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arXiv 2022年

作者： Zou, Bo Zhou, Yu Zhou, Yan Wu, Yanyan He, Yang Wang, Xiaonan Yang, Jinfeng Zhang, Lianghui Chen, Yuxiang Zhou, Shi Guo, Huaixin Sun, Huarui School of Science Ministry of Industry and Information Technology Key Laboratory of Micro-Nano Optoelectronic Information System Harbin Institute of Technology Shenzhen518055 China Collaborative Innovation Center of Extreme Optics Shanxi University Shanxi Taiyuan030006 China State Key Laboratory of Superlattices and Microstructures Institute of Semiconductors Chinese Academy of Sciences Beijing100083 China University of Science and Technology of China Hefei230026 China Science and Technology on Monolithic Integrated Circuits and Modules Laboratory Nanjing Electronic Devices Institute Nanjing210016 China

The emerging Au-assisted exfoliation technique provides a wealth of large-area and high-quality ultrathin two-dimensional (2D) materials compared with traditional tape-based exfoliation. Fast, damage-free, and reliable determination of the layer number of such 2D films is essential to study layer-dependent physics and promote device applications. Here, an optical method has been developed for simple, high throughput, and accurate determination of the layer number for Au-assisted exfoliated MoS2 and WS2 films in a broad thickness range. The method is based on quantitative analysis of layer-dependent white light reflection spectra, revealing that the reflection peak intensity can be used as a clear indicator for determining the layer number. The simple yet robust method will facilitate the fundamental study on layer-dependent optical, electrical, and thermal properties and device applications of 2D materials. The technique can also be readily combined with photoluminescence and Raman spectroscopies to study other layer-dependent physical properties of 2D materials. Copyright © 2022, The Authors. All rights reserved.

关键词： Layered semiconductors

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monolithically integrated 850 nm optical receiver front end

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Guti Dianzixue Yanjiu Yu Jinzhan/Research and Progress of Solid State Electronics 2007年第3期27卷 350-355页

作者： Feng, Ou Feng, Zhong Yang, Lijie Jiao, Shilong Jiang, Youquan Chen, Tangsheng Li, Fuxiao Ye, Yutang Nanjing Electronic Devices Institute Nanjing 210016 China National Key Laboratory of Monolithic Integrated Circuits and Modules Nanjing 210016 China School of Optoelectronic Inf. Uni. of Electronic Science and Technology of China Chengdu 610054 China

An 850 nm monolithically integrated optical receiver front end has been developed with 0.5 μm GaAs PHEMT process, mesa process and interconnected photolithography technology between mesa and plane, which comprises a metal-semiconductor-metal (MSM) photodetector and a transimpedance preamplifier. The photodetector has a photosensitive area and a capacitance of 2000 μm2 and 0.15 pF respectively, as well as a dark current of less than 14 nA under a bias of 4 V. The transimpedance preamplifier has a -3 dB bandwidth close to 10 GHz, with a transimpedance of 43 dBΩ;The front end has a relatively clear output eye diagram for the 850 nm optical signal modulated by 2.5 Gb/s NRZ pseudorandom binary sequence.

关键词： Optical receivers

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Corrigendum to “Accurate calculation of terahertz attenuation of a dielectric-coated metal wire with an intervening air gap using the engineering approach” [Optics Communications 284/16–17 (2011) 3990–3995]

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Optics Communications 2012年第5期285卷 857-857页

作者： Zhihui Wang Yong Zhang Ruimin Xu Weigan Lin School of Electronic Engineering University of Electronic Science and Technology of China Chengdu 611731 China National Key Laboratory of Monolithic Integrated Circuits and Modules Nanjing 210016 China

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COMPUTER-AIDED MANUFACTURING OF ADVANCED MICROWAVE modules

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INTERNATIONAL JOURNAL OF MICROWAVE AND MILLIMETER-WAVE COMPUTER-AIDED ENGINEERING 1991年第1期1卷 90-111页

作者： PAVIO, AM PAVIO, JS CHAPMAN, JE BOGGAN, GH Texas Instruments Incorporated P.O. Box 655474 Dallas. Texas 75265 Jeanne Pavio is the Manager of the Microwave Advanced Packaging Group at Texas Instruments where she has been cmployed since 1980. She received the BA degree in 1971 and the MS in 1972 both from the University of Connecticut. Her experience base has included the fabrication and assembly of thick and thin film hybrids. At the Texas Instruments Hybrid Microelectronics Laboratory Jeanne implemented nitrogenfireable thick film for ceramic application in surface-mount technology and hybrids. For the last six years she has focused on the automated assembly and packaging of GaAs Monolithic Microwave Integrated Circuits and devices. This has encompassed development of fluxless furnace reflow and void-free vacuum reflow of GaAs components as well as development of automated wirebonding to GaAs Microwave Hybrids. She was instrumental in directly applying this technology to active phased array module production. Her efforts presently involve the implementation of high-volume techniques and automation for insertion of MMIC technology in a cost-effective highvolume environment. She has authored numerous papers involving hybrid fabrication and assembly technology and in particular involving automated assembly and packaging of GaAs MMIC devices. James E. Chapman Jr. was born in Dallas Texas in 1943. He received the BS and MS degrees in Electrical Engineering from Southern Methodist University (SMU) in 1966 and 1968 respectively. During this time he was associated with the Semiconductor Group of Texas Instruments Incorporated as an undergraduate engineering cooperative student working with various silicon products and processes. Mr. Chapman is currently a Senior Member of the Technical Staff assigned to the Microwave Technology and Products Division of the Defense Systems and Electronics Group. In this position he is currently technical director of the Technology Development for Solid-state Phased-Arrays (TDSSPA) Program. This program is a task-ordere

The application of computer-aided manufacturing (CAM) techniques to the assembly and test of a low-cost, high-volume X-band Radar T/R module will be investigated by highlighting the differences between low frequency and microwave CAM methods, focusing on the difficulties of automated testing, evaluation, and circuit tuning. The problems encountered when implementing high-precision automated assembly and test methods, which include wire-bonding, soldering, piece-part placement, thin wafer GaAs probing, and a novel implementation of a microwave circuit laser-tuning technique will also be discussed. These CAM techniques, combined with integrated MMIC technology, are then used to illustrate a manufacturing philosophy targeted toward high-volume microwave module production.

关键词： Microwave devices

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低真空条件下石墨烯薄膜的制备工艺研究

低真空条件下石墨烯薄膜的制备工艺研究

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第十七届全国化合物半导体材料微波器件和光电器件学术会议

作者： Yun Li 李赟 Zhijun Yin 尹志军 Zhiming Zhu 朱志明 Science and Technology on Monolithic Integrated Circuits and Modules Laboratory Nanfing Electronic 微波毫米波单片集成和模块电路重点实验室南京电子器件研究所南京 210016

本文利用水平热壁式CVD外延炉开展了SiC热分解法制备石墨烯薄膜的实验,主要研究了不同的真空热处理时间对石墨烯薄膜生长的影响。SiC衬底的氢气在线刻蚀处理和热分解在同一炉次进行,高温时反应室释放出之前吸附的氢气不能有效地被分子... 详细信息

本文利用水平热壁式CVD外延炉开展了SiC热分解法制备石墨烯薄膜的实验,主要研究了不同的真空热处理时间对石墨烯薄膜生长的影响。SiC衬底的氢气在线刻蚀处理和热分解在同一炉次进行,高温时反应室释放出之前吸附的氢气不能有效地被分子泵抽除,SiC衬底的有效碳化时间有限,实验发现热处理时间超过30分钟之后,石墨烯层数并无明显变化。进一步加长热处理时间,石墨烯样品中出现局部氢插入层。

关键词：石墨烯薄膜碳化硅衬底制备工艺性能评价低真空条件

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Comparison of spin photocurrent in devices based on in-plane or out-of-plane magnetized CoFeB spin detectors

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Physical Review B 2019年第4期100卷 045417-045417页

作者： Xiaodi Xue Laipan Zhu Wei Huang Xavier Marie Pierre Renucci Yu Liu Yang Zhang Xiaolin Zeng Jing Wu Bo Xu Zhanguo Wang Yonghai Chen Weifeng Zhang Yuan Lu Key Laboratory of Semiconductor Materials Science Institute of Semiconductors Chinese Academy of Sciences Beijing Key Laboratory of Low Dimensional Semiconductor Materials and Devices Beijing 100083 China Henan Key Laboratory of Photovoltaic Materials Laboratory of Low-Dimensional Materials ScienceSchool of Physics & Electronics Henan University Kaifeng 475004 China Beijing Institute of Nanoenergy and Nanosystems Chinese Academy of Sciences Beijing 100083 China Science and Technology on Monolithic Integrated Circuits and Modules Laboratory Nanjing Electronic Devices Institute Nanjing 210016 China Université de Toulouse INSA-CNRS-UPS LPCNO135 Avenue de Rangueil F-31077 Toulouse France Center of Materials Science and Optoelectronics Engineering University of Chinese Academy of Sciences Beijing 100049 China Université de Lorraine Institut Jean Lamour UMR CNRS 7198 campus ARTEM 2 Allée André Guinier 54011 Nancy France

We have measured a helicity-dependent photocurrent at zero external magnetic field in a device based on a semiconductor quantum well embedded in a p-i-n junction. The device is excited under vertical incidence with circularly polarized light. The spin filtering effect is evidenced in the temperature range 77–300 K owing to a CoFeB/MgO spin filter with out-of-plane magnetization in remanence. The helicity-dependent photocurrent is explored as a function of the temperature and bias. These characteristics are compared with those of a spin photocurrent device with in-plane magnetized CoFeB/MgO spin filter, excited under oblique incidence with circularly polarized light. In contrast to the in-plane spin filter device, the circularly polarized light asymmetry of the photocurrent in the out-of-plane device depends weakly on the external bias. The two devices are sensitive to the spin filtering of either the in-plane (Sx) or out-of-plane (Sz) photogenerated electron spin in the semiconductor quantum well. The helicity-dependent photocurrent results can be explained by the Dyakonov-Perel electron spin-relaxation mechanism. Our study reveals the giant spin relaxation anisotropy in III-V zinc-blende quantum wells in the presence of a vertical electric field.

关键词： Polarization of light Spin filtering Spin relaxation Spintronics Ferromagnets Quantum wells Femtosecond laser spectroscopy

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高质量GaN薄膜的MOCVD同质外延生长

高质量GaN薄膜的MOCVD同质外延生长

引用

第十七届全国化合物半导体材料微波器件和光电器件学术会议

作者： Liang Li 李亮 Zhonghui Li 李忠辉 Weike Luo 罗伟科 Xu Dong 董逊 Daqing Peng 彭大青 Dongguo Zhang 张东国微波毫米波单片集成和模块电路重点实验室南京电子器件研究所南京210016 Science and Technology on Monolithic Integrated Circuits and Modules Laboratory Nanjing Electronics Device InstituteNaning210016 China

采用金属有机化学气相沉积(MOCVD)方法,在GaN自支撑衬底上同质外延生长了GaN薄膜,得到高质量的GaN外延薄膜。X射线衍射(XRD)结果显示其(002)面摇摆曲线半高宽小于100弧秒,原子力显微镜(AFM)照片上能看到连续的二维台阶流形貌,其表面租... 详细信息

采用金属有机化学气相沉积(MOCVD)方法,在GaN自支撑衬底上同质外延生长了GaN薄膜,得到高质量的GaN外延薄膜。X射线衍射(XRD)结果显示其(002)面摇摆曲线半高宽小于100弧秒,原子力显微镜(AFM)照片上能看到连续的二维台阶流形貌,其表面租糙度小于0.5nm,其位错密度低于l06cm-3。

关键词：半导体薄膜氮化镓同质外延金属有机化学气相沉积

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低温GaN插入层对AlGaN/GaN二维电子气特性的改善

低温GaN插入层对AlGaN/GaN二维电子气特性的改善

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第十七届全国化合物半导体材料微波器件和光电器件学术会议

作者： Dongguo Zhaang 张东国 Zhonghui Li 李忠辉 Daqing Peng 彭大青 Xun Dong 董逊 Liang Li 李亮 Jinyu Ni 倪金玉 Science and Technology of Monolithic Integrated and Modules Circuits Key Laboratory Nanjing Electronic Devices Institute Nanfing 210016 China 微波毫米波单片集成和模块电路重点实验室南京电子器件研究所南京 210016

利用低压MOCVD技术在蓝宝石衬底上生长了AlGaN/GaN二维电子气(2DEG)材料,在GaN生长中插入一层低温GaN,并研究了低温GaN插入层对二维电子气输运特性的影响。使用原子力显微镜(AFM)和非接触霍尔测试仪测量了材料的表面形貌和电学特性,发... 详细信息

利用低压MOCVD技术在蓝宝石衬底上生长了AlGaN/GaN二维电子气(2DEG)材料,在GaN生长中插入一层低温GaN,并研究了低温GaN插入层对二维电子气输运特性的影响。使用原子力显微镜(AFM)和非接触霍尔测试仪测量了材料的表面形貌和电学特性,发现低温GaN插入层可以改善材料表面平整度并使AlGaN/GaN2DEG的电子迁移率有明显提高,GaN插入层温度为860℃的样品2DEG的电子迁移率达到2110 cm2/V.s。

关键词：异质结半导体低温氮化镓插入层二维电子气性能改善电子迁移率

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Integrating high-quality dielectrics with one-nanometer equivalent oxide thickness on two-dimensional electronic devices

arXiv

引用

arXiv 2019年

作者： Li, Weisheng Zhou, Jian Cai, Songhua Yu, Zhihao Zhang, Jialin Fang, Nan Li, Taotao Wu, Yun Chen, Tangsheng Xie, Xiaoyu Ma, Haibo Yan, Ke Dai, Ningxuan Wu, Xiangjin Zhao, Huijuan Wang, Zixuan He, Daowei Pan, Lijia Shi, Yi Wang, Peng Chen, Wei Nagashio, Kosuke Duan, Xiangfeng Wang, Xinran National Laboratory of Solid State Microstructures School of Electronic Science and Engineering Collaborative Innovation Center of Advanced Microstructures Nanjing University Nanjing210093 China National Laboratory of Solid State Microstructures Jiangsu Key Laboratory of Artificial Functional Materials College of Engineering and Applied Sciences Collaborative Innovation Center of Advanced Microstructures Nanjing University Nanjing210093 China Department of Chemistry National University of Singapore 3 Science Drive 3 117543 Singapore Department of Materials Engineering University of Tokyo Tokyo113-8656 Japan Science and Technology on Monolithic Integrated Circuits and Modules Laboratory Nanjing Electronic Device Institute Nanjing210016 China School of Chemistry and Chemical Engineering Nanjing University Nanjing210023 China Department of Chemistry and Biochemistry University of California Los AngelesCA United States

Two-dimensional (2D) semiconductors are widely recognized as attractive channel materials for low-power electronics. However, an unresolved challenge is the integration of high-quality, ultrathin high-κ dielectrics that fully meet the roadmap requirements for low-power applications. With a dangling-bond free surface, the deposition of dielectrics by atomic layer deposition (ALD) on 2D materials is usually characterized with nonuniform nucleation and island formation, producing a highly porous dielectric layer with serious leakage particularly at the small equivalent oxide thickness (EOT) limit. Here, we report the robust ALD of highly uniform high-κ dielectric on 2D semiconductors by using ~0.3 nm-thick exclusively monolayer molecular crystal as seeding layer. Ultrathin dielectrics down to 1 nm EOT is realized on graphene, MoS2 and WSe2, with considerably reduced roughness, density of interface states, leakage current and improved breakdown field compared to prior methods. Taking advantage of the reduced EOT, we demonstrate graphene RF transistors operating at 60 GHz, as well as MoS2 and WSe2 complementary metal-oxide-semiconductor (CMOS) transistors with Vdd =0.8 V and ideal subthreshold swing (SS) of 60 mV/dec, 20 nm-channel-length MoS2 transistors with on/off ratio over 107. These studies highlight that our dielectric integration method is generally applicable for different 2D materials, and compatible with top-down fabrication process on large-area chemical vapor deposited films. Copyright © 2019, The Authors. All rights reserved.

关键词： Atomic layer deposition

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Transistors: Realization of Room‐Temperature Phonon‐Limited Carrier Transport in Monolayer MoS2by Dielectric and Carrier Screening (Adv. Mater. 3/2016)

引用

Advanced Materials 2016年第3期28卷

作者： Zhihao Yu Zhun‐Yong Ong Yiming Pan Yang Cui Run Xin Yi Shi Baigeng Wang Yun Wu Tangsheng Chen Yong‐Wei Zhang Gang Zhang Xinran Wang National Laboratory of Solid State Microstructures School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures Nanjing University Nanjing 210093 P. R. China Institute of High Performance Computing 1 Fusionopolis Way Singapore 138632 Singapore National Laboratory of Solid State Microstructures School of Physics Nanjing University Nanjing 210093 P. R. China Science and Technology on Monolithic Integrated Circuits and Modules Laboratory Nanjing Electronic Device Institute Nanjing 210016 P. R. China

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