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检索条件"机构=State Key Laboratory of ASIC and System Department of Microelectronics"
997 条 记 录,以下是971-980 订阅
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A novel technique for behavioral modeling of the second generation switched-current building block circuits
A novel technique for behavioral modeling of the second gene...
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International Conference on asic
作者: X. Zeng W. Wang J.L. Shi P.S. Tang ASIC & System State Key Laboratory Microelectronics Department Fudan University Shanghai China
The proposed models are capable of capturing not only the ideal behavior of switched-current circuits, but also the non-ideal behavior, which includes the charge injection effect, device mismatch effect, and finite ou... 详细信息
来源: 评论
Preparation and properties of (Ba/sub x/Sr/sub 1-x/)TiO/sub 3/ thin film for high density DRAM application
Preparation and properties of (Ba/sub x/Sr/sub 1-x/)TiO/sub ...
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International Conference on Solid-state and Integrated Circuit Technology
作者: Yu-han Xie Yin-yin Lin Ting-ao Tang Department of Microelectronics ASIC & System State Key Laboratory Fudan University Shanghai China
BST thin film is thought as the best candidate to substitute for SiO/sub 2/ thin film in high density DRAM application due to its high dielectric constant and low leakage current property. In this paper, (Ba/sub x/Sr/... 详细信息
来源: 评论
The effect of Pd addition on silicide formation for Ni/Pd bilayers on silicon  6
The effect of Pd addition on silicide formation for Ni/Pd bi...
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6th International Conference on Solid-state and Integrated Circuit Technology, ICSICT 2001
作者: Qu, Xin-Ping Detavernier, C. Meirhaeghe, R.L. Ru, Guo-Ping Li, Bing-Zong Dept. of Microelectronics ASIC and system State key laboratory Fudan University Shanghai 200433 China Dept. of Solid State Science Gent University Krijgslaan B-9000 Gent Belgium
Ni/Pd bilayers were deposited on n-Si [100] substrates and annealed up to 900°C using rapid thermal annealing (RTA). Results show that the nucleation temperature for NiSi2is delayed due to the Id addition. The hi...
来源: 评论
An improved chip level thermal analysis algorithm using BEM
An improved chip level thermal analysis algorithm using BEM
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International Conference on asic
作者: Mingdong Cui Wenqing Zhao Pushan Tang ASIC & System State Key Laboratory Microelectronics Department Fudan University Shanghai China
The increasing number of thermal-related problems in VLSI circuit led to the requirement for more efficient temperature analysis tools. In this paper, we developed an algorithm to calculate temperature profile using B... 详细信息
来源: 评论
An efficient VLSI architecture for 2D-DCT using direct method
An efficient VLSI architecture for 2D-DCT using direct metho...
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International Conference on asic
作者: Bian Li Jian Zeng Xuan Tong Jia Rong Liu Yue ASIC & System State Key Laboratory Microelectronics Department Fudan University Shanghai China
An efficient VLSI architecture for 8/spl times/8 two-dimensional (2D) discrete cosine transform (DCT) is proposed in this paper. It is a folded architecture using direct method. It can compute 2D-DCT of a 12-b 8/spl t... 详细信息
来源: 评论
The Schottky characteristics of Ti/n-GaAs surface-treated by N2plasma  6
The Schottky characteristics of Ti/n-GaAs surface-treated by...
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6th International Conference on Solid-state and Integrated Circuit Technology, ICSICT 2001
作者: Jiang, Yu-Long Ru, Guo-Ping Lu, Fang Li, Bing-Zong Li, Wei Li, Ai-Zhen Department of Microelectronics ASIC and System State Key Lab. Fudan University Shanghai200433 China State Key Laboratory of Applied Surface Physics Fudan University Shanghai200433 China State Key Laboratory of Functional Materials for Informatics Shanghai Institute of Metallurgy Chinese Academy of Sciences Shanghai200050 China
The Schottky characteristics of Ti contacts on n-GaAs surface-treated by N2plasma at different temperature are studied. The capacitance-voltage (C-V) characteristic of the samples surface-treated by N2plasma is far mo...
来源: 评论
Circuit design and implementation for digital temperature and humidity measurement and control
Circuit design and implementation for digital temperature an...
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International Conference on asic
作者: Cao Hui Huang Junnai ASIC & System State Key Lab Microelectronics Department Fudan University Shanghai China
This paper describes a mixed signal, low power circuit design for temperature and humidity measurement and control. Temperature and humidity are sensed using a thermistor sensor and a hygrometer sensor. The theory of ... 详细信息
来源: 评论
Modeling switched-current functional block circuits using VHDL-AMS language
Modeling switched-current functional block circuits using VH...
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International Conference on asic
作者: J.L. Shi X. Zeng ASIC & System State Key Lab Microelectronics Department Fudan University Shanghai China
This paper proposes the behavioral models of the second-generation switched-current functional block circuits using the VHDL-AMS language. The proposed models cannot only characterize the ideal behavior of the SI circ... 详细信息
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Schottky barrier height inhomogeneities of nickel mono-silicide/n-Si contact studied by I-V-T technique
Schottky barrier height inhomogeneities of nickel mono-silic...
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International Conference on Solid-state and Integrated Circuit Technology
作者: Yu-Long Jiang Yun Tian Guo-Ping Ru Yong-Zhao Han Fang Lu Bing-Zong Li Department of Microelectronics ASIC and System State Key Laboratory Fudan University Shanghai China State Key Laboratory of Applied Surface Physics Fudan University Shanghai China
The current-voltage (I-V) characteristics of nickel mono-silicide/n-Si Schottky diodes fabricated at different temperature and measured over a temperature range of 78 to 299 K have been interpreted on the basis of the... 详细信息
来源: 评论
The effect of Pd addition on silicide formation for Ni/Pd bilayers on silicon
The effect of Pd addition on silicide formation for Ni/Pd bi...
收藏 引用
International Conference on Solid-state and Integrated Circuit Technology
作者: Xin-Ping Qu C. Detavernier R.L. Meirhaeghe Guo-Ping Ru Bing-Zong Li Department of Microelectronics ASIC and system State key laboratory Fudan University Shanghai China Department of Solid State Science Gent University Ghent Belgium
Ni/Pd bilayers were deposited on n-Si [100] substrates and annealed up to 900/spl deg/C using rapid thermal annealing (RTA). Results show that the nucleation temperature for NiSi/sub 2/ is delayed due to the Id additi... 详细信息
来源: 评论