TiO films were prepared by custom-made Cathode Multi Arc Ion equipment. Experimental test results reveal that our equipment can easly deposite big area scale TIO, particle size is in nanometer scale .
TiO films were prepared by custom-made Cathode Multi Arc Ion equipment. Experimental test results reveal that our equipment can easly deposite big area scale TIO, particle size is in nanometer scale .
A soft nano-imprint lithography (NIL) technology is approached to fabricate the pore arrays *** results reveal that the proposed process can fabricate highly ordered pore arrays with a low cost.
A soft nano-imprint lithography (NIL) technology is approached to fabricate the pore arrays *** results reveal that the proposed process can fabricate highly ordered pore arrays with a low cost.
Nano-Imprint Lithography (NIL) technology is presented to fabricate Carbon Nano-Tube (CNT) arrays for Field Emission (FE) and sensor devices by process control and optimization. Results reveal that the CNT arrays are ...
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Nano-Imprint Lithography (NIL) technology is presented to fabricate Carbon Nano-Tube (CNT) arrays for Field Emission (FE) and sensor devices by process control and optimization. Results reveal that the CNT arrays are high resolution and fidelity.
A soft imprint lithography(IL) process is presented to fabricate the pixel array pattern for organic lightemitting diodes. In this study, we successfully fabricate the OLED pixel array of sizes from 50μm to 5μm.
A soft imprint lithography(IL) process is presented to fabricate the pixel array pattern for organic lightemitting diodes. In this study, we successfully fabricate the OLED pixel array of sizes from 50μm to 5μm.
TiN films growing, Ti films as interlayers were prepared on AZ91C by CMP equipment. Surface topography,microstructure and hardness of the films were analyzed with high resolution SEM, X-ray EDS and CSM microcharacter ...
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TiN films growing, Ti films as interlayers were prepared on AZ91C by CMP equipment. Surface topography,microstructure and hardness of the films were analyzed with high resolution SEM, X-ray EDS and CSM microcharacter hardness tester.
A nano-imprint lithography (NIL) technology is approached to fabricate the organic hereo-structure of the photovoltaic (PV) device. Experimental results reveal that fabrication of PV devices can improve its power conv...
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A nano-imprint lithography (NIL) technology is approached to fabricate the organic hereo-structure of the photovoltaic (PV) device. Experimental results reveal that fabrication of PV devices can improve its power conversion efficiency.
The article elaborates a set of large-scale automation equipment, which is applicable to the reflector thin deposition of automobile illumination according to the work of our laboratory, and its experimental results a...
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The article elaborates a set of large-scale automation equipment, which is applicable to the reflector thin deposition of automobile illumination according to the work of our laboratory, and its experimental results are also introduced.
Applying modern information management technology to traditional environment field is the sign of making environment protection work modern and the necessitous task that environment protection departments are confront...
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An online semi-supervised active learning algorithm is proposed, which is based on self-organizing incremental neural network (SOINN). The proposed method do not need any priori knowledge such as number of nodes or nu...
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An online semi-supervised active learning algorithm is proposed, which is based on self-organizing incremental neural network (SOINN). The proposed method do not need any priori knowledge such as number of nodes or number of classes; it can automatically learn number of nodes and teacher vectors needed by the current task; It can realize online incremental learning even life-long learning. The experiments for artificial data and real world data show that the proposed method works efficiently.
Anisotropic conductive adhesive technology for electronics packaging and interconnect application has significantly been developed during the last few years. It is time to make a summary of what has been done in this ...
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Anisotropic conductive adhesive technology for electronics packaging and interconnect application has significantly been developed during the last few years. It is time to make a summary of what has been done in this field. The present paper reviews the technology development, especially from the reliability point of view. It is pointed out that anisotropic conductive adhesives are now widely used in many applications and the reliability data and models have been developed to a large extent for anisotropic conductive adhesives in various applications.
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