作者：
Yanagisawa, HNoya, ASasaki, KAbe, YFaculty of Engineering
Kitami Institute of Technology Kitami Japan 090 Graduated from the Department of Electronic Engineering
Nippon Electronic Technical College in 1975 and joined Kitami Institute of Technology the same year. Currently he is a Research Associate in the Department of Electric and Electronic Engineering at the College. He has been engaged in the research and development of thin-film electronic materials. He is a member of the Japan Society of Applied Physics. Graduated from the Electronic Engineering Department
Muroran Institute of Technology in 1974 received his doctoral degree in 1980 and joined Kitami Institute of Technology as a Research Associate the same year. He was appointed Lecturer in 1990 Assistant Professor in 1991 and Professor in 1994. He has been engaged in research on thin-film electronic materials and their evaluation. He is a member of the Japan Society of Applied Physics. Graduated from the Polymer Science Department
Hokkaido University in 1967. Later he received his Dr. of Eng. degree. After being assigned to the Applied Electrical Laboratory of Hokkaido University he was appointed Lecturer at Kitami Institute of Technology in 1975 Assistant Professor in 1979 and Professor in 1990. After the reorganization of Kitami Institute of Technology he was appointed Professor of the Materials Science Engineering Department. He has been engaged in research on thin-film electronic materials and electronic properties as well as in the development of LSI thin-film technology and in the application of anodic oxide films to electronic devices. He is a member of the Japan Society of Applied Physics and the Chemical Society of Japan. Graduated from the Applied Physics Department
Hokkaido University in 1980. He received his doctoral degree in 1985 and joined Hitachi Ltd. the same year. At Hitachi Ltd. he engaged in research on EL displays and semiconductor memories. He was appointed as an Assistant Professor of the Materials Science Engineering Department Kitami Institute
The interfacial solid-phase reactions taking place in the Al/Al3Zr/Zr/Si contact systems have been investigated to evaluate the effectiveness of Al3Zr/Zr bilayered films its a diffusion barrier in Al-metallization tec...
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The interfacial solid-phase reactions taking place in the Al/Al3Zr/Zr/Si contact systems have been investigated to evaluate the effectiveness of Al3Zr/Zr bilayered films its a diffusion barrier in Al-metallization technology. The interposition of an intermediate Al3Zr layer can successfully suppress the possible spontaneous rections between the Al and Zr layers because nearly-minimum free energy states are realized at interfaces of both Al/Al3Zr and Al3Zr/Zr. It is revealed that the present system tolerates heat treatment at temperatures of up to 470 degrees C and the formation of a Zr-silicide layer is observed at the Zr/Si interface after heat treatment in the temperature range of 450 similar to 470 degrees C.
作者：
Shimizu, STanizawa, MKusunoki, SInuishi, MMiyoshi, HULSI Laboratory
Mitsubishi Electric Corporation 4-1 Mizuhara Itami Hyogo Japan 664 Received the B.S. and M.S. degrees in electronic engineering from Kobe University
Hyogo Japan in 1988 and 1990 respectively. In 1990 he joined LSI Research and Development Laboratory Mitsubishi Electric Corporation where he has been engaged in research on the structural design of submicron CMOS such as MOSFETs silicidation and reliability including investigations of the hot carrier effect in the ULSI Laboratory. He is a member of the Japan Society of Applied Physics. Received the B.S. and M.S. degrees in electronic engineering from Kyoto University
Kyoto Japan in 1983 and 1985 respectively. From 1985 to 1988 he was with Sharp Corporation Nara Japan. In 1988 he joined LSI Research and Development Laboratory Mitsubishi Electric Corporation Hyogo Japan where he has been engaged in semiconductor device modeling for circuit simulation in ULSI Laboratory. He is a member of the Japan Society of Applied Physics. Received the B.S. degree in Physics and the M.S. degree in Information Systems Science from Kyushu University in 1978 and 1982
respectively. He joined the LSI Research and Developmept Laboratory Mitsubishi Electric Corporation Hyogo Japan in 1982. From 1982 to 1988 he was engaged in research on SOI device technology and three-dimensional ICs and from 1988 to 1995 he was engaged in research on the structural design of scaled MOS transistors. He is presently engaged in the research on the structural design of power devices in the ULSI Laboratory. He is a member of the Japan Society of Applied Physics. Received a B.S. in materials science and engineering from Osaka University
Japan in 1976 and a Ph.D. from Northwestern University Evanston Illinois in 1981. In 1981 he joined LSI Research and Development Laboratory Mitsubishi Electric Corporation Hyogo Japan. Since then he has been engaged in research on process and device technologies for 64K and 1M DRAMs and on submicron CMOS isolation ret
High performance under low supply voltage is required for ULSIs in combination with the higher packing density that results from scaling down to the deep sub-micron region. For this requirement, the conventional metho...
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High performance under low supply voltage is required for ULSIs in combination with the higher packing density that results from scaling down to the deep sub-micron region. For this requirement, the conventional method, using the DC hot carrier lifetime of MOSFETs as measured by DC stress, overestimates the degradation caused by real circuit operation. As a result, the improvement of MOSFET performance is limited by attempting to satisfy the overestimated hot carrier criteria under DC stress. Therefore, it is strongly desired that the reliability simulation estimate accurately hot carrier degradation in real circuit operation. We have found that the degradation rate depends on the stress conditions and can be expressed in terms of the difference between the gate and drain voltages. Hence, in this paper, we propose a new method of modeling and calculation of hot carrier degradation that incorporates this dependence and will demonstrate improved accuracy in predicting degradation and life time for both AC and DC bias conditions. We also propose a new duty ratio extraction method that can be used to predict the lifetime for hot carrier degradation under actual circuit operation.
The military services are being moved in the direction of performance-based specifications and standards. They are being steered against dictating ''how to'' produce an item since such action foreclose...
The military services are being moved in the direction of performance-based specifications and standards. They are being steered against dictating ''how to'' produce an item since such action forecloses on the ability to gain access to components or technology that may have a commercial equivalent. Why should the engineering community embrace the new approach? Aside from the obvious weight of it being approved policy, therefore currently mandated, it warrants examination because it is the correct approach at this time when applied to appropriate products. Military specifications and standards are to be displaced then, by acceptable alternative contractor design solutions. Industry bidders will be allowed to propose the particular design details, permitting procurement flexibility by contractually citing only system level or interface requirements, both physical and functional. Hopefully, this can broaden the industrial base and increase competition with reduced costs to follow. Conceptually, the approach appears both performance-sensible and cost-attractive (there are, of course, consequent risks) but how does implementation proceed? Is it possible to pursue the goals envisioned along paths that are not in themselves experimental? Can the American postulate, minimal loss of life and limb to U.S. military people, continue to be honored? Experience and track record elsewhere imply encouraging possibilities in select situations-useful prospects are identified and discussed in practical terms.
A ship design methodology is presented for developing hull forms that attain improved performance in both seakeeping and resistance. Contrary to traditional practice, the methodology starts with developing a seakeepin...
A ship design methodology is presented for developing hull forms that attain improved performance in both seakeeping and resistance. Contrary to traditional practice, the methodology starts with developing a seakeeping-optimized hull form without making concessions to other performance considerations, such as resistance. The seakeeping-optimized hull is then modified to improve other performance characteristics without degrading the seakeeping. Presented is a point-design example produced by this methodology. Merits of the methodology and the point design are assessed on the basis of theoretical calculations and model experiments. This methodology is an integral part of the Hull Form Design System (HFDS) being developed for computer-supported naval ship design. The modularized character of HFDS and its application to hull form development are discussed.
The potential use of rudders as anti-roll devices has long been recognized. However, the possible interference of this secondary function of the rudder with its primary role as the steering mechanism has prevented, fo...
The potential use of rudders as anti-roll devices has long been recognized. However, the possible interference of this secondary function of the rudder with its primary role as the steering mechanism has prevented, for many years, the development of practical rudder roll stabilizers. The practical feasibility of rudder roll stabilization has, however, in recent years been demonstrated by two systems designed and developed for operational evaluation aboard two different U.S. C oast G uard Cutters, i.e., Jarvis and Mellon of the 3,000-ton, 378-foot HAMILTON Class. The authors describe the major components of the rudder roll stabilization (RRS) system, along with the design goals and methodology as applied to these first two prototypes. In addition, a brief history of the hardware development is provided in order to show some of the lessons learned. The near flawless performance of the prototypes over the past four years of operational use in the North Pacific is documented. Results from various sea trials and reports of the ship operators are cited and discussed. The paper concludes with a discussion of the costs and benefits of roll stabilization achieved using both a modern anti-roll fin system, as well as two different performance level RRS systems. The benefits of roll stabilization are demonstrated by the relative expansion in the operational envelopes of the USS OLIVER HAZARD PERRY (FFG-7) Class. The varying levels of roll stabilization suggest that the merits of fins and RRS systems are strongly dependent on mission requirements and the environment. The demonstrated performance of the reliable RRS system offers the naval ship acquisition manager a good economical stabilization system.
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