Coverage model is the main technique to evaluate the thoroughness of dynamic verification of a Design-under-Verification (DUV). However, rather than achieving a high coverage, the essential purpose of verification is ...
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As the feature size of FPGA shrinks to nanometers, SRAM-based FPGAs are more vulnerable to soft errors. During logic synthesis, reliability of the design can be improved by introducing logic masking effect. In this wo...
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As the feature size of FPGA shrinks to nanometers, SRAM-based FPGAs are more vulnerable to soft errors. During logic synthesis, reliability of the design can be improved by introducing logic masking effect. In this work, we observe that there are a lot of not-fully occupied look-up tables (LUTs) after logic synthesis. Hence, we propose a functional equivalent class based soft error mitigation scheme to exploit free LUT entries in the circuit. The proposed technique replaces not fully-occupied LUTs with corresponding functional equivalent classes, which can improve the reliability while preserve the functionality of the design. Experimental results show that, compared with the baseline ABC mapper, the proposed technique can reduce the soft error rate by 21%, and the critical-path delay increase is only 4.25%.
MPI Alltoall communication is widely used in many high performance computing (HPC) applications. In Alltoall communication, each process sends a distinct message to all other participating processes. In multicore clus...
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The network content security system of Internet information requires a controlling force over information flows which allows the access to some information and prohibits some other information. The complexity of Inter...
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Very large scale integrated circuits typically employ Network-on-Chip (NoC) as the backbone for on-chip communication. As technology advances into the nanometer regime, NoCs become more and more susceptible to permane...
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ISBN:
(纸本)9781424475162
Very large scale integrated circuits typically employ Network-on-Chip (NoC) as the backbone for on-chip communication. As technology advances into the nanometer regime, NoCs become more and more susceptible to permanent faults such as manufacturing defects, device wear-out, which hinder the correct operations of the entire system. Therefore, effective fault-tolerant techniques are essential to improve the reliability of NoCs. Prior work mainly focuses on introducing redundancies, which can't achieve satisfactory reliability and also involve large hardware overhead, especially for data path components. In this paper, we propose fine-grained data path salvaging techniques by splitting data path components, i.e., links, input buffers and crossbar into slices, instead of introducing redundancies. As long as there is one fault-free slice for each component, the router can be functional. Experimental results show that the proposed solution achieves quite high reliability with graceful performance degradation even under high fault rate.
The limited write endurance of phase change random access memory (PRAM) is one of the major obstacles for PRAM-based main memory. Wear leveling techniques were proposed to extend its lifetime by balancing writes traff...
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ISBN:
(纸本)9781450306362
The limited write endurance of phase change random access memory (PRAM) is one of the major obstacles for PRAM-based main memory. Wear leveling techniques were proposed to extend its lifetime by balancing writes traffic. Another important concern that need to be considered is endurance variation in PRAM chips. When different PRAM cells have distinct endurance, balanced writes will result in lifetime degradation due to the weakest cells. Instead of balancing writes traffic, in this paper we propose wear rate leveling (WRL), a variant of wear leveling, to balance wear rates (i.e., writes traffic/edudrance) of cells across the PRAM chip. After investigating writing behavior of applications and endurance variation, we propose an architecture-level WRL mechanism. Moreover, there is an important tradeoff between endurance improvement and swapping data volume. To co-optimize endurance and swapping, a novel algorithm, Max Hyper-weight Rematching, is proposed to maximize PRAM lifetime and minimize performance degradation. Experimental results show 19x endurance improvement to prior Wear Leveling.
Three-dimensional (3D) integration and Network-on-Chip (NoC) are both proposed to tackle the on-chip interconnect scaling problems, and extensive research efforts have been devoted to the design challenges of combinin...
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ISBN:
(纸本)9781424475162
Three-dimensional (3D) integration and Network-on-Chip (NoC) are both proposed to tackle the on-chip interconnect scaling problems, and extensive research efforts have been devoted to the design challenges of combining both. Through-silicon via (TSV) is considered to be the most promising technology for 3D integration, however, TSV pads distributed across planar layers occupy significant chip area and result in routing congestions. In addition, the yield of 3D integrated circuits decreased dramatically as the number of TSVs increases. For symmetric 3D mesh NoC, we observe that the TSVs' utilization is pretty low and adjacent routers rarely transmit packets via their vertical channels (i.e. TSVs) at the same time. Based on this observation, we propose a novel TSV squeezing scheme to share TSVs among neighboring router in a time division multiplex mode, which greatly improves the utilization of TSVs. Experimental results show that the proposed method can save significant TSV footprint with negligible performance overhead.
三维集成电路是通过硅通孔将多个相同或不同工艺的晶片上下堆叠并进行垂直集成的新兴芯片集成技术。通过这种集成,芯片可获得更小的外形尺寸、更高的片上晶体管集成密度、单片上能集成更多的功能模块以及更高的互连性能等显著优点。然而,三维集成电路也带来了诸如TSV电迁移效应等新挑战。本文提出了一种抑制TSV电迁移效应的可靠性设计方法。首先,针对镀铜气泡、绑定非对齐和绑定界面尘埃沾染等TSV缺陷,分析了制造缺陷和电迁移效应之间的关系。通过观察发现,制造缺陷在加剧电迁移效应的同时还会影响TSV的阻值。然后,本文提出了TSV-SAFE(TSV Self-healing architecture For Electro-migration)可靠性设计框架抑制电迁移效应。实验中,本文构建了一个由两层电路组成的3D芯片仿真平台。实验结果表明,采用本文所提出的技术,TSV的平均无故障时间(MTTF)平均增加了70倍,而由此带来的硬件面积开销不超过全芯片面积的1%。
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