and fitted by Boltzmann function. A set of fitting coefficients are deduced. Their OAR differences before 1.5 cm depth are used to deduce the contaminative electron source. The MLC irregular-inhomogeneous field is divided into several semi-regular sub-fields, whose side intensities and sub-field width are confirmed by the corresponding field coefficients. This algorithm is implemented by adapting the open Monte Carlo code DPM. Results: This algorithm has been benchmarked with experiment data for regular fields. Basically the difference is under 2%/2mm. The rotational irregular-inhomogeneous multi-fields also are modeled. Conclusion: A grid intensity-based dose algorithm is presented, which need not know the composition and structure inside a real Linac. This algorithm can simulate the irregular-inhomogeneous field formed by MLC, and is promising for Monte Carlo clinical application.

关键词： Multileaf collimators Monte Carlo algorithms Photons Dosimetry Linear accelerators Electron sources Radiotherapy sources Radiation therapy Adaptive radiation therapy Optimization

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The irradiation effect of DC-DC power converter under x-ray

The irradiation effect of DC-DC power converter under x-ray

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International Conference on (ICEPT) electronic Packaging technology

作者： Yujuan He Hongwei Luo Science and Technology on Reliability Physics and Application of Electrical Component Laboratory Guangzhou 510610 China

The irradiation response of DC-DC power converter was studied using X-ray source with whole and local irradiation method. It was indicated that the irradiation response of the different part of circuit was represented different effect. The VDMOSFET of DC-DC power converter was tremendous irradiation affected, and PWM and Shottky diode was exiguous affected, and the trend of DC-DC power converter optical-coupler parameters affected by optical-coupler was reversely with other part of DC-DC circuits.

关键词： Radiation effects Integrated optics Pulse width modulation Couplers Stimulated emission MOSFET circuits Photoconductivity

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Analysis on the failure modes and mechanisms of LED packaging

Analysis on the failure modes and mechanisms of LED packagin...

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International Conference on (ICEPT) electronic Packaging technology

作者： Xin Liu Wenxiao Fang CEPREI Science and Technology on Reliability Physics and Application of Electronic Component Laboratory No.110 Dongguanzhuang Rd. Guangzhou 510610 China

In- and out-doors LED is a new device with excellent performance in power-saving, lighting efficiency, reaction time. Currently, it is widely used in communication, display, illumination. reliability is a key point to promote its application. The most important reliability issue in LED modules is about packaging which includes refrigeration, bonding wire, the aging of organic material, good packaging design et al. In this paper, the failure modes and failure mechanisms of LED are reviewed, and some failure analysis cases are presented.

关键词： Light emitting diodes Bonding Packaging Materials reliability Compounds Wires

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Dielectric and Electrical Transport Properties of the Fe^(3+)-doped CaCu_3Ti_4O_(12)

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Journal of Materials science & technology 2012年第12期28卷 1145-1150页

作者： Zhi Yang Yue Zhang Guang You Kun Zhang Rui Xiong Jing Shi Key Laboratory of Artificial Micro- and Nano-structures of Ministry of Education and School of Physics and Technology Wuhan University Wuhan 430072 China Institution of Sensors and Intelligent System and School of Optical and Electronic Information Huazhong University of Science and Technology Wuhan 430074 China Key Laboratory for the Green Preparation and Application of Functional Materials of Ministry of Education Hubei University Wuhan 430062 China International Center for Materials Physics Shenyang 110016 China

CaCu（3-x）FexTi4O（12）（x=0, 0.015, 0.03, 0.045, 0.06） ceramics were synthesized by sol-gel method. The electrical conduction and dielectric measurements show that the doping of a very small amount of Fe（3＋） ions greatly reduces the low-frequency dielectric constants and leakage, and enhances grain resistivity. For the doped samples, the appearance of the strong low-frequency peaks in the spectra of dielectric loss confirms that the doping of Fe（3＋） ions induces the contact-electrode effect on ceramic surface. These great changes of electrical properties may originate from the reduced amount of oxygen vacancies by doping Fe（3＋）

关键词： Ceramics dc electric current Dielectric properties Doping

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The reliability evaluation of the bonding wire in the DC/DC power under the environment of humidity

The reliability evaluation of the bonding wire in the DC/DC ...

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International Conference on (ICEPT) electronic Packaging technology

作者： XiaoWen Zhang xiaoqi He Science and Technology on Reliability Physics and Application of Electronic Component Laboratory CEPREI 110 Dong Guang Zhuang Road Tianhe District Guangzhou China

Aluminum is an active metal; it can form aluminum oxide (Al 2 O 3 ) when left exposed to air. Aluminum oxide can dissolve in either acid or alkaline solutions, and lead to Corrosion failures on bonding-pad or internal line. In order to evaluate the reliability of bonding wires inside the DC/DC power, the reliability test structure of bonding wire in the DC/DC power has been designed, which has been made by connecting several bonding wire in series, all these bonding wires are bonded on the surface of the Aluminum slice, and all the Aluminum slice is mounted on the surface of ceramic substrate. Two ampere electrical current has been put into the test structure chain to simulate the bonding wire working condition under the operation environment, so the reliability of the DC/DC power under the humidity condition can be assessed. The resistor degradation process of the bonding wire have been conducted through the accelerating of temperature and humidity under the 85 °C/85%RH environment. After 2185 hours accelerating lifetime experiment, the reliability of the DC/DC power under the humidity condition has been evaluated. The result is that if the process is well controlled, the bonding wires are robust to the humidity environment, no failure take place even if there is 5000PPM water vapor existing in the package.

关键词： Wires Bonding Corrosion reliability Humidity Aluminum Resistors

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Extraction of Anand model parameters for mixed solder material by tensile test

Extraction of Anand model parameters for mixed solder materi...

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International Conference on (ICEPT) electronic Packaging technology

作者： Bin Zhou Qing Zhou Kailin Pan Ganggang Liu Science and Technology on Reliability Physics and Application of Electronic Component Laboratory CEPREI No.110 Dongguanzhuang Road Tianhe District Guangzhou China School of Mechanical and Electrical Engineering Guilin University of Electronic Technology China

In this paper, the Sn3.0Ag0.5Cu and 63Sn37Pb were mixed by a certain mass ratio to research reliability of mixed solder material. Firstly, in order to obtain the data of the 9 fitting Anand parameters of mixed solder joint material, a series of tensile tests were carried out under the condition of 5 strain rates from 5.0E-5/s to 1.0E-3/s and at 4 temperatures 253K, 298K, 348K and 398K. Secondly, the constant strain rate method was applied to tensile test at different temperature, and it is this test that must be repeated two times with the same test conditions, the same strain rate and the same temperature. Finally, the stress-strain curve was acquired. The 9 materials parameters of Anand model for mixed solder alloys were determined from experiments and least-square fitting of constitutive relation as well. Further, it is these parameters that can lay the foundation for the analysis of mixed solder joint thermal fatigue simulation and life prediction.

关键词： Strain Packaging reliability engineering Metals

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Study on interfacial behavior and shear strength of lead-free micro-interconnect bump after SnPb reballing

Study on interfacial behavior and shear strength of lead-fre...

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International Conference on (ICEPT) electronic Packaging technology

作者： Bin Zhou Qing Zhou Yun-fei En Science and Technology on Reliability Physics and Application of Electronic Component Laboratory CEPREI No.110 Dongguanzhuang Road Tianhe District Guangzhou China School of Mechanical and Electrical Engineering Guilin University of Electronic Technology China

The metallurgical structure and mechanical shear performance of replated solder bumps were studied. Firstly, the original lead-free interconnect bumps were removed by melt method and the SnPb solder bumps were soldered on the original soldering interface. Then the cross sections of replated bumps were obtained by polishing and the metallurgical structure and the composition of intermetallic layer at the soldering interface were analyzed by SEM&EDS. Secondly, the aging behavior of metallurgical structure of replated bumps was studied further. Finally, the dage4000 was employed and the shear tests were performed respectively on the solder bumps before and after replating. The results showed that the jagged nickel coating formed during the lead conversion process increased the contact areas between nickel coating and IMC layer, and the aging test of 85°C promoted the enhanced growth of IMC layer and even diffusion of solder grain, all of these playing the role of increasing mechanical strength of solder balls. The solder balls after lead conversion represented good shear strength, which proved that the lead free devices after lead conversion used in the high reliability electronic products were feasible.

关键词： Aging reliability Lead Standards Abstracts Tin Performance evaluation

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