We report a simulation study of the characteristics of a new tunnel field effect transistor (TFET), i.e., vertical TFET (VTFET). The new VTFET has a different working principle compared with the traditional lateral TF...
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In this paper, graphene oxide (GO) was modified in-situ on an electrochemical electrode array for attachment of protein. GO suspension made from natural graphite flakes was directly dip-coated onto the Au working elec...
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The characteristics of PNIN tunneling field effect transistor (TFET) with nanometer sizes are investigated using TCAD simulation. The results show that the performance and variations of the device strongly depends on ...
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An important trend of the modern mobile device is that a single user terminal that will be capable of receiving signals of multiple different transmission standards. Most of these transmission standards employ a forwa...
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In this paper, we systematically study the positive gate leakage current in AlGaN/GaN metal-oxide-semiconductor high electron-mobility transistors (MOS-HEMTs) with HfO 2 dielectric using atomic layer deposition (ALD)....
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In this paper, we systematically study the positive gate leakage current in AlGaN/GaN metal-oxide-semiconductor high electron-mobility transistors (MOS-HEMTs) with HfO 2 dielectric using atomic layer deposition (ALD). We observe that the incorporated nitrogen ions will improve the positive gate leakage current of devices obviously, but do not change the reverse gate leakage current. The passivation mechanism of nitrogen ions in oxygen vacancies in HfO 2 is studied by first-principles calculations. It is shown that the gap states of HfO 2 caused by oxygen vacancies increase the positive gate leakage current of MOS-HEMTs. Nitrogen ions passivate the gap states of HfO 2 and decrease the positive gate leakage current but do not effect the reverse gate leakage current.
A novel two-dimensional photonic crystal (PC) contained azobenzene crosslinked liquid-crystalline polymers (CLCPs) was fabricated by using the nanoimprinting technique. In accordance with the deformations induced by t...
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The origin of the on-state current (Ion) difference between dopant-segregated Schottky (DSS) source/drain MOSFET and conventional MOSFET with 20nm channel length is investigated by device simulation. The simulation re...
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High-frequency ultrasonic transducer arrays are essential for high resolution imaging in clinical analysis and Non-Destructive Evaluation (NDE). However, the structure design and fabrication of the kerfed ultrasonic a...
High-frequency ultrasonic transducer arrays are essential for high resolution imaging in clinical analysis and Non-Destructive Evaluation (NDE). However, the structure design and fabrication of the kerfed ultrasonic array is quite challenging when very high frequency (≥ 100 MHz) is required. Inductively Coupled Plasma (ICP) deep etching process is used to etch 36°/Y-cut lithium niobate (LiNbO3) crystals. Furthermore, a finite element tool, COMSOL, is employed to calculate the electrical properties of the arrays, including crosstalk effect and electrical impedance. At last, arrays with a pitch of 40 μm are fabricated and characterized by a network analyzer. The measured results agree well with the theoretical predictions.
High-frequency ultrasonic array transducers are essential for high resolution imaging in clinical analysis and Non Destructive Evaluation (NDE). However, the fabrication of piezoelectric array transducers is a great c...
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ISBN:
(纸本)9781467345613
High-frequency ultrasonic array transducers are essential for high resolution imaging in clinical analysis and Non Destructive Evaluation (NDE). However, the fabrication of piezoelectric array transducers is a great challenge due to the small features in elaborating piezoelectric array films. This paper describes a MEMS based self-aligned mask-free process for fabrication of ZnO linear array transducers of more than 100MHz. A four-step-rotation deposition approach is proposed and investigated, that improves the lateral growth in ZnO array deposition. The ratio of vertical to lateral growth is improved by 40% compared to one-step deposition method. The results prove that the reduction of the lateral growth helps to achieve full-kerfed ZnO array with smaller pitch.
In this work, complex 3D ferroelectric nanostructures on Poly(vinylidenefluoride-trifluoroethylene), P(VDF-TrFE), films have successfully been fabricated using a special hot-embossing process with two sequential shots...
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