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检索条件"机构=Sort Test Technology Development"

共 14 条记录，以下是1-10 订阅

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test Complexity in the Semiconductor Landscape

Test Complexity in the Semiconductor Landscape

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VLSI test Symposium

作者： Suma Ayyagari Sort Test Technology Development Intel Corporation Chandler AZ USA

ISBN: (数字)9798331521448

ISBN: (纸本)9798331521455

As semiconductor technology advances, the complexity of integrated circuits and the introduction of innovative packaging technologies present significant challenges for test processes. This paper provides an overview of the test methodologies used to ensure functionality, performance, and reliability across the product lifecycle. We explore how emerging packaging technologies; such as 2.5D, 3D stacking, and advanced system-in-package (SiP) approaches; complicate traditional test strategies due to increased interconnect density, heterogeneous integration, and thermal management concerns. Furthermore, we discuss the evolving landscape of test, including the adoption of design-for-test (DFT), Automated test Equipment (ATE), Built-In Self-test (BIST), and Over-the-Air (OTA) testing techniques to address these complexities. The paper concludes with insights into future test methodologies, highlighting the need for adaptive, cost-efficient, and high-coverage solutions to meet the demands of next-generation semiconductor devices. This paper aims to equip industry and academic professionals with a comprehensive understanding of current challenges and emerging trends shaping the future of semiconductor testing.

关键词： Industries Three-dimensional displays Wireless networks Stacking Multichip modules Built-in self-test Market research Complexity theory Next generation networking testing

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Scaling Solder Micro-Bump Interconnect Down to $10\ \mu\mathrm{m}$ Pitch for Advanced 3D IC Packages

Scaling Solder Micro-Bump Interconnect Down to $10\ \mu\math...

引用

Electronic Components and technology Conference (ECTC)

作者： Zhaozhi Li Yoshihiro Tomita Adel A. Elsherbini Pilin Liu Holly A. Sawyer Johanna M. Swan Shawna M. Liff Assembly & Test Technology Development Intel Corporation Chandler AZ USA Components Research Intel Corporation Chandler AZ USA Corporate Quality Network Intel Corporation Chandler AZ USA Fab Sort Manufacturing Intel Corporation Hillsboro OR USA

This paper discusses the efforts to shrink the micro-bump pitch to $20\ \mu\mathrm{m}$ and then $10\ \mu\mathrm{m}$ with solder micro-bumps for silicon-on-silicon 3D assembly by leveraging alternate solder diffusion barrier metals and tuning the assembly process to realize both good yield and reliable interconnects. Specifically in this paper, the assembly process challenges are detailed and the impact of our barrier metal assessment and process optimization to resolve these technical challenges are discussed through the study of solder joint reliability results using internal $20 \mu \mathrm{m}$ pitch and $10\ \mu\mathrm{m}$ pitch solder micro-bump test-vehicles (TV).

关键词： Electromigration Three-dimensional displays Aging Nickel Reliability Isothermal processes Soldering

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Direct liquid cooling of bare die packages using a microchannel cold plate

Direct liquid cooling of bare die packages using a microchan...

引用

Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM)

作者： Tolga Acikalin Chris Schroeder Sort & Test Technology Development Assembly & Test Technology Development Chandler Arizona Intel Labs Santa Clara California

A stainless steel direct liquid contact microchannel cold plate is investigated for the thermal management of bare die packages. Experiments are conducted for a prototype microchannel cold plate in contact with a 1.18cm 2 uniformly heated thermal test vehicle. The junction-to-fluid thermal resistance is measured to be 0.21°C/W for a water flow rate of 1 L/min thru the cold plate. Dynamic thermal characterization of the microchannel cooling solution has also been conducted and compared against static models to predict temperature response from a dynamic power profile.

关键词： Microchannels Temperature sensors Cold plates Temperature measurement Thermal resistance Vehicles

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Multiport VNA Measurement Uncertainty - Signal Integrity Applications

Multiport VNA Measurement Uncertainty - Signal Integrity App...

引用

IEEE International Symposium on Electromagnetic Compatibility(EMC 2011)

作者： Brett Grossman Michael Peterson Jose Torres Sort Test Technology Development Intel Corporation Hillsboro Oregon USA Sort Test Technology Development Intel Corporation Chandler Arizona USA

ISBN: (纸本)9781457708121;9781457708114;9781424447831

Vector network analyzer (VNA) measurements are often stated without an indication of the estimated uncertainty. Understanding the uncertainty can lead to understanding the sources of uncertainty and targeting improvements in the metrology to address the largest sources. Connector repeatability in manually probed measurements can be a primary source of uncertainty with this metrology. A measurement capability assessment provides the method for evaluating the total uncertainty. Evaluation of the probe launch and cable movement provided substantial opportunities to improve the capability. Implementing improvements identified through the measurement capability assessment (MCA) process has resulted in a doubling of the highest frequency where the metrology is deemed capable.

关键词： metrology Vector network analysers primary power Uncertainty Signal integrity multiport measurement uncertainty

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Paper study on thermal conductivity of Al2O3 thin film of different thicknesses on copper substrate under different contact pressures

Paper study on thermal conductivity of Al2O3 thin film of di...

引用

IEEE Symposium on Industrial Electronics & Applications (ISIEA)

作者： K. Dinash D. Mutharasu Y.T. Lee Nano Opto Electronics Laboratory (NOR) School of Physics Universiti Sains Malaysia Penang Malaysia Sort Test Technology Development Intel Sdn. Bhd (Kulim) Kedah Malaysia

Thermal interface resistance of solids is an important factor for heat conduction from one solid to another. Interface resistance disrupts heat flow in systems like CPUs and various solid state devices like LEDs. Interface materials play an important role in heat transport through interface. In this study, Al 2 O 3 with different thickness was coated on a copper substrate. The overall thermal conductivity of the material is measured at different contact pressures. It was observed that overall thermal conductivity of the system was affected by thickness of the Al 2 O 3 . It was also observed that the overall thermal conductivity increases with increasing pressure.

关键词： Thermal conductivity Conductivity Heating Materials Resistance Copper Heat sinks

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Thermal measurements of two layered thin films of different orders on copper

Thermal measurements of two layered thin films of different ...

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IEEE Symposium on Industrial Electronics & Applications (ISIEA)

作者： K. Dinash D. Mutharasu Y.T Lee Nano Opto Electronics Laboratory (NOR) School of Physics Universiti Sains Malaysia Penang Malaysia Sort Test Technology Development Intel Sdn. Bhd (Kulim) Kedah Malaysia

Thermal interface resistance of solids is an important factor for heat conduction from one solid to another. Interface resistance disrupts heat flow in systems like CPUs and various solid state devices like LEDs. Interface materials play an important role in heat transport through an interface. In this study, TiN/Ti with different Ti thickness and Ti/TiN was coated on a copper substrate. In general all samples show increase in overall thermal conductivity as pressure was increased. The overall thermal conductivity of the material is measured at different contact pressures. It was observed that by switching the order of the coating, overall thermal conductivity changed drastically. It was also observed that thermal conductivity of the sample reduced when coating thickness was reduced.

关键词： Materials Thermal conductivity Conductivity Heating Resistance Copper Tin

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Design of a data recovery block for communications over power distribution networks of microprocessors

Design of a data recovery block for communications over powe...

引用

2008 4th IEEE International Conference on Circuits and Systems for Communications, ICCSC

作者： Chawla, Vipul Thirugnanam, Rajesh Dong, Sam Ha Mak, T.M. Lab. Department of Electrical and Computer Engineering Virginia Tech Blacksburg VA 24061 United States Sort Test Technology Development Santa Clara CA 95054 United States

ISBN: (纸本)9781424417087

We proposed the use of power distribution network (PDN) of a microprocessor for ubiquitous access of internal nodes for test/debug and showed the suitability of impulse ultra-wideband (UWB) communications for the purpose. This paper presents design of a data recovery block to recover data from UWB impulses superposed on a power line of a microprocessor. Considerations for data recovery block design based upon measured PDN characteristics have been discussed. The proposed circuit was implemented in TSMC 0.18 um CMOS process, and simulations show that it consumes 4.42 mW when operating from a 1.8V supply and at a pulse repetition rate of 200 MHz. ©2008 IEEE.

关键词： Pulse repetition rate

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Design of a Data Recovery Block for Communications over Power Distribution Networks of Microprocessors

Design of a Data Recovery Block for Communications over Powe...

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IEEE International Conference on Circuits and Systems for Communications (ICCSC)

作者： Vipul Chawla Rajesh Thirugnanam Dong Sam Ha T. M. Mak Department of Electrical and Computer Engineering Virginia Technology Virginia Technology VLSI for Telecommunications Laboratory Blacksburg VA USA Sort Test Technology Development Santa Clara CA USA

We proposed the use of power distribution network (PDN) of a microprocessor for ubiquitous access of internal nodes for test/debug and showed the suitability of impulse ultra-wideband (UWB) communications for the purpose. This paper presents design of a data recovery block to recover data from UWB impulses superposed on a power line of a microprocessor. Considerations for data recovery block design based upon measured PDN characteristics have been discussed. The proposed circuit was implemented in TSMC 0.18 um CMOS process, and simulations show that it consumes 4.42 mW when operating from a 1.8 V supply and at a pulse repetition rate of 200 MHz.

关键词： Power systems Microprocessors Programmable control Circuit noise Circuit testing Power line communications Low-frequency noise Frequency Automatic testing Routing

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Comparison of multi-port VNA architectures-Measured results 68

Comparison of multi-port VNA architectures-Measured results

引用

68th ARFTG Conference on Measurement for Emerging Technologies, ARFTG 2006

作者： Ruttan, Thomas Grossman, Brett Fledell, Evan Assembly Technology Development Organization Within Intel Corporation HillsboroOR97124 United States Sort Test Technology Development Organization Within Intel Corporation HillsboroOR97124 United States

ISBN: (纸本)1424406765

Multi-port vector network analyzers (VNA) have become important measurement tools for the characterization of high frequency/high speed computer system and communications interconnects. These systems utilize many parallel channels of differential transmission lines to carry the high bandwidth data between devices. The need to measure the differential transmission line and crosstalk characteristics of these structures has driven the need for 4, 8, and 12 ports on microwave VNA's. 4-port VNA's have been commercially available for some time to address part of this need. In order to avoid additional complexity and cost these early architectures are unable to utilize the more recent, non-redundant calibration algorithms. These faster, more flexible algorithms can reduce the calibration and measurement time for multi-port devices at some cost to measurement accuracy. Through the evaluation of commercial verification devices after multiple calibrations, this paper illustrates that by comparing algorithms across two 4-port architectures, this compromise in accuracy may not be significant when compared to the savings in time and fewer standard connections. © 2006 IEEE.

关键词： Calibration

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Comparison of multi-port VNA architectures — Measured results

Comparison of multi-port VNA architectures — Measured resul...

引用

ARFTG Conference

作者： Thomas Ruttan Brett Grossman Evan Fledell Assembly Technology Development organization within Intel Corporation Hillsboro OR USA Sort Test Technology Development organization within Intel Corporation Hillsboro OR USA

关键词： Calibration Standards Transmission line measurements Instruments Microwave measurement Crosstalk Switches

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