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10th IEEE International Power Electronics and Motion Control Conference, IPEMC 2024 ECCE Asia

作者： Huang, Xu Sun, Pengju He, Zhiyuan Li, Kaiwei Li, Qiang Chen, Lan Chen, Jian Chongqing University State Key Laboratory of Power Transmission Equipment and System Security and New Technology China Guangdong University of Technology School of Integrated Circuits China Southwest Jiaotong University China

ISBN: (纸本)9798350351330

The GaN device is a high-performance alternative to Si devices in the market. However, concerns have been raised regarding their reliability. This paper characterized their reliability by conducting power cycling test (PCT). The test results reveal that the drain leakage current increases as the device degrades. This observation suggests that the drain leakage current could serve as a potential precursor for estimating the device's lifetime. To verify this, device failure is defined as the leakage current exceeding 5 times the initial. Subsequently, the experimental data were analyzed, revealing that the lifetime distribution follows a Weibull distribution. This indicates that the drain leakage current could serve as a precursor for evaluating the lifetime of GaN devices. Furthermore, by utilizing the Arrhenius relationship, the lifetime of GaN devices under various conditions can be estimated. This discovery presents a novel approach for predicting failure and modeling the lifetime of GaN devices. © 2024 IEEE.

关键词： Reliability

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Research on Longitudinal Ultrasonic Vibration Assisted Flip Chip Bonding Process

Research on Longitudinal Ultrasonic Vibration Assisted Flip ...

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International Conference on (ICEPT) Electronic Packaging technology

作者： Dapeng Liu Jianxin Qiao Longqiu Li Zhi Qiao Bin Zhou Yunkang Su State Key Laboratory of Robotics and System Key Laboratory for Microsystems and Microstructure Manufacturing Harbin Institute of Technology Harbin China School of Mechanical and Electrical Engineering Harbin Institute of Technology Harbin China

ISBN: (数字)9798350353808

ISBN: (纸本)9798350353815

The current flip-chip bonding technology still faces defects such as surface thermal burnout of chips due to excessively high process temperature and significant mechanical stress leading to solder joint fracture and chip damage. This paper proposes a longitudinal ultrasonic-assisted flip-chip bonding process. By introducing ultrasonic vibration of a certain frequency in the bonding direction, stress on the device during the bonding process is reduced, leading to lower bonding temperatures and improved bonding quality and reliability. However, unreasonable ultrasonic bonding parameters may result in the fracture at the bonding interface by hammering effect. Based on the longitudinal ultrasonic-assisted bonding experimental platform was constructed to conduct bonding experiments. Through orthogonal contrast experiments, it has been determined that longitudinal ultrasonic assisted technology could reduce the bonding temperature at most by 180°C and bonding duration by 3-5s with ultrasonic parameter of 26W/cm 2 sound intensity and 4~4.66MPa prebonding pressure. This study provides valuable insights for optimizing flip-chip bonding processes.

关键词： Vibrations Temperature distribution Ultrasonic imaging Acoustics Flip-chip devices Bonding Surface cracks

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A Regional Necessity Based Multi-agent Target Search Strategy for Post-earthquake Rescue 41

A Regional Necessity Based Multi-agent Target Search Strateg...

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第41届中国控制会议

作者： Xi Luo School of Automation Beijing Institute of Technology State Key Laboratory of Intelligent Control and Decision of Complex System

ISBN: (数字)9789887581536

ISBN: (纸本)9781665482561

The damage caused by the earthquake is *** the purpose of post-earthquake rescue is to reduce *** it is necessary to improve the efficiency of rescue as much as *** paper focuses on multi-agent cooperative target search in the post-earthquake rescue and how to exploit the prior information of post-disaster building to improve the searching efficiency.A regional necessity based searching strategy is proposed which utilizes pre-disaster building information and adapts to dynamic ***,the target probability map is estimated according to the distribution information of pre-disaster ***,the regional necessity map is constructed by integrating the target probability map and the perception of the environment during the search ***,the search strategy is proposed based on the regional necessity map and the particle swarm optimization *** the gradient direction of regional necessity and local optimal velocity,the agent dynamically selects the search *** comparing with other search strategies in simulation experiments,the proposed strategy could shorten the searching time and improve the searching efficiency in the small and medium-scale task ***,the search strategy can adapt to the post-earthquake dynamic environment,which is confirmed by dynamic experiments.

关键词： multi-agent cooperative target search post-earthquake rescue regional necessity particle swarm optimization

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Design of Bionic Manta Ray Driven by SMA 7

Design of Bionic Manta Ray Driven by SMA

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7th International Conference on Control and robotics Engineering, ICCRE 2022

作者： Liu, Yiwei Chen, Zhiyuan Chen, Changjiang Wang, Tao Tian, Guoping Ji, Shihang State Key Laboratory of Robotics and System Harbin Institute of Technology Harbin China Shanghai Aerospace Equipment Manufacturing General Factory Co. Ltd Shanghai China

ISBN: (纸本)9781665468404

Taking manta ray as bionic object, a kind of bionic robot fish was designed, which was propelled by pectoral fin and driven by SMA (shape memory alloy) wire. Firstly, the model and driving structure were designed according to the appearance and motion mechanism of manta ray. Then, the mechanical model of the designed bionic pectoral fin was established, and the relationship between the pectoral fin swing angle and the current was obtained by combining with the thermodynamic model of SMA. Then, the motion law was determined by theoretical analysis, and the control system was designed. Finally, the prototype was made, and the experiments of pectoral fin swing and bionic manta ray swimming were carried out respectively. © 2022 IEEE.

关键词： Bionics

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Research and Introduction of the Process Flow of 3D-IC Thermo-Compression Intelligent Collective Bonding Equipment

Research and Introduction of the Process Flow of 3D-IC Therm...

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International Conference on (ICEPT) Electronic Packaging technology

作者： Bin Zhou Jianxin Qiao Longqiu Li Yunkang Su Dapeng Liu Haichuan Shi Wentao Huang State Key Laboratory of Robotics and System Key Laboratory for Microsystems and Microstructure Manufacturing Harbin Institute of Technology Harbin China School of Mechanical and Electrical Engineering Harbin Institute of Technology Harbin China

ISBN: (数字)9798350353808

ISBN: (纸本)9798350353815

Three-dimensional integrated (3D IC) technologies have attracted substantial academic interest due to their enhanced performance and reduced interfacial dimensions. Conventional 3D packaging for chips of four layers must be stacked and bonded four and three times, respectively, bringing about the low reliability of bumps and productivity. Additionally, the decreasing size and spacing of solder bumps present challenges for defect detection. This paper proposes a collective intelligent bonding equipment for flip-chip 3D packaging. The equipment includes a bonding head system, downward vision, chip shift table, upward vision, bonding zone, in-situ monitoring system, and substrate movement platform. The bonding head system, downward vision, chip shift table, upward vision, and bonding zone complete the collective bonding. The defect detection is accomplished by the in-situ monitoring system. The chips need to be stacked four times, and the time of bonding is once. Meanwhile, during the bonding process, the defects can be monitored in real-time by the in situ monitoring system based on active infrared technology. Four layers in chips can be simultaneously bonded, and alignment accuracy is ±15μm@3sigma. The breakage, misalignment, and other defects can be monitored during the bonding progress. The introduction of this equipment will enhance productivity while ensuring bump reliability. Moreover, its successful development holds significant importance for the advancement and manufacturing of semiconductor packaging equipment domestically.

关键词： Productivity Three-dimensional displays Machine vision Packaging Reliability Bonding Soldering

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Research on Robust Current Control Algorithm for Permanent Magnet Synchronous Motor Based on Extended state Observer

Research on Robust Current Control Algorithm for Permanent M...

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IEEE International Conference on Mechatronics and Automation

作者： Xiaofei Ding Bin Qi Bowen Zhang Khuram Shahzad Songyuan Zhang State Key Laboratory of Robotics and System Harbin Institute of Technology 92 Xidazhi Street Harbin China

High-performance servo joints are the basis for quadruped robots to have excellent motion performance. The current loop is the innermost loop of the servo system, and its control effect on torque directly determines the control effect of the entire servo system. This paper proposes a robust current control algorithm for permanent magnet synchronous motors (PMSM) based on the extended state observer (ESO) to improve the performance of the current loop. Traditional predictive current control relies more on the accuracy of model parameters. This paper uses ESO to obtain unknown disturbances to reduce the dependence of control effects on model parameters. Simulation and experiments show that predictive current control has more excellent dynamic performance than PI control. After adding the ESO compensation link, the static error and oscillation of current caused by controller model parameter error are effectively eliminated, significantly reducing the dependence on model parameters and improving the robustness of the current loop in the servo system.

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A Defense Planning Model for a Power system Against Coordinated Cyber-physical Attack

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Protection and Control of Modern Power systems 2024年第5期9卷 84-95页

作者： Peiyun Li Jian Fu Kaigui Xie Bo Hu Yu Wang Changzheng Shao Yue Sun Wei Huang State Key Laboratory of Power Transmission Equipment&System Security and New Technology Chongqing UniversityChongqing 400044China State Grid Chengdu Power Supply Com-pany State Grid Sichuan Electric Power Co.Ltd.Chengdu 610041China China Yangtze Power Co. LtdYichang 443002China

This paper proposes a tri-level defense planning model to defend a power system against a coor-dinated cyber-physical attack(CCPA).The defense plan considers not only the standalone physical attack or the cyber attack,but also coordinated *** defense strategy adopts coordinated generation and transmission expansion planning to defend against the *** the process of modeling,the upper-level plan represents the perspective of the planner,aiming to minimize the critical load shedding of the planning system after the *** load resources available to planners are extended to flex-ible loads and critical *** middle-level plan is from the viewpoint of the attacker,and aims at generating an optimal CCPA scheme in the light of the planning strategy determined by the upper-level plan to maximize the load shedding caused by the *** optimal operational behavior of the operator is described by the lower-level plan,which minimizes the load shedding by defending against the *** tri-level model is analyzed by the column and constraint generation algorithm,which decomposes the defense model into a master problem and *** studies on a modified IEEE RTS-79 system are performed to demonstrate the economic effi-ciency of the proposed model.

关键词： Coordinated cyber-physical attack flexible load column-and-constraint generation defense planning robust optimization.

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Recent Advances in Space-Deployable Structures in China

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Engineering 2022年第10期17卷 207-219页

作者： Xiaofei Ma Tuanjie Li Jingya Ma Zhiyi Wang Chuang Shi Shikun Zheng Qifeng Cui Xiao Li Fan Liu Hongwei Guo Liwu Liu Zuowei Wang Yang Li Xi’an Institute of Space Radio Technology Xi’an 710100China School of Electromechanical Engineering Xidian UniversityXi’an 710071China Beijing Institute of Spacecraft System Engineering Beijing 100094China Aerospace System Engineering Shanghai Shanghai 201109China State Key Laboratory of Robotics Harbin Institute of TechnologyHarbin 150001China Department of Astronautical Science and Mechanics Harbin Institute of TechnologyHarbin 150001China

Deployable space structure technology is an approach used in building spacecraft,especially when realizing deployment and folding *** in orbit,the structures are released from the fairing,deployed,and *** the development of communication,remote-sensing,and navigation satellites,space-deployable structures have become cutting-edge research topics in space science and *** paper summarizes the current research status and development trend of spacedeployable structures in China,including large space mesh antennas,space solar arrays,and deployable structures and mechanisms for deep-space *** technologies of space-deployable structures are addressed from the perspectives of deployable mechanisms,cable-membrane form-finding,dynamic analysis,reliable environmental adaptability analysis,and ***,future technology developments and trends are elucidated in the fields of mesh antennas,solar arrays,deployable mechanisms,and on-orbit adjustment,assembly,and construction.

关键词： Deployable space structures Mesh antennas Solar arrays Deep-space exploration

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Introduction of high-speed data acquisition system scheme based on FPGA 3

Introduction of high-speed data acquisition system scheme ba...

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3rd International Conference on Electronic Information Engineering and Data Processing, EIEDP 2024

作者： Lin, Yinghui Xu, Zhijing Sun, Jun Chen, Ren College of Information Engineering Shanghai Maritime University Shanghai China Shanghai Institute of Technical Physics State Key Laboratory of Infrared Physics Key Laboratory of Infrared System Detection and Imaging Technology Chinese Academy of Sciences Shanghai China

ISBN: (纸本)9781510680531

Signal acquisition system is widely used in various fields of reality, due to the data acquisition rate and processor performance enhancement as well as the development of sensor arrays and other technologies, the data acquisition system acquisition and transmission of the signal is exponential growth, in order to solve the high-speed signal acquisition process of the large amount of data, real-time, transmission rate and other issues, the study of high-speed acquisition of signals as well as the transmission program has an important practical significance. FPGA is very suitable to be applied in high-speed signal acquisition system because of its characteristics. In this paper, we firstly introduce the composition of a typical high-speed signal acquisition system based on FPGA, and then briefly introduce the function and development process of each module of the system and introduce the mainstream programs used in several key modules. In engineering applications, different programs should be used in different modules in conjunction with the actual. © 2024 SPIE.

关键词： Field programmable gate arrays (FPGA)

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Augmented Reality Based Navigation system for Endoscopic Transnasal Optic Canal Decompression

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Journal of Shanghai Jiaotong university(Science) 2025年第1期30卷 34-42页

作者： FU Hang XU Jiangchang LI Yinwei ZHOU Huifang CHEN Xiaojun Institute of Biomedical Manufacturing and Life Quality Engineering State Key Laboratory System and VibrationSchool of Mechanical EngineeringShanghai Jiao Tong UniversityShanghai 200240China Department of Ophthalmology Shanghai Ninth People's HospitalShanghai Jiao Tong University School of MedicineShanghai 200011China Institute of Medical Robotics Shanghai Jiao Tong UniversityShanghai 200240China Shanghai Key Laboratory of Orbital Diseases and Ocular Oncology Shanghai 200011China

Endoscopic transnasal optic nerve decompression surgery plays a crucial role in minimal invasive treatment of complex traumatic optic ***,a major challenge faced during the procedure is the inability to visualize the optic nerve *** address this issue,an endoscopic image-based augmented reality surgical navigation system is developed in this *** system aims to virtually fuse the optic nerve onto the endoscopic images,assisting surgeons in determining the optic nerve’s position and reducing surgical ***,a calibration algorithm based on a checkerboard grid of immobile points is proposed,building upon existing calibration ***,to tackle accuracy issues associated with augmented reality technology,an optical navigation and visual fusion compensation algorithm is proposed to improve the intraoperative tracking *** evaluate the system’s performance,model experiments were meticulously designed and *** results confirm the accuracy and stability of the proposed system,with an average tracking error of(0.99±0.46)*** outcome demonstrates the effectiveness of the proposed algorithm in improving the augmented reality surgical navigation system’s ***,the system successfully displays hidden optic nerves and other deep tissues,thus showcasing the promising potential for future applications in orbital and maxillofacial surgery.

关键词： optic nerve decompression endoscopy augmented reality surgical navigation

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