检索结果-内蒙古大学图书馆

您好，读者！请登录

内蒙古大学图书馆

首页
概况
党建
资源
服务
科研支持
- 论文收录引用证明
- 科技查新
知识产权
档案馆
帮助

咨询与建议

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

您的常用邮箱：*

您的手机号码：*

问题描述：

当前已输入0个字，您还可以输入200个字

全部搜索
期刊论文
图书
学位论文
标准
纸本馆藏
外文资源发现
数据库导航
超星发现

高级检索

时间限定

出版年份：

文献类型

图书期刊文献学位论文多媒体

馆藏选择

电子馆藏纸本馆藏

核心期刊

全部期刊 SCI 收录期刊 SSCI 收录期刊 EI 收录期刊 CSCD 收录期刊 CSSCI 收录期刊

语言

中文英文

文献类型

期刊文献图书学位论文标准纸本馆藏

帮助

文字说明：

T=题名（书名、题名），A=作者（责任者），K=主题词，P=出版物名称，PU=出版社名称，O=机构（作者单位、学位授予单位、专利申请人），L=中图分类号，C=学科分类号，U=全部字段，Y=年（出版发行年、学位年度、标准发布年）

检索规则说明：

AND代表“并且”；OR代表“或者”；NOT代表“不包含”；(注意必须大写,运算符两边需空一格)

检索范例：

范例一：(K=图书馆学 OR K=情报学) AND A=范并思 AND Y=1982-2016
范例二：P=计算机应用与软件 AND (U=C++ OR U=Basic) NOT K=Visual AND Y=2011-2016

分类表

所选分类

>> <<

限定检索结果

文献类型

457 篇 会议
358 篇 期刊文献

馆藏范围

815 篇 电子文献
0 种 纸本馆藏

日期分布

学科分类号

444 篇 工学
- 230 篇 电子科学与技术（可...
- 133 篇 材料科学与工程（可...
- 131 篇 电气工程
- 91 篇 化学工程与技术
- 77 篇 计算机科学与技术...
- 57 篇 软件工程
- 49 篇 冶金工程
- 45 篇 光学工程
- 44 篇 动力工程及工程热...
- 41 篇 仪器科学与技术
- 36 篇 机械工程
- 32 篇 信息与通信工程
- 27 篇 力学（可授工学、理...
- 25 篇 控制科学与工程
- 18 篇 核科学与技术
- 13 篇 土木工程
- 13 篇 安全科学与工程
- 11 篇 交通运输工程
- 10 篇 轻工技术与工程
- 10 篇 航空宇航科学与技...
334 篇 理学
- 246 篇 物理学
- 97 篇 化学
- 75 篇 数学
- 24 篇 统计学（可授理学、...
- 20 篇 地球物理学
- 13 篇 生物学
41 篇 管理学
- 37 篇 管理科学与工程(可...
- 10 篇 工商管理
8 篇 经济学
7 篇 医学
5 篇 法学
3 篇 军事学
1 篇 农学

主题

69 篇 reliability
33 篇 stress
30 篇 degradation
22 篇 failure analysis
20 篇 logic gates
18 篇 soldering
15 篇 junctions
14 篇 electromigration
13 篇 packaging
12 篇 thermal resistan...
12 篇 gallium nitride
12 篇 silicon
12 篇 mathematical mod...
11 篇 temperature
11 篇 resistance
11 篇 vibrations
11 篇 mosfet
11 篇 lead
11 篇 light emitting d...
11 篇 heating

机构

64 篇 science and tech...
63 篇 science and tech...
23 篇 school of electr...
21 篇 science and tech...
18 篇 science and tech...
18 篇 science and tech...
16 篇 college of mater...
16 篇 school of mechan...
15 篇 national-local j...
15 篇 university of ch...
14 篇 college of physi...
14 篇 hebei key lab of...
12 篇 key laboratory o...
12 篇 institute of mod...
12 篇 science and tech...
11 篇 laboratory of qu...
11 篇 china electronic...
10 篇 institute of com...
10 篇 science and tech...
10 篇 shanghai ebit la...

作者

40 篇 yunfei en
35 篇 yun huang
35 篇 bin zhou
23 篇 wei su
20 篇 guoguang lu
19 篇 huang yun
17 篇 yuan liu
17 篇 shaohua yang
16 篇 si chen
16 篇 lei zhifeng
15 篇 fangfang song
15 篇 zhiyuan he
15 篇 ping lai
15 篇 yang shaohua
15 篇 lu guoguang
15 篇 en yunfei
14 篇 yuan chen
14 篇 renhuai liu
14 篇 zhong zhicheng
14 篇 yinwei li

语言

768 篇 英文
24 篇 其他
18 篇 中文

检索条件"机构=Science and Technology on Reliability Physics and Application of Electronic"

共 815 条记录，以下是731-740 订阅

全选清除本页清除全部题录导出标记到"检索档案"

详细简洁

排序：

Optimal buffering resources allocation of on-chip networks with finite buffers

Optimal buffering resources allocation of on-chip networks w...

引用

2011 4th International Conference on on Intelligent Networks and Intelligent Systems, ICINIS 2011

作者： Wang, Li-Wei Science and Technology on Reliability Physics and Application of Electronic Component Laboratory 5th Electronics Research Institute of the Ministry of Industry and Information Technology Guangzhou 510610 China

ISBN: (纸本)9780769545431

A novel buffer allocation algorithm for deterministically-routed and wormhole-switched network-on-chip (NoC) with finite size buffers is proposed. Based on a analytical model, the algorithm can assess the performance bottleneck of all the NoC routers. When the total buffer budget is fixed, according to the traffic characteristics of the target application, the proposed algorithm automatically allocates the buffer depth for each input channel in different routers. The simulation results show that, by using the proposed algorithm, better system performance and lower average packet latency can be achieved compared to the uniform assignment of buffering resources which has been widely adopted in current NoC design. © 2011 IEEE.

关键词： Network-on-chip

来源：评论

学校读者我要写书评

暂无评论

Effect of hygro-thermo-mechanical stress on reliability of stacked die package

Effect of hygro-thermo-mechanical stress on reliability of s...

引用

2011 International Symposium on Advanced Packaging Materials, APM 2011

作者： Zhu, Wenmin Lai, Ping Yang, Shaohua School of Material and Energy Guangdong University of Technology Guangzhou 510006 China Science and Technology Laboratory on Reliability Physics and Application of Electronic Component CEPREI Guangzhou 510610 China

ISBN: (纸本)9781467301473

Mechanical reliability of epoxy molding compounds in plastic packages of integrated circuits (IC) is greatly affected by the compound ability to absorb moisture. In this paper, the hygro-thermal effect of a 2-layer stacked die package was investigated which emphasized on the hygroscopic stress and thermal mismatch stress. By finite element analysis (FEA), the distribution of moisture diffusion, thermo-mechanical stress, hygro-mechanical stress and hygro-thermo-mechanical stress under hygro-thermal environment were simulated and calculated. The simulation results showed that the bottom die-attach endured higher thermal stress after the moisture preconditioning under 85°C /85% RH. By simulation of hygroscopic swelling stress during reflow process, it was indicated that the critical position for the package reliability located at the corner of the bottom die and the interface between the bottom die-attach and die. Therefore, the reliability of the bottom layers is relatively low under hygro-thermal environment. © 2011 IEEE.

关键词： reliability

来源：评论

学校读者我要写书评

暂无评论

reliability Test and Analysis for Vibration-Induced Solder Joint Failure of PBGA Assembly

Reliability Test and Analysis for Vibration-Induced Solder J...

引用

2011 12th International Conference on electronic Packaging technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

作者： Bin Zhou Yunfei EN Xueli Qi Science and Technology on Reliability Physics and Application of Electronic Component Laboratory CE Science and Technology on Reliability Physics and Application of Electronic Component Laboratory CE

In order to understand the vibration characteristic of plastic BGA solder joints, the test vehicles with daisy chain were designed, vibration reliability test platform and real-time monitoring platform were developed, a series of vibration test including sweep vibration at different levels and random vibration were conducted, and the comparative study for experiments and simulation results was carried out. And the effect of void and pad type on the maximum vibration stress of solder joint was studied. The results showed the relation between deformation of test vehicle and input accelerator represented nonlinear characteristic. The failure of solder joint was occurred firstly in the PBGA which was located on the center of board due to the maximum deformation. The solder joint failure presented the character of solder joint crack, and the crack was initiated at the soldering interface close to solder joint outmost on BGA side and propagated to the internal of solder joint. It can be known that the soldering interface close to SMD pads on BGA side had higher stress concentration and poorer adhesive strength, NSMD solder pad is useful to raise the vibration reliability of solder joint, and maximum stress of solder joint have few sensitive for the changing of solder pad thickness. The phenomenon was validated in the cross-section results. The soldering voids were easy to induce the stress concentration around the voids.

关键词： Soldering Vibrations Stress reliability Fatigue Clamps

来源：评论

学校读者我要写书评

暂无评论

Study of Vibration reliability Test and Simulation for High Density PBGA Assembly

Study of Vibration Reliability Test and Simulation for High ...

引用

2011 International Conference on Quality,reliability,Risk,Maintenance,and Safety Engineering(2011年质量、可靠性、风险、维修性与安全性国际会议暨第二届维修工程国际学术会议 ICQR2MSE 2011)

作者： Bin ZHOU Xueli QI Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Chi Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Chi

The PBGA assembly test samples which contain daisy chain patterns were designed;vibration reliability test platform and real-time monitoring platform called Event Detector from Analysis Tech were developed. The vibration reliability test and failure analysis were performed, and the comparative study for experiments and simulation results was carried out. The results showed that the outermost corner solder joint in the PBGA module which was far away from the fixation point was most vulnerable to vibration failure;the solder joint failure presented the characteristics of crack. The crack initiation and propagation was across the solder close to SMD pad on component side. The voids solder joint had poorer vibration fatigue life than the normal solder joint under the same level of vibration excitation. There was adverse influence of void on the vibration fatigue life of solder joint. It represented corresponding relationship between the strain of solder joint and the vibration fatigue life of solder joint. Finally, non-linear dynamic deformation behavior of the PCB assembly was validated under external vibration excitation. The results of the study could help to design new reliable surface mount electronic package based on high vibration reliability.

关键词： solder joint vibration test simulation reliability fatigue life

来源：评论

学校读者我要写书评

暂无评论

Effect of substrate material on thermal reliability of high-power electronic packaging device

Effect of substrate material on thermal reliability of high-...

引用

2011 International Symposium on Advanced Packaging Materials, APM 2011

作者： Song, Fang Fang Lai, Ping Science and Technology on Reliability Physics and Application of Electronic Component Laboratory 510610 Guangzhou China China Electronic Product Reliability and Environmental Testing Research Institute No.110 Dongguanzhuang Rd. Tianhe District 510610 Guangzhou China

ISBN: (纸本)9781467301473

Thermal performance and reliability are necessary to be considered for high-power electronic packaging device design. In this paper, the thermal characteristic of one kind of packaging device was studied using FEM and experimentation, for phase shifter. The model for thermal condition of phase shifter was established. The top junction temperature obtained by simution shows tendency as tested experiment results, verifying the correctness of the simulation model and method used. The relation of relative temperature rising to different substrate thickness and material is studied by simution. The quantitative relations of these parameters and temperature provided a theoretical basis for the thermal design and reliability estimate, the optimization of parameters and the reliability improvement of phase shifter. © 2011 IEEE.

关键词： Phase shifters

来源：评论

学校读者我要写书评

暂无评论

Static thermal resistance test and simulation analysis technology for hybrid microcircuit

Static thermal resistance test and simulation analysis techn...

引用

2011 International Symposium on Advanced Packaging Materials, APM 2011

作者： Zhou, Bin Qi, Xueli Science and Technology on Reliability Physics and Application of Electronic Component Laboratory CEPREI No. 110 Dongguanzhuang Road Tianhe District Guangzhou China School of Electronic and Information Engineering South China University of Technology Guangzhou China

ISBN: (纸本)9781467301473

The miniaturization of packaging volume for hybrid microcircuit and the increasing of dissipated power for chip make its junction case thermal resistance parameters become the focus of people's study and attention. The thermal resistance sample was designed based on a new embedded copper enhance case and static measurement was used, transient temperature response curve of internal die was showed by testing, thermal resistance - heat capacity network model was obtained through numerical deconvolution, the thermal resistance of internal structures were analyzed, which was compared with the theory calculation result of 45°method, and the effect of each layer structure on overall junction case thermal resistance was analyzed. In addition, heat dissipation performance was studied by comparative analysis between new case and original cold rolled steel case. Finally, temperature distribution and junction case thermal resistance of new hybrid circuit module were studied by finite element simulation. The results showed that the thermal resistance value of new embedded copper packaging case decreased about 50% in contrast to cold rolled steel case. Decreasing overall internal resistance of microcircuit need improves the heat dissipation performance of case, meanwhile, the effect of each layer structure on whole internal thermal resistance should be decreased as much as possible. © 2011 IEEE.

关键词： Heat resistance

来源：评论

学校读者我要写书评

暂无评论

Weld technology reliability analysis of cathode in vacuum tube

Weld technology reliability analysis of cathode in vacuum tu...

引用

2011 International Symposium on Advanced Packaging Materials, APM 2011

作者： Song, Fang Fang Feng, Xian-Long Li, Sha Jin Yu, Shiji Science and Technology on Reliability Physics and Application of Electronic Component Laboratory 510610 Guangzhou China China Electronic Product Reliability and Environmental Testing Research Institute 510610 Guangzhou China Institutes of Electronics No.110 Dongguanzhuang Rd. Tianhe District 510610 Guangzhou China

ISBN: (纸本)9781467301473

Influence of weld technology on reliability and life to cathode in vacuum tube was studied by requests of microwave tube. The quality of weld technology quite affects the emission capability of cathode. The mode of weld quite affects thermal efficiency of cathode in vacuum tube. Thermal efficiency of cathode can increase availably by changing the weld technology on the heat transfer path. Thermal analysis and optimization design of cathode module for vacuum tube was carried out with the FEM in order to obtain required cathode temperature with lower heat power. The weld mode quite affects the cathode heat power, for example, the cathode heat power can reduce 28.6% with 8+8 laser spot welding. We have also built the life test system of TWT's electron gun structure of 8+8 laser spot welding, using this life test system, up to 30 years life of cathode is forecasted. © 2011 IEEE.

关键词： Cathodes

来源：评论

学校读者我要写书评

暂无评论

Simulation of the Effect of Surface Roughness on the Mechanical Properties of a Microbeam

Simulation of the Effect of Surface Roughness on the Mechani...

引用

作者： Wen-Xiao FANG Qin-Wen HUANG Xin LIU Chu-Xuan QIU Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Gua Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Gua Guangdong Inspection and Quarantine Technology Center Guangzhou China

Surface flaw is harmful for the quality of microelectromechanical device, because it could affect the mechanical response of the micro structure inside. In this paper, we simulate the effect of surface roughness on the mechanical properties of a micro beam by a two-dimensional finite element analysis. The random surface is generated in one dimension by a gauss correlation function with two major parameters, root mean square (RMS) σ and correlation length λ. The effect of σ and λ on the bending deflection and eigenfrequency of a 0.5μm (height)×5μm ( length) b eam I s I nvestigated f or t he c ases o f o ne fixed end and two fixed ends, with the following results. Firstly, with a same load, the bending deflection of the microbeam increases with both RMS and correlation length, while the eigenfrequencies (the first to the sixth) of the microbeam decrease with the increase of both RMS and correlation length. In another word, the roughness of the surface softens the microbeam. Secondly, by generating numbers of microbeams with a same σ and λ, we find that the increase of the σ and λ causes the increasing instability degree of the microbeam for the bending deflection Umax and the eigenfrequencies ω in both cases. In the case of two fixed ends, a RMS of 60nm and a correlation length of 300nm lead to a Δumax/Umax=7％ instability degree of the bending, while in the case of one fixed end, they would lead to a value of Δumax/Umax=11％. In the mean time, they lead toΔω/ω=2.9％ instability degree of the first frequency in the case of two fixed ends, and Δω/ω=4.25％ in the case of one fixed end. The simulation would be helpful in the fabrication design of microelectromechanical device.

关键词： surface roughness microbeam bending deflection eigenfrequencies.

来源：评论

学校读者我要写书评

暂无评论

A study of junction temperature testing method in GaAs PHEMT

A study of junction temperature testing method in GaAs PHEMT

引用

2011 International Symposium on Advanced Packaging Materials, APM 2011

作者： Hong, Xiao Huang, Yun Li, Shajin Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Guangzhou Guangdong China 5th Electronics Research Institute of the Ministry of Industry and Information Technology No.110 Dongguanzhuang Rd Guangzhou Guangdong China

ISBN: (纸本)9781467301473

With the development of the RF/microwave technology, more and more GaAs PHEMT device is used and the power of the device is also increasing. However, the test of thermal performance and heat dissipation in packaging device is still a prominent problem. In order to obtain steady operation and longer lifetime, what is the highest temperature environment the device can work? Also the package of the device is a major factor of cooling effect, so the measurement of thermal resistance must be accurate. In this paper, some methods was given to measuring of device junction temperature. Traditional test method such as infrared thermography is not work for the packaging device. A new method to measure the thermal resistance of GaAs PHEMT is given. Based on the electrical measurement method for thermal resistance and Schottky junction temperature of GaAs PHEMT and the factors which influence measuring results are investigated. In the meantime we design the setup of the test system for the measuring. The first is drawing the curve of forward voltage changes and temperature. Then the thermal resistance is measured and calculated. The error introduced by thermal resistance of GaAs PHEMT surface is eliminated. The experimental results show that the method has the advantages of simple structure and good stability. The proposed method is capable to evaluate the thermal resistance of the packaging device such as GaN device, VDMOS and so on. It is very significant to provide evaluation method in reliability test. © 2011 IEEE.

关键词： Heat resistance

来源：评论

学校读者我要写书评

暂无评论

The popcorn effect of lead and lead-free mixed assembly process in high density plastic packages

The popcorn effect of lead and lead-free mixed assembly proc...

引用

2011 International Symposium on Advanced Packaging Materials, APM 2011

作者： Hong, Xiao Lai, Ping Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Guangzhou Guangdong China 5th Electronics Research Institute of the Ministry of Industry and Information Technology No.110 Dongguanzhuang Rd Guangzhou Guangdong China

ISBN: (纸本)9781467301473

The expansion of integrated circuit applications is driving chip costs down. To respond to the lower price the lower price expectations, manufacturers bring Plastic packages which is cost less expensive packaging solutions. Today although the electronic packaging industry there are still many enterprises were to have lead solder, but this does not preclude the "lead-free" has become the main topic of electronic materials and microelectronics. In this transitional period, lead and lead-free both assemble on the plastic package in the field of application is already unavoidable. Problem existed in lead or lead-free materials, technology, equipment, system compatibility and other issues. The reliability of the plastic package IC is becoming a key concern. The popcorn effect is caused when moisture inside a plastic package turns to steam and expands rapidly during infrared and vapor phase reflow solder process. Under certain conditions, the force from the expanding moisture can cause stresses inside the package. Solder ball inside with lead process and outside with lead-free may result in failure. It is prompted by the melting point of lead and lead-free material is different in the same BGA packaging chip. In most severe cases, the packaging defects and the stress may result in external package cracks. And in this paper, a sample is given that the BGA packaging chip exist void in the die/die attach interface. Capillary phenomenon is present in the package closest to the die attach, and lead to a short circuit between some pins. Pay more attention to the reliability of mixed assembly process is of great value. © 2011 IEEE.

关键词： Moisture

来源：评论

学校读者我要写书评

暂无评论

没有更多数据了...

全选清除本页清除全部题录导出标记到“检索档案”

共82页 << < 70 71 72 73 74 75 76 77 78 79 > >>

检索报告对象比较合并检索0

隐藏清空

合并搜索

回到顶部

执行限定条件

内容：

评分：

请选择保存的检索档案：

请选择收藏分类：

订阅名称：

通借通还

温馨提示：

图书名称：

借书校区：

取书校区：

手机号码：

邮箱地址：

一卡通帐号：

电话和邮箱必须正确填写，我们会与您联系确认。

联系人：

所在院系：

联系邮箱：

联系电话：

内蒙古自治区呼和浩特市赛罕区大学西街235号邮编: 010021

建议与咨询 留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案： 新增检索档案 确定 取消

请选择收藏分类： 新增自定义分类 确定 取消

通借通还

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

请选择保存的检索档案：

请选择收藏分类：