检索结果-内蒙古大学图书馆

您好，读者！请登录

内蒙古大学图书馆

首页
概况
党建
资源
服务
科研支持
- 论文收录引用证明
- 科技查新
知识产权
档案馆
帮助

咨询与建议

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

您的常用邮箱：*

您的手机号码：*

问题描述：

当前已输入0个字，您还可以输入200个字

全部搜索
期刊论文
图书
学位论文
标准
纸本馆藏
外文资源发现
数据库导航
超星发现

高级检索

时间限定

出版年份：

文献类型

图书期刊文献学位论文多媒体

馆藏选择

电子馆藏纸本馆藏

核心期刊

全部期刊 SCI 收录期刊 SSCI 收录期刊 EI 收录期刊 CSCD 收录期刊 CSSCI 收录期刊

语言

中文英文

文献类型

期刊文献图书学位论文标准纸本馆藏

帮助

文字说明：

T=题名（书名、题名），A=作者（责任者），K=主题词，P=出版物名称，PU=出版社名称，O=机构（作者单位、学位授予单位、专利申请人），L=中图分类号，C=学科分类号，U=全部字段，Y=年（出版发行年、学位年度、标准发布年）

检索规则说明：

AND代表“并且”；OR代表“或者”；NOT代表“不包含”；(注意必须大写,运算符两边需空一格)

检索范例：

范例一：(K=图书馆学 OR K=情报学) AND A=范并思 AND Y=1982-2016
范例二：P=计算机应用与软件 AND (U=C++ OR U=Basic) NOT K=Visual AND Y=2011-2016

分类表

所选分类

>> <<

限定检索结果

文献类型

38 篇 会议
9 篇 期刊文献

馆藏范围

47 篇 电子文献
0 种 纸本馆藏

日期分布

学科分类号

26 篇 工学
- 11 篇 电子科学与技术（可...
- 8 篇 化学工程与技术
- 7 篇 仪器科学与技术
- 6 篇 计算机科学与技术...
- 5 篇 光学工程
- 5 篇 软件工程
- 4 篇 生物医学工程（可授...
- 3 篇 冶金工程
- 3 篇 动力工程及工程热...
- 3 篇 电气工程
- 3 篇 信息与通信工程
- 2 篇 机械工程
- 2 篇 材料科学与工程（可...
- 2 篇 纺织科学与工程
- 2 篇 农业工程
- 1 篇 土木工程
- 1 篇 水利工程
- 1 篇 轻工技术与工程
16 篇 理学
- 8 篇 物理学
- 6 篇 数学
- 5 篇 化学
- 1 篇 生物学
- 1 篇 系统科学
3 篇 医学
- 2 篇 基础医学(可授医学...
- 2 篇 临床医学
3 篇 管理学
- 3 篇 管理科学与工程(可...
- 2 篇 工商管理
2 篇 经济学
- 2 篇 应用经济学
2 篇 法学
- 2 篇 社会学
2 篇 农学
- 2 篇 作物学

主题

3 篇 substrates
3 篇 impedance measur...
2 篇 amorphous silico...
2 篇 packaging
2 篇 impedance
2 篇 fabrication
2 篇 films
2 篇 bonding
2 篇 optimization
2 篇 monitoring
2 篇 smart textiles
2 篇 wires
2 篇 printed circuits
2 篇 integrated circu...
2 篇 antenna-in-packa...
2 篇 electrodes
2 篇 integrated circu...
2 篇 electromagnetic ...
1 篇 tools
1 篇 millimeter wave ...

机构

8 篇 system integrati...
4 篇 department of sy...
4 篇 department of mi...
3 篇 mems & micro dev...
3 篇 system integrati...
3 篇 fraunhofer izm d...
3 篇 delft university...
2 篇 department of in...
2 篇 school of electr...
2 篇 fraunhofer izm d...
2 篇 tno/holst centre...
2 篇 department of el...
2 篇 system integrati...
2 篇 institute of ele...
2 篇 department of co...
2 篇 roma tre univers...
2 篇 department of ma...
2 篇 clinic for cardi...
2 篇 corporate sector...
2 篇 technical univer...

作者

8 篇 giagka vasiliki
7 篇 vasiliki giagka
4 篇 tanja braun
3 篇 christian voigt
3 篇 rashidi amin
3 篇 serdijn wouter a...
3 篇 e. hoene
3 篇 ioannis tsigaras
3 篇 braun tanja
3 篇 dekker ronald
3 篇 ewald strolz
3 篇 roland rettenmei...
3 篇 s. schoerle
2 篇 martin schneider...
2 篇 ruben kahle
2 篇 soukoulis costas...
2 篇 klaus-dieter lan...
2 篇 kafesaki maria
2 篇 tretyakov sergei...
2 篇 marta saccher

语言

39 篇 英文
7 篇 其他
1 篇 中文

检索条件"机构=System Integration and Interconnection Technologies"

共 47 条记录，以下是1-10 订阅

全选清除本页清除全部题录导出标记到"检索档案"

详细简洁

排序：

Towards Industrialized E-Textile Assembly: Low Temperature Optimization of Textile-Electronic NCA Bonding

Towards Industrialized E-Textile Assembly: Low Temperature O...

引用

2024 International Conference on the Challenges, Opportunities, Innovations and Applications in Electronic Textiles, E-Textiles 2024

作者： Stagun, Lars Rotzler, Sigrid Werft, Lukas Von Krshiwoblozki, Malte Technical University of Berlin Microperipheric Research Center Berlin Germany System Integration and Interconnection Technologies Berlin Germany

ISBN: (纸本)9783000804298

Developing an industrially viable interconnection process for integrating electronic modules in textiles at low temperatures could represent a key technology for the efficient and cost-effective industrial production of electronic textiles (e-textiles). The challenge lies in identifying and characterizing adhesive films that can ensure reliable adhesion between printed circuit board (PCB) material and textiles at processing temperatures below 130°C. This lower process temperature prevents damage to the textile fibers and deformation of common circuit board material, maintains the integrity and functionality of the final product, leads to higher reliability of electrical connections and benefits sustainability by reducing the energy needed for processing. © 2024 Fraunhofer IZM.

关键词： Low temperature production

来源：评论

学校读者我要写书评

暂无评论

Ultrasound for Data Transfers from Deep Implants: an Experimental Comparison Between Binary-Frequency-Shift-Keying and On-Off-Keying with Backscatter Modulation

Ultrasound for Data Transfers from Deep Implants: an Experim...

引用

2023 IEEE International Ultrasonics Symposium, IUS 2023

作者： Holzapfel, Lukas Giagka, Vasiliki Fraunhofer Izm Department of System Integration and Interconnection Technologies Berlin Germany Delft University of Technology Department of Microelectronics Delft Netherlands

ISBN: (纸本)9798350346459

Implantable devices need to communicate information to the outside world. For deep-seated miniaturized implants ultrasound communication can be favourable. However, implants need to operate during movement, and the selected communication scheme should be assessed accordingly. In this work, we implemented a simple protocol to transfer data packets based on On-Off-Keying (OOK) and Frequency-Shift-Keying (FSK) by backscatter modulation in ultrasonic communication links for deep implants. We then used it to compare FSK vs OOK encoding regarding the bit error rate during continuous ultrasound power transfer, and while moving, in a water tank setup. Our experiment shows, that sub-millimeter movements can have severe effects on OOK communication, but not for FKS. Therefore, FSK can allow for backscatter communication from deep implants regardless of their position and involved movements. The protocol can also be adapted to other backscatter modulation schemes in the future. © 2023 IEEE.

关键词： Ultrasonics

来源：评论

学校读者我要写书评

暂无评论

A Differential Series-Fed Dipole Array for D-Band Sensing in Wafer Level Package Technology 19

A Differential Series-Fed Dipole Array for D-Band Sensing in...

引用

19th European Conference on Antennas and Propagation, EuCAP 2025

作者： De Kok, Martijn Vargas, Paola A. Escobari Meyer, Elmine Muller, Friedrich Braun, Tanja Reniers, Ad C. F. Johannsen, Ulf Eindhoven University of Technology (TU/e) Electromagnetics Group Eindhoven Netherlands Fraunhofer Izm Department of System Integration & Interconnection Technologies Berlin Germany

ISBN: (纸本)9788831299107

This paper presents the design and characterization of a series-fed differential Antenna-in-Package (AiP) design, demonstrated as a four- and a six-element reflector-backed linear dipole array, that has been realized in a resin-based fan-out wafer level package technology. The four- and six-element designs achieve -10 dB input reflection bandwidths of 5.5 and 5.9 percent, realized gains of 14 and 15.4 dBi, and side-lobe levels of -10.7 and -12.1 dB, respectively. The realized samples were characterized through probed measurements in a state-of-the-art millimeter-wave anechoic chamber. After taking the RF-probe influence on the antenna performance into consideration, the measurements corroborated the simulated results. © 2025 European Association on Antennas and Propagation.

关键词： Antenna-in-package D-band Differential antenna Fan-out wafer level package Reflector-backed dipole

来源：评论

学校读者我要写书评

暂无评论

AI-Enhanced Smart Textile system for the Monitoring of Cardiovascular Insufficiency

AI-Enhanced Smart Textile System for the Monitoring of Cardi...

引用

2024 International Conference on the Challenges, Opportunities, Innovations and Applications in Electronic Textiles, E-Textiles 2024

作者： Adams, Basel Dils, Christian Kuhne, Titus Kretzler, Lucie System Integration and Interconnection Technologies Fraunhofer IZM Berlin Germany Institute of Computer-assisted Medicine ICM Heart Center of the Charité Berlin Germany Clinic for Cardiology Heart Center of the Charité Berlin Germany

ISBN: (纸本)9783000804298

This study explores the integration of artificial intelligence (AI) and sensor fusion in wearable technology for early cardiac emergency detection and improved non-invasive cardiac diagnostics. Developed as part of a doctoral thesis within the Maia project in collaboration with Fraunhofer IZM and Charité Berlin, the system combines bioimpedance spectroscopy (BIS) with complementary sensor technologies, enabling synchronous monitoring of over 110 cardiac parameters at high data rates. Clinically relevant parameters were selected with input from Charité clinicians, ensuring precision. The system employs biocompatible silicone-based sensors and optimized semi-dry textile electrodes embedded in a smart textile vest, allowing continuous, non-invasive cardiac monitoring. By integrating BIS with electrocardiography (ECG), seismocardiography (SCG), phonocardiography (PCG), and photoplethysmography (PPG), this comprehensive system supports in-depth cardiac health assessment. Advanced deep learning and statistical machine learning algorithms enhance diagnostic accuracy, with models trained on clinical and patient-specific data, showing high sensitivity, specificity, and accuracy in detecting cardiovascular conditions. Validation with data from the PhysioNet database underpins this foundational design and development study. © 2024 Fraunhofer IZM.

关键词： Photoplethysmography

来源：评论

学校读者我要写书评

暂无评论

A Differential Series-Fed Dipole Array for D-Band Sensing in Wafer Level Package Technology

A Differential Series-Fed Dipole Array for D-Band Sensing in...

引用

European Conference on Antennas and Propagation, EuCAP

作者： Martijn De Kok Paola A. Escobari Vargas Elmine Meyer Friedrich Müller Tanja Braun Ad C. F. Reniers Ulf Johannsen Electromagnetics Group Eindhoven University of Technology (TU/e) Eindhoven The Netherlands Department of System Integration & Interconnection Technologies Fraunhofer IZM Berlin Germany

ISBN: (数字)9788831299107

ISBN: (纸本)9798350366327

关键词： Antenna measurements Dipole antennas Scalability Millimeter wave measurements Antenna-in-package Bandwidth Reflector antennas Radar antennas Manufacturing Sensors

来源：评论

学校读者我要写书评

暂无评论

Application of Machine Learning Methods for Process Optimization in Electronic Packaging Processes 24

Application of Machine Learning Methods for Process Optimiza...

引用

24th European Microelectronics and Packaging Conference, EMPC 2023

作者： Niegisch, Corinna Haag, Sabine T. Braun, Tanja Hulck, Ole Schneider-Ramelow, Martin Robert Bosch GmbH Corporate Sector Research and Advance Engineering Renningen Germany Fraunhofer IZM Departement System Integration and Interconnection Technologies Berlin Germany Technical University Berlin Faculty IV Electrical Engineering and Computer Science Berlin Germany

ISBN: (纸本)9780956808691

Epoxy resins are commonly used as encapsulation materials in electronic packaging processes. Fluctuations in the materials lead to both changes in processability and to varying quality. Ideally, these variations should be identified, and measures taken as quickly as possible to reduce scrap parts and thus costs. A promising optimization approach for encapsulation processes are machine learning models, which have already shown good results in quality predictions, especially for injection molding. Subsequent quality measurements are avoided with good quality prediction models. With this type of models, not only predictions can be made, but also optimal parameter combinations can be found. In this paper, models for predicting quality criteria warpage and residual enthalpy of the epoxy molding compound were set up, trained and validated. Time series of in-situ sensors were used, from which relevant features were extracted and which, together with machine parameters, provide a dataset for prediction. The most promising prediction models are random forest regression and gradient boosting regression. They predict warpage with an accuracy of 90 % to 91 % and the residual enthalpy with an accuracy of 95 %. Subsequently, optimization models of the machine parameters were set up. All relevant target variables were considered in a cost function, through the minimization of which an optimal parameter set was found. The gradient boosted tree and Bayesian optimization were determined to be the most promising models, as they lead to the lowest values of the respective cost function. © 2023 IMAPS-Europe.

关键词： Optimization

来源：评论

学校读者我要写书评

暂无评论

A pplication of machine learning methods for process optimization in electronic packaging processes

A pplication of machine learning methods for process optimiz...

引用

作者： Niegisch, Corinna Haag, Sabine T. Braun, Tanja Hölck, Ole Schneider-Ramelow, Martin Corporate Sector Research and Advance Engineering Robert Bosch GmbH Renningen Germany Fraunhofer IZM Departement System Integration and Interconnection Technologies Berlin Germany Technical University Berlin Faculty IV Electrical Engineering and Computer Science Berlin Germany

E poxy resins are commonly used as encapsulation materials in electronic packaging processes. F luctuations in the materials lead to both changes in processability and to varying quality. Ideally, these variations should be identified, and measures taken as quickly as possible to reduce scrap parts and thus costs. A promising optimization approach for encapsulation processes are machine learning models, which have already shown good results in quality predictions, especially for injection molding. Subsequent quality measurements are avoided with good quality prediction models. W ith this type of models, not only predictions can be made, but also optimal parameter combinations can be found. In this paper, models for predicting quality criteria warpage and residual enthalpy of the epoxy molding compound were set up, trained and validated. T ime series of in-situ sensors were used, from which relevant features were extracted and which, together with machine parameters, provide a dataset for prediction. T he most promising prediction models are random forest regression and gradient boosting regression. T hey predict warpage with an accuracy of 90 % to 91 % and the residual enthalpy with an accuracy of 95 % . Subsequently, optimization models of the machine parameters were set up. All relevant target variables were considered in a cost function, through the minimization of which an optimal parameter set was found. T he gradient boosted tree and Bayesian optimization were determined to be the most promising models, as they lead to the lowest values of the respective cost function. © 2023 IMAPS-International Microelectronics and Packaging Society. All rights reserved.

关键词： Optimization

来源：评论

学校读者我要写书评

暂无评论

UV and IR Laser-Patterning for High-Density Thin-Film Neural Interfaces 23

UV and IR Laser-Patterning for High-Density Thin-Film Neural...

引用

23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021

作者： Velea, Andrada I. Wilson, Joshua Pak, Anna Seckel, Manuel Schmidt, Sven Kosmider, Stefan Bakhshaee, Nasim Serdijn, Wouter A. Giagka, Vasiliki Bioelectronics Section Department of Microelectronics Delft University of Technology Delft Netherlands Technologies for Bioelectronics Group Department of System Integration and Interconnection Technologies Fraunhofer IZM Berlin Germany Embedding and Substrate Technologies Group Department of System Integration and Interconnection Technologies Fraunhofer IZM Berlin Germany

ISBN: (纸本)9780956808677

Our limited understanding of the nervous system forms a bottleneck which impedes the effective treatment of neurological disorders. In order to improve patient outcomes it is highly desirable to interact with the nervous tissue at the resolution of individual cells. As neurons number in the billions and transmit signals electrically, high-density, cellular-resolution microelectrode arrays will be a useful tool for both treatment and research. This paper investigates the advantages and versatility of laser-patterning technologies for the development of such high-density microelectrode arrays in flexible polymer substrates. In particular, it aims to elucidate the mechanisms involved in laser patterning of thin polymers on top of thin metal layers. For this comparative study, a pulsed picosecond laser (Schmoll Picodrill) with two separate wavelengths (1064 nm (infrared (IR)) and 355 nm (ultraviolet (UV))) was used. A 5 μm thick electroplated layer of gold (Au) was used to form the microelectrodes. Laser-patterning was investigated to expose the Au electrodes when encapsulated by two different thermoplastic polymers: thermoplastic polyurethane (TPU), and Parylene-C, with thicknesses of maximum 25 μm. The electrode diameter and the distance between electrodes were reduced down to 35 μm and 30 μm, respectively. The structures were evaluated using optical microscopy and white light interferometry and the results indicated that both laser wavelengths can be successfully used to create high-density microelectrode arrays in polymer substrates. However, due to the lower absorption coefficient of metals in the IR spectrum, a higher uniformity of the exposed Au layer was observed when IR-based lasers were used. This paper provides more insight into the mechanisms involved in laser-patterning of thin film polymers and demonstrates that it can be a reliable and cost-effective method for the rapid prototyping of thin-film neural interfaces. © 2021 2021 23rd European Microelectronic

关键词： Thin films

来源：评论

学校读者我要写书评

暂无评论

Phase Distribution Efficiency of cm-Scale Ultrasonically Powered Receivers

Phase Distribution Efficiency of cm-Scale Ultrasonically Pow...

引用

2023 IEEE International Ultrasonics Symposium, IUS 2023

作者： Saccher, Marta Rashidi, Amin Savoia, Alessandro Stuart Giagka, Vasiliki Dekker, Ronald Roma Tre University Department of Industrial Electronic and Mechanical Engineering Rome Italy Delft University of Technology Department of Microelectronics Delft Netherlands Fraunhofer Izm Department of System Integration and Interconnection Technologies Berlin Germany Mems & Micro Devices Philips Eindhoven Netherlands

ISBN: (纸本)9798350346459

In the domain of ultrasonically powered biomedical implants, there is an increasing interest in cm-scale ultrasonic receivers (RX). However, when a single-element transducer is used as the RX transducer, an uneven phase distribution across the RX area can significantly reduce the harvestable power. In this paper, we investigate the impact of lateral and angular misalignment on the acoustic field phase distribution across the RX surface. We show that, for a single-element RX transducer, lateral misalignment has minimal effect on the harvestable power, whereas even small angular misalignments can cause a considerable reduction, especially for larger RX sizes. We present a potential solution that consists of subdividing a large RX transducer (e.g. 20 × 20 mm2) into smaller elements, which significantly improves power transfer efficiency by taking advantage of the smaller phase variation across the surface of each element. The trade-offs between achieving a minimum acceptable power transfer efficiency and managing the increased complexity in packaging and matching circuitry are also discussed. © 2023 IEEE.

关键词： Transducers

来源：评论

学校读者我要写书评

暂无评论

Towards Industrialized E-Textile Assembly: Low Temperature Optimization of Textile-Electronic NCA Bonding

Towards Industrialized E-Textile Assembly: Low Temperature O...

引用

Challenges, Opportunities, Innovations and Applications in Electronic Textiles (E-Textiles), International Conference on the

作者： Lars Stagun Sigrid Rotzler Lukas Werft Malte Von Krshiwoblozki Microperipheric Research Center Technical University of Berlin Berlin Germany System Integration and Interconnection Technologies Fraunhofer Institute for Reliability and Microintegration IZM Berlin Germany

ISBN: (数字)9783000804298

ISBN: (纸本)9798331516871

关键词： Smart textiles Technological innovation Printed circuits Integrated circuit interconnections Materials reliability Production Textile fibers Integrated circuit reliability Wearable devices Sustainable development

来源：评论

学校读者我要写书评

暂无评论

没有更多数据了...

全选清除本页清除全部题录导出标记到“检索档案”

共5页 << < 1 2 3 4 5 > >>

检索报告对象比较合并检索0

隐藏清空

合并搜索

回到顶部

执行限定条件

内容：

评分：

请选择保存的检索档案：

请选择收藏分类：

订阅名称：

通借通还

温馨提示：

图书名称：

借书校区：

取书校区：

手机号码：

邮箱地址：

一卡通帐号：

电话和邮箱必须正确填写，我们会与您联系确认。

联系人：

所在院系：

联系邮箱：

联系电话：

内蒙古自治区呼和浩特市赛罕区大学西街235号邮编: 010021

建议与咨询 留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案： 新增检索档案 确定 取消

请选择收藏分类： 新增自定义分类 确定 取消

通借通还

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

请选择保存的检索档案：

请选择收藏分类：