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Full-Coverage Mapping of Daily High-Resolution XCO2 across China from 2015 to 2020 by Deep Learning-Based Spatio-Temporal Fusion

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IEEE Transactions on Geoscience and Remote Sensing 2025年

作者： Li, Yi Yan, Jining Zhong, Liheng Bao, De Sun, Leigang Li, Guangyu China University of Geosciences School of Computer Science Wuhan430074 China Ministry of Education Engineering Research Center of Natural Resource Information Management and Digital Twin Engineering Software Wuhan430074 China Ant Group World Financial Center Beijing100020 China Hebei Academy of Sciences Institute of Geographical Sciences Shijiazhuang050011 China Hebei Technology Innovation Center for Geographic Information Application Shijiazhuang050011 China Environmental Development Center of the Ministry of Ecology and Environment China

Carbon neutrality has become a global priority, and high spatio-temporal resolution data on the column-average dry-air mole fraction carbon dioxide (XCO2) is essential for tracking progress and guiding policy adjustments. However, satellite-derived XCO2 exhibits significant temporal and spatial gaps due to influences such as orbital dynamics and cloud cover. Additionally, the low spatial resolution of CarbonTracker (CT) is insufficient to meet the current demands for fine-scale monitoring. Current XCO2 assessment methods often rely solely on single-pixel data, overlooking the spatio-temporal correlations. In this article, we introduce a deep learning-based spatio-temporal model (DSTM) that extracts features from multiple data sources related to atmospheric transport, carbon emissions, and carbon sinks, enabling fine-scale XCO2 assessments. Additionally, XCO2 data from the Orbiting Carbon Observatory-2 (OCO-2) and CT were fused at a 0.1° spatial resolution to generate training labels with broader coverage and more samples, serving as fitting labels. Our approach produced daily, full-coverage 0.1° resolution XCO2 maps for China from 2015 to 2020, and analyzed changes in XCO2 growth trends over this period. Numerical results show that our model outperforms traditional deep learning methods. Model validation using data from four ground-based observation sites of the Total Carbon Column Observing Network (TCCON) achieved an average R2 of 0.86 and an RMSE of 2.67 ppm. The extraction and fusion of spatio-temporal features from multiple data sources provide a novel approach for reconstructing missing XCO2 data. © 1980-2012 IEEE.

关键词： Atmospheric movements

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Research on Point Cloud Registration Based on Key Points and Matching Point Pairs Algorithm

Research on Point Cloud Registration Based on Key Points and...

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IEEE International Symposium on Geoscience and Remote Sensing (IGARSS)

作者： Zhonghua Su Guiyun Zhou Hao Tang Yi Yuan Jiawei Liao Wandong Yu Xukun Lu Li Lv School of Computer and Software Engineering Xihua University Chengdu China School of Resources and Environment University of Electronic Science and Technology of China Chengdu China Sichuan Provincial Public 7 Security Department Communications and Information Technology Headquarters Chengdu China Xinjiang Xintou Energy Development Co. Ltd Urumqi China College of Electrical and Engineering Hunan University Changsha China Sichuan Institute of Geological Engineering Investigation Group Co Ltd Chengdu China

ISBN: (数字)9798350360325

ISBN: (纸本)9798350360332

Point cloud registration is a prominent topic in computer vision research, with applications including target identification, 3D reconstruction, SLAM, and others. The capture of key points and matching point pairs has evolved into a critical technology for point cloud registration. In this paper, we propose an approach that extracts key points using the Intrinsic Shape Signature (ISS) algorithm. Additionally, we combine the Fast Point Feature Histograms (FPFH) descriptor with curvature to obtain matching point pairs, thereby establishing a solid foundation for point cloud registration. The experiment shows that, compared to the 3D-SIFT technique, the key points derived by the ISS algorithm have a more uniform distribution. Moreover, our proposed combination of the FPFH descriptor with curvature extracts matching point pairs more effectively than using the FPFH descriptor alone.

关键词： Point cloud compression Histograms Computer vision Three-dimensional displays Simultaneous localization and mapping Accuracy Shape

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Vulnerability Name Prediction Based on Enhanced Multi-Source Domain Adaptation

Vulnerability Name Prediction Based on Enhanced Multi-Source...

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IEEE International Conference on Trust, Security and Privacy in Computing and Communications (TrustCom)

作者： Ying Xing Mengci Zhao Bin Yang Yuwei Zhang Wenjin Li Jiawei Gu Jun Yuan Lexi Xu School of Artificial Intelligence Beijing University of Posts and Telecommunications Beijing China Key Laboratory for Safety-Critical Software Development and Verification Nanjing University of Aeronautics and Astronautics Ministry of Industry and Information Technology Nanjing China Yunnan Key Laboratory of Software Engineering Yunnan China China Unicom Research Institute Beijing China School of Computer Science Peking University Beijing China NSFOCUS Technologies Group Co. Ltd. Beijing China

ISBN: (数字)9798350381993

ISBN: (纸本)9798350382006

software products have brought convenience to modern society but also pose significant security risks due to various types of vulnerabilities. Identifying vulnerability names is vital for program repair and software maintenance, but the lack of training data presents a challenge. Big data analytics and machine learning can help overcome this challenge by processing large amounts of data and improving the accuracy of vulnerability name prediction. Considering that the data is often from datasets composed of multiple sources, a feature-based or attention-based multi-source domain adaptation (MSDA) approach is required. In this paper, we propose an MSDA method based on both feature and attention to accomplish the task of predicting vulnerability names, called Multi-Source Domain Adaptation for Vulnerability Name Prediction (MSDA-VNP). First, MSDA-VNP reduces domain divergence by adversarial training and then uses domain-invariant features to obtain feature correlations between individual source and target domains. In combination with the obtained domain correlations, Weighted multi-kernel Maximum Mean Discrepancy (WMK-MMD) is proposed as the attention mechanism. Second, a data augmentation strategy is employed to enhance MSDA-VNP to identify privacy-related vulnerabilities. To evaluate our approach, we conducted experiments on eight Java real-world projects in the software Assurance Reference Dataset (SARD). The experimental results show that the proposed method MSDA-VNP performed efficiently and stably for the 44 types of vulnerabilities involved. The data augmentation strategy has also been proved to be effective as an enhancement for the proposed method MSDA-VNP.

关键词： Training software maintenance Java Data privacy Correlation Training data Maintenance engineering

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A Novel FOPLP Structure with Chip First & RDL First Process for Automotive chip application

A Novel FOPLP Structure with Chip First & RDL First Process ...

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Electronic Components and technology Conference (ECTC)

作者： Terry Wang Chih Wei Lu Eric Feng Yu-Jhen Yang Cheng-Yueh Chang Pei-Pei Cheng Fredrick Lie Austin Cheng Hsin-Yi Huang Meiten Koh Aneta Wiatrowska Łukasz Witczak Electonic and OptoelectronicSystem Research Laboratories (EOSL) Industrial Technology Research Institute (ITRI) Hsinchu Taiwan Digital Lithography Group (DLG) Applied Materials Inc. Santa Clara CA USA Equipment Development Business Unit Software Development Department FAVITE Inc. Hsinchu Taiwan R & D Electronic Chemicals Business Unit Everlight Chemical Industrial Corp. Hsinchu Taiwan TAIYO INK MFG. CO. LTD Saitama Japan XTPL S.A. Wrocław Poland

ISBN: (数字)9798350375985

ISBN: (纸本)9798350375992

Based on the requirements of high-end automotive IC packaging, multiple active and/or passive sub-components interconnected to create a single complex circuit within a single Multi-Chip Module (MCM) package is a big trend for enhancing Autonomous Driving (AD) performance. In order to enhance performance and reduce cost of mass production, the panel-level package (PLP) is better choice than wafer-level package (WLP). In this study, ITRI has successfully demonstrated a novel FOPLP structure with Chip First & RDL First Process for automotive chip application.

关键词： Printing Mass production Lithography Integrated circuit interconnections Glass Packaging Market research

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A conceptual framework for SPI evaluation

arXiv

引用

arXiv 2023年

作者： Unterkalmsteiner, Michael Gorschek, Tony Islam, A.K.M. Moinul Cheng, Chow Kian Permadi, Rahadian Bayu Feldt, Robert Software Engineering Research Lab School of Computing Blekinge Institute of Technology KarlskronaSE-371 79 Sweden Software Engineering: Process and Measurement Research Group Department of Computer Science University of Kaiserslautern PO Box 3049 Kaiserslautern67653 Germany General Electrics Healthcare Healthcare IT. Munzinger Straße 5 Freiburg79111 Germany Amadeus S.A.S. Product Marketing and Development 485 Route du Pin Montard Boite Postale 69 Sophia Antipolis06902 Cedex France

software Process Improvement (SPI) encompasses the analysis and modification of the processes within software development, aimed at improving key areas that contribute to the organizations’ goals. The task of evaluating whether the selected improvement path meets these goals is challenging. Based on the results of a systematic literature review on SPI measurement and evaluation practices, we developed a framework (SPI-MEF) that supports the planning and implementation of SPI evaluations. SPI-MEF guides the practitioner in scoping the evaluation, determining measures and performing the assessment. SPI-MEF does not assume a specific approach to process improvement and can be integrated in existing measurement programs, refocusing the assessment on evaluating the improvement initiative’s outcome. Sixteen industry and academic experts evaluated the framework’s usability and capability to support practitioners, providing additional insights that were integrated in the application guidelines of the framework. Copyright © 2013 John Wiley & Sons, Ltd. © 2023, CC BY-NC-SA.

关键词： software design

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Integrated Problem Solving Environment for HPC and Cloud Computing Platforms

Integrated Problem Solving Environment for HPC and Cloud Com...

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International Conference on Smart Systems and Inventive technology (ICSSIT)

作者： B. Arunachalam Manavalan N. Gopalakrishnan System Software Development Group Centre for Development of Advanced Computing Bangalore India National Institute of Technology Tiruchirappalli India

ISBN: (数字)9781728158211

ISBN: (纸本)9781728158228

The increasing data resources from multiple sensors challenges the researchers in developing a standard job submission framework that can be readily used over an HPC cluster and cloud environment. Developing a framework will be of great use to small computing labs, where the availability of HPC resources is limited. In addition to this, the issues such as network failure, software dependencies, etc. also hinder the nature and processing duration of the simulations. Resolving any such system-centric factor is out of the scope in many applications. In this regard, this article addresses the need for developing a problem-solving framework that can integrate the available HPC and cloud resources. Furthermore, the impact happens due to the network failure, non-availability of remote HPC clusters and delay in deriving the critical results that can be reduced to a major extent.

关键词： Computational modeling Cloud computing Real-time systems Predictive models Data models Problem-solving Middleware

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Int-Ball2: ISS JEM Internal Camera Robot with Increased Degree of Autonomy – Design and Initial Checkout

Int-Ball2: ISS JEM Internal Camera Robot with Increased Degr...

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Space Robotics (iSpaRo), International Conference on

作者： Seiko P. Yamaguchi Tatsuya Yamamoto Hideyuki Watanabe Riichi Itakura Masaru Wada Shinji Mitani Daichi Hirano Keisuke Watanabe Taisei Nishishita Yuta Kawai Shota Inoue Yusuke Arai Keiji Hagiwara Yuya Shimoda Masayuki. Yamamoto Kazuko Hagiwara Soki Kuga Ikujiro Ao Hideaki Kikuchi Human Spaceflight Technology Directorate Japan Aerospace Exploration Agency (JAXA) Tsukuba Japan Research and Development Directorate JAXA Tsukuba Japan Systems Engineering Consultants Co. Ltd. Tokyo Japan MEISEI ELECTRIC Co. Ltd. Isesaki Japan WEL Research Co. Ltd. Ichihara Japan Mitsubishi Electric Software Corporation Tokyo Japan ACSL Ltd. Tokyo Japan AstreX Group Tokyo Japn

ISBN: (数字)9798350367232

ISBN: (纸本)9798350367249

Int-Ball2 is a camera robot applied into the Japan Experimental Module (JEM or "Kibo") on the International Space Station (ISS) to support astronauts and ground control in space station operations. Astronauts conduct various tasks within their limited time allotments. Thus, effective cooperation with ground control is crucial. Astronauts currently spend a significant amount of time on video shooting and camera setup. Int-Ball (JEM Internal Ball Camera Robot) aims to do those tasks with a remote-controlled camera drone remotely operated from the ground. The first model of Int-Ball was launched and tested on the ISS in 2017. The upgraded Int-Ball2 was developed and launched in 2023 based on the test results. This paper presents a design overview and the initial checkout highlights of the Int-Ball2 on the ISS.

关键词： Space vehicles Robot vision systems Aerospace electronics Cameras International Space Station Space exploration Planetary orbits

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Empowering software Startups with Agile Methods and Practices: A Design Science Approach

SSRN

引用

SSRN 2022年

作者： Gandomani, Taghi Javdani Nafchi, Mina Ziaei Parizi, Reza M. Department of Computer Science Shahrekord University Shahrekord Iran CHB Science and Technology Park Shahrekord Iran Data Science Research Group Department of Computer Science Shahrekord University Shahrekord Iran Department of Software Engineering and Game Development Kennesaw State University MariettaGA30060 United States

In recent years, the number of software startups is increasing rapidly and employing a proper software development methodology in these startups is a concern. Recently, these startups have been using agile software development methodologies and practices. However, due to the special conditions of these startups and the focus on producing the Minimum Viable Product, it seems that the use of these methodologies and practices is not done correctly. Accordingly, these startups face more severe challenges, making their success more difficult. The literature review shows that few studies have been done regarding the correct methods of using agile methods and practices in software startups. This research has used Design Science Research Methodology (DSRM) to fill this research gap and develop agile adaptation guidelines in software startups. The developed guidelines were validated with the participation of 23 experts from 7 software startup teams through survey questionnaires and open discussion. Eventually, final guidelines containing 13 recommendations were developed in three categories: selection of agile methods and practices, preparation for adaptation, and application and adaptation of agile methods and practices. The evaluation results show the simplicity of understanding these guidelines, their usefulness, and their support for the expected agility of the software development process. © 2022, The Authors. All rights reserved.

关键词： software design

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Evaluation and Measurement of software Process Improvement - A Systematic Literature Review

arXiv

引用

arXiv 2023年

作者： Unterkalmsteiner, Michael Gorschek, Tony Islam, A.K.M. Moinul Cheng, Chow Kian Permadi, Rahadian Bayu Feldt, Robert Software Engineering Research Lab School of Computing Blekinge Institute of Technology KarlskronaSE-371 79 Sweden Software Engineering: Process and Measurement Research Group Department of Computer Science University of Kaiserslautern PO Box 3049 Kaiserslautern67653 Germany General Electrics Healthcare Healthcare IT Munzinger Straße 5 Freiburg79111 Germany Amadeus S. A. S. Product Marketing and Development 485 Route du Pin Montard Boite Postale 69 Sophia Antipolis 06902 Cedex France

BACKGROUND—software Process Improvement (SPI) is a systematic approach to increase the efficiency and effectiveness of a software development organization and to enhance software products. OBJECTIVE—This paper aims to identify and characterize evaluation strategies and measurements used to assess the impact of different SPI initiatives. METHOD—The systematic literature review includes 148 papers published between 1991 and 2008. The selected papers were classified according to SPI initiative, applied evaluation strategies and measurement perspectives. Potential confounding factors interfering with the evaluation of the improvement effort were assessed. RESULTS—Seven distinct evaluation strategies were identified, whereas the most common one, "Pre-Post Comparison", was applied in 49% of the inspected papers. Quality was the most measured attribute (62%), followed by Cost (41%) and Schedule (18%). Looking at measurement perspectives, "Project" represents the majority with 66%. CONCLUSION—The evaluation validity of SPI initiatives is challenged by the scarce consideration of potential confounding factors, particularly given that "Pre-Post Comparison" was identified as the most common evaluation strategy, and the inaccurate descriptions of the evaluation context. Measurements to assess the short and mid-term impact of SPI initiatives prevail, whereas long-term measurements in terms of customer satisfaction and return on investment tend to be less used. © 2023, CC BY-NC-SA.

关键词： Customer satisfaction

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Panel Level Interposer by Using Glass Carrier for 2.5D Advance IC Package Application

Panel Level Interposer by Using Glass Carrier for 2.5D Advan...

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Electronic Components and technology Conference (ECTC)

作者： Terry Wang Cheng-Yueh Chang William Yang Yu-Jhen Yang Pei-Pei Cheng Chien-Ming Tseng Hungyu Wu Austin Cheng Hsin-Yi Huang Meiten Koh Chi-hua Huang Kent Chen Electonic and OptoelectronicSystem Research Laboratories (EOSL) Industrial Technology Research Institute (ITRI) Hsinchu Taiwan ROC Digital Lithography Group (DLG) Applied Materials Inc. Santa Clara CA USA Software Development Department Equipment Development Business Unit FAVITE Inc. Hsinchu Taiwan ROC R & D Electronic Chemicals Business Unit Everlight Chemical Industrial Corp. Hsinchu Taiwan ROC TAIYO INK MFG. CO. LTD Saitama Japan R & D Alliance Material Co. Ltd. Taiwan ROC SEMI R&D Division CSUN MFG. LTD Taiwan ROC

ISBN: (数字)9798331539320

ISBN: (纸本)9798331539337

In response to the demands of advanced IC packaging, the interconnection of multiple active and/or passive sub-components to form a single complex circuit within a Multi-Chip Module (MCM) package has become a significant trend for improving artificial intelligence (AI) performance. To boost performance and lower mass production costs, panel-level packaging (PLP) is preferred over wafer-level packaging (WLP). This study highlights that ITRI has successfully showcased the potential of FOPLP using the RDL First and Chip First processes for applications involving panel-level interposers.

关键词： Mass production Layout Process control Integrated circuit interconnections Electronic components Glass Packaging Market research Wafer scale integration Integrated circuit packaging

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