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检索条件"机构=State Key Laboratory of Microelectronics Device and Integrated Technology"
704 条 记 录,以下是151-160 订阅
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Compact millimeter-wave air-filled substrate-integrated waveguide crossover employing homogeneous cylindrical lens
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Frontiers of Information technology & Electronic Engineering 2023年 第9期24卷 1366-1374页
作者: Chun GENG Jiwei LIAN Dazhi DING Qian Xuesen College Nanjing University of Science and TechnologyNanjing 210094China School of Microelectronics(School of Integrated Circuits) Nanjing University of Science and TechnologyNanjing 210094China State Key Laboratory of Millimeter Waves Southeast UniversityNanjing 210096China
We propose a new method to design crossovers by employing an embedded homogeneous cylindrical lens(HCL).Compared with traditional crossover designs,this strategy introduces an HCL within the air-filled substrate-integ... 详细信息
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High Short-Circuit Capability and Low-Loss SOI-LIGBT with Double-integrated NMOS
High Short-Circuit Capability and Low-Loss SOI-LIGBT with Do...
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International Conference on Solid-state and integrated Circuit technology
作者: Jialei Tan Jie Wei Jinlong Lu Xindi Liu Gaoqiang Deng Wei Song Pei Guo Bo Zhang Xiaorong Luo State Key Laboratory of Electronic Thin Films and Integrated Devices University of Electronic Science and Technology of China Chengdu China College of Microelectronics Chengdu University of Information Technology Chengdu China
A novel SOI lateral insulated gate bipolar transistor (LIGBT) featuring double-integrated NMOS (DNM) is proposed and investigated. The DNM (MOS1 and MOS2) self-adaptively controls the states of parasitic diode $\mathr... 详细信息
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Novel Heterojunction Field Plate $\beta-\text{Ga}_{2}\mathrm{O}_{3}$ MOSFET with High Breakdown Voltage
Novel Heterojunction Field Plate $\beta-\text{Ga}_{2}\mathrm...
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International Conference on Solid-state and integrated Circuit technology
作者: Xiangnan Li Jie Wei Kai Zhao Linyao Hao Xiaosong Peng Yuxi Wei Renkuan Liu Wei Song Pei Guo Xiaorong Luo State Key Laboratory of Electronic Thin Films and Integrated Devices University of Electronic Science and Technology of China Chengdu China College of Microelectronics Chengdu University of Information Technology Chengdu China
A novel $\beta-\text{Ga}_{2}\mathrm{O}_{3}$ metal-oxide-semiconductor field-effect transistor (MOSFET) featured heterojunction field plate (HFP) is proposed to enhance its breakdown voltage $(BV)$ and reduce specific ... 详细信息
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Impact of Proton Radiation on Zr-Doped HfO2-Based Ferroelectric Memory
SSRN
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SSRN 2024年
作者: Zhu, Xuhao Ma, Yao Bi, Jinshun Xu, Gaobo He, Mu Mei, Fan Yuan, Yihui Li, Shirui Wang, Yulin Zou, Peichun Zhao, Xue Key Laboratory of Microelectronics College of Physics Sichuan University Chengdu610064 China School of Integrated Circuits Key Laboratory of Microelectronics College of Physics Sichuan University Chengdu610064 China School of Integrated Circuits University of Chinese Academy of Sciences Beijing100049 China State Key Laboratory of Fabrication Technologies for Integrated Circuits Institute of Microelectronics of Chinese Academy of Sciences Beijing100029 China Sichuan Xu Mao Micro Technology Co.Ltd China
HfO2-based ferroelectric random access memory (FeRAM) has attracted tremendous attention in the field of data storage. However, the radiation performance and tolerance of FeRAM have not been investigated comprehensive... 详细信息
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tSS-BO: Scalable Bayesian Optimization for Analog Circuit Sizing via Truncated Subspace Sampling
tSS-BO: Scalable Bayesian Optimization for Analog Circuit Si...
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Design, Automation and Test in Europe Conference and Exhibition
作者: Tianchen Gu Jiaqi Wang Zhaori Bi Changhao Yan Fan Yang Yajie Qin Tao Cui Xuan Zeng State Key Laboratory of Integrated Chips and Systems School of Microelectronics Fudan University Shanghai China State Key Laboratory of Scientific and Engineering Computing Academy of Mathematics and Systems Science Chinese Academy of Sciences & University of Chinese Academy of Sciences Beijing China State Key Laboratory of Integrated Chips and Systems School of Information Science and Technology Fudan University Shanghai China
We propose a novel scalable Bayesian optimization method with truncated subspace sampling (tSS-BO) to tackle high-dimensional optimization challenges for large-scale analog circuit sizing. To address the high-dimensio... 详细信息
来源: 评论
Novel Multifunctional Transient Voltage Suppressor technology for Modular EOS/ESD Protection Circuit Designs  35
Novel Multifunctional Transient Voltage Suppressor Technolog...
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35th International Symposium on Power Semiconductor devices and ICs, ISPSD 2023
作者: Qi, Zhao Qiao, Ming Wei, Jingqi Shi, Yonggang Chen, Hongquan Li, Zhaoji Zhang, Bo University of Electronic Science and Technology of China State Key Laboratory of Electronic Thin Films and Integrated Devices Chengdu China Chongqing Institute of Microelectronics Industry Technology Uestc Chongqing China Institute of Electronic and Information Engineering of Uestc in Guangdong Dongguan China Shenzhen Institute for Advanced Study University of Electronic Science and Technology of China Shenzhen China
Transient voltage suppressor (TVS) is a kind of widely-used protection device which can enhance system surge and electrostatic discharge (ESD) robustness in small PCB area. However, different TVS cannot be fabricated ... 详细信息
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Analysis of SiC Damage Associated with Single-Event Gate Oxide Damage
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IEEE Transactions on Nuclear Science 2025年
作者: Qiu, Leshan Bai, Yun Chen, Yan Dong, Zewei Ding, Jieqin Hao, Jilong Tang, Yidan Tian, Xiaoli Liu, Xinyu Institute of Microelectronics of the Chinese Academy of Sciences Beijing100029 China University of Chinese Academy of Sciences School of Integrated Circuits Beijing100049 China Zhuzhou CRRC Times Semiconductor Company Ltd State Key Laboratory of Advance Power Semiconductor Device Zhuzhou412001 China
This paper presents observations of SiC damage related to single-event gate oxide damage in SiC MOSFETs subjected to varying drain biases following heavy-ion irradiation and electrical stress. At low and medium drain ... 详细信息
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On the Reliability and Security Enhancements of Double-RIS Enabled WPC System with Jamming
On the Reliability and Security Enhancements of Double-RIS E...
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IEEE Conference on Wireless Communications and Networking
作者: Jingyu Chen Kunrui Cao Lu Lv Beixiong Zheng Haolian Chi Siwei Tang Danyu Diao School of Information and Communications National University of Defense Technology China State Key Laboratory of Integrated Services Networks Xidian University China School of Microelectronics South China University of Technology China
This paper studies the physical layer security for a double reconfigurable intelligent surface (RIS) aided wireless powered communication system in the presence of an eaves-dropper, where a user acts as friendly jamme... 详细信息
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Two-Dimensional Thermal-Induced Warpage Prediction for Multi-Chiplet Heterogeneous Integration System in Advanced Packaging
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IEEE Transactions on Components, Packaging and Manufacturing technology 2025年
作者: Cao, He Xu, Qinzhi Liu, Jianyun Li, Zhiqiang Wang, Chenghan Ma, Xiaoning An, Kunlong Zhang, Daoqing Sun, Tunan State Key Laboratory of Fabrication Technologies for Integrated Circuits Beijing100029 China EDA Center Institute of Microelectronics of the Chinese Academy of Sciences Beijing100029 China School of Integrated Circuits University of Chinese Academy of Sciences Beijing100049 China Beijing Key Laboratory of Three Dimensional and Nanometer Circuit Design Automation Technology Beijing100029 China
Thermal-induced warpage is a bottleneck problem in advanced packaging technology. In this paper, a new way of predicting the warpage deformation is proposed for multi-chiplet heterogeneous integration system, where th... 详细信息
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LauWS: Local Adaptive Unstructured Weight Sparsity of Load Balance for DNN in Near-Data Processing
LauWS: Local Adaptive Unstructured Weight Sparsity of Load B...
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IEEE International Symposium on Circuits and Systems (ISCAS)
作者: Zixu Li Wang Wang Xin Zhong Manni Li Jiayu Yang Yinyin Lin Guhyun Kim Yosub Song Chengchen Wang Xiankui Xiong State Key Laboratory of Integrated Chips and Systems School of Microelectronics Fudan University Shanghai China Solution Development Division SK Hynix Inc. South Korea State Key Laboratory of Mobile Multimedia Technology ZTE Corporation Shenzhen China
Memory wall issue has become the overwhelming bottleneck of future systems due to the explosive parameter growth and low computing density large language model (LLM). Near-data processing (NDP) could alleviate data tr... 详细信息
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