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2024 IEEE High Performance Extreme Computing Conference, HPEC 2024

作者： Sadasivan, Harisankar Klauser, Artur Hench, Juergen Turakhia, Yatish Singh, Gagandeep Zeni, Alberto Beecroft, Sarah Narayanasamy, Satish Nivala, Jeff Robey, Bob Mutlu, Onur Denolf, Kristof Sitaraman, Sriranjani Advanced Micro Devices Inc. Ai Group BellevueWA United States Seattle WA United States Institute for Pathology and Medical Genetics University Hospital Basel Basel Switzerland University of California San Diego United States Research and Development Advanced Micro Devices Inc. Zug Switzerland Ai Group- Silicon Advanced Micro Devices Inc. Dublin Ireland Pawsey Supercomputing Research Centre PerthWA Australia University of Michigan Ann ArborMI United States Dcgpu Advanced Micro Devices Inc. Hpc Solutions Los AlamosNM United States Eth Zürich Zürich Switzerland Research and Development Advanced Micro Devices Inc. LongmontCO United States Dcgpu Advanced Micro Devices Inc. Hpc Solutions AustinTX United States

ISBN: (纸本)9798350387131

The rapid growth of genomic data has positioned genomics to become one of the world's most storage-intensive and computationally demanding fields. This review paper provides a comprehensive analysis of emerging trends in software and hardware for genomics, addressing a critical gap in the current literature. We categorize and examine key algorithms in genomic sequencing workflows, including sequence data indexing, retrieval and pile-up, dynamic programming, and machine learning. We analyze how computational and memory requirements scale with input sizes for each category, offering insights into potential bottlenecks and optimization opportunities. Our review synthesizes recent advancements in hardware-software co-design, compression schemes, and acceleration techniques for genomic data processing. We propose graphics processing units (GPUs) as a promising first step for deploying genomics workflows due to their high throughput, memory bandwidth, and programmability. By providing a holistic perspective on the computational challenges in genomics, this paper attempts to set a promising direction for future researchers to work collectively to optimize all the components of genomic data processing workflows. Our work aims to foster more targeted and effective advancements in the field, potentially leading to significant improvements in the efficiency and scalability of genomic analyses. We also discuss performance portability as a second step to meet the diverse requirements in point-of-care workflows. © 2024 IEEE.

关键词： Graphics processing unit

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A Clock Duty Cycle Correction Circuitry for Ultra-Wide Frequency Range using Nested Loops

A Clock Duty Cycle Correction Circuitry for Ultra-Wide Frequ...

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Norchip

作者： Rg Raghavendra Kamlesh Singh Milind Gopal Agrawal Circuit Technology Group Advanced Micro Devices Inc

ISBN: (数字)9798331517663

ISBN: (纸本)9798331517670

Clock duty cycle is important in high-speed interface designs, as it directly impacts the transmitted data eye width, thereby increasing the deterministic jitter (DJ) of overall high-speed link. Traditional methods of duty cycle correction (DCC) include an analog negative feedback loop, which is slow, difficult to stabilize and requires a constant clock for the loop to track and maintain the output clock’s duty cycle. Further, analog loops suffer from burst mode issues, where traffic is sporadic, and clocks are shutdown to save the power. We propose a mixed mode nested loop based digital duty cycle correction (DCC) circuitry using analog sensing loop, which overcomes the issues observed in a traditional negative feedback based analog loop. The proposed nested loop solution corrects clock duty cycle over an ultra-wide frequency range with minimal/zero power impact. The proposed solution supports duty cycle corrected clock for burst mode traffic over an ultra-wide operating frequency range. The proposed solution can find its applications in variety of clocking intellectual properties (IP) for its merits. Implemented in $7 \mathbf{n m}$ FinFET technology, the proposed nested loop based digital DCC solution achieves target duty cycle correction range requirements for $500 \mathrm{MHz}-10 \mathrm{GHz}$ frequency range with residual DC error contained within $1 \%$.

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Programmable Delay Line With Inherent Duty Cycle Correction

Programmable Delay Line With Inherent Duty Cycle Correction

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International Conference on VLSI Design

作者： Siva Charan Nimmagadda Hari Bilash Dubey Technology and Engineering Group Advanced Micro Devices Hyderabad India

In the recent HBM2E IO design, clock is transmitted differentially to the external DRAM and duty cycle distortion (DCD) could add to the differential clock due to traversing multiple stages in DRAM. At higher data rates, the DCD from the differential clock imposes restrictions on the timing margins. In current work, Tx clock path is added with DCC feature to compensate for any DCD errors introduced by the clock network in the external DRAM. Linearity of the DCC is critical metric when the clock is differential and running at high speed. A new programmable delay line with inherent DCC design with good linearity is presented in this paper.

关键词： Industries Embedded systems Random access memory Linearity Delay lines Very large scale integration Distortion

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Topological materials for full-vector elastic waves

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National Science Review 2023年第5期10卷 194-200页

作者： Ying Wu Jiuyang Lu Xueqin Huang Yating Yang Li Luo Linyun Yang Feng Li Weiyin Deng Zhengyou Liu School of Physics and Optoelectronics and State Key Laboratory of Luminescent Materials and Devices South China University of Technology Institute of Solid Mechanics Midea Corporate Research CenterMidea Group Department of Astronautic Science and Mechanics Harbin Institute of Technology Centre for Quantum Physics Key Laboratory of Advanced Optoelectronic Quantum Architecture and Measurement (MOE)School of PhysicsBeijing Institute of Technology Key Laboratory of Artificial Micro-and Nanostructures of Ministry of Education and School of Physics and Technology Wuhan University Institute for Advanced Studies Wuhan University

Elastic wave manipulation is important in a wide variety of applications,including information processing in small elastic devices and noise control in large solid *** recent emergence of topological materials has opened new avenues for modulating elastic waves in ***,because of the full-vector feature and the complicated couplings of the longitudinal and transverse components of elastic waves,manipulating elastic waves is generally difficult compared with manipulating acoustic waves(scalar waves) and electromagnetic waves(vectorial waves but transverse only).To date,topological materials,including insulators and semimetals,have been used for acoustic and electromagnetic *** topological materials with elastic waves have also been reported,the observed topological edge modes lie on the domain wall.A natural question arises:Is there an elastic metamaterial with topological edge modes on its own boundary?Here,we report a 3D metal-printed bilayer metamaterial that topologically insulates elastic *** introducing chiral interlayer couplings,the spin-orbit couplings for elastic waves are induced,which give rise to nontrivial topological *** edge states with vortex features were demonstrated on the boundary of the single topological *** further show a heterostructure of the metamaterial that exhibits tunable edge *** findings could be used in devices based on elastic waves in solids.

关键词： topological insulators elastic waves edge states

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Programmable delay line with inherent duty cycle correction

Memories - Materials, Devices, Circuits and Systems

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Memories - Materials, devices, Circuits and Systems 2024年 8卷

作者： Nimmagadda, Siva Charan Dubey, Hari Bilash Technology and Engineering Group Advanced Micro Devices Inc. Salarpuria Sattva Knowledge City Hyderabad500081 India

In the recent HBM2E IO design, clock is transmitted differentially to the external DRAM and duty cycle distortion (DCD) could add to the differential clock due to traversing multiple stages in DRAM. At higher data rates, the DCD from the differential clock imposes restrictions on the timing margins. In the current work, Tx clock path is added with DCC feature to compensate for any DCD errors introduced by the clock network in the external DRAM. Linearity of the DCC is critical metric when the clock is differential and running at high speed. A new programmable delay line with inherent DCC design with good linearity is presented in this paper. © 2024 The Authors

关键词： Taps

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Design and Simulation of Piezoelectric Wideband Acoustic Sensor Covered with Organic Film 1

Design and Simulation of Piezoelectric Wideband Acoustic Sen...

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1st International Conference on Robotics, Engineering, Science, and technology, RESTCON 2024

作者： Kuchiji, Hiroyuki Masumoto, Naoki Morishita, Kota Hasegawa, Shunta Suzuki, Takaaki Baba, Akiyoshi Nisshinbo Micro Devices Inc. Advanced Technology Development Dept. Chuo-Ku Tokyo Japan Kyushu Institute of Technology Center for Microelectronic Systems Iizuka-City Fukuoka Japan Gunma University Kiryu-City Division of Mechanical Science and Technology Gunma Japan

ISBN: (纸本)9798350348842

A wideband acoustic sensor is reported in which the cantilevers are covered with an organic film in a piezoelectric micro-electro mechanical systems (MEMS) acoustic transducer. Coating the gap between the cantilevers with an organic film expands the low-frequency sensitivity, and connecting the cantilevers with an organic film increases the resonance frequency. Therefore, a broadband acoustic sensor can be realized [1]. However, coating with an organic film lowers the sensitivity, making the selection of the material for the organic film crucial. In this study, we perform finite element method (FEM) simulations using a combination of piezoelectric materials and organic films and provide guidelines for selecting organic films. Simulations are performed using AlN, ZnO, and polyvinylidene fluoride (PVDF) as piezoelectric materials. The results show that the larger the Young's modulus ratio between the piezoelectric layer and the organic film, the lesser the effect of the organic film, which is expected to suppress the decrease in sensitivity caused by the organic film. The simulation results of the effective stress distribution from the fixed end to the free end of the cantilever confirms that there exists a region where the effective stress is high near the tip of the cantilever. This suggests that sensitivity can be improved by placing the electrode near the tip of the cantilever. © 2024 IEEE.

关键词： Finite element method

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The Genomic Computing Revolution: Defining the Next Decades of Accelerating Genomics

The Genomic Computing Revolution: Defining the Next Decades ...

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IEEE Conference on High Performance Extreme Computing (HPEC)

作者： Harisankar Sadasivan Artur Klauser Juergen Hench Yatish Turakhia Gagandeep Singh Alberto Zeni Sarah Beecroft Satish Narayanasamy Jeff Nivala Bob Robey Onur Mutlu Kristof Denolf Sriranjani Sitaraman AI Group Advanced Micro Devices Inc. Bellevue WA USA Seattle WA USA Institute for Pathology and Medical Genetics University Hospital Basel Basel Switzerland Electrical and Computer Engineering University of California San Diego USA Research and Development Advanced Micro Devices Inc. Zug Switzerland AI Group- Silicon Advanced Micro Devices Inc. Dublin Ireland Pawsey Supercomputing Research Centre Perth WA Australia Computer Science and Engineering University of Michigan Ann Arbor MI USA Computer Science and Engineering University of Washington Seattle WA USA HPC Solutions DCGPU Advanced Micro Devices Inc. Los Alamos NM USA Information Technology and Electrical Engineering ETH Zürich Zürich Switzerland Research and Development Advanced Micro Devices Inc. Longmont CO USA HPC Solutions DCGPU Advanced Micro Devices Inc. Austin TX USA

ISBN: (数字)9798350387131

ISBN: (纸本)9798350387148

关键词： Sequential analysis Reviews Software algorithms Genomics Graphics processing units Hardware Software Dynamic programming Bioinformatics Optimization

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Thermal simulations of lock-in-thermography for failure analysis of integrated circuits

Thermal simulations of lock-in-thermography for failure anal...

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International Symposium on Physical & Failure Analysis of Integrated Circuits

作者： Wen Qiu Bernice Zee Kin Leong Pey Nagarajan Raghavan Device Analysis Lab Advanced Micro Devices (Singapore) Pte Ltd Singapore Engineering Product Development Pillar Singapore University of Technology and Design Singapore

This paper describes a methodology that uses ANSYS workbench as a finite element (FE) simulator together with lock-in thermography (LIT) for accurately determining defects that are deeply buried and situated near the die edge of a stacked die device. The correlation provides a baseline for determining the critical defect location in cases where the hottest thermal site is detected outside of the silicon die region.

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3D printed multicore fiber-tip discriminative sensor for magnetic field and temperature measurements

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Light(advanced Manufacturing) 2024年第1期5卷 82-92页

作者： Cong Xiong Caoyuan Wang Ruowei Yu Wei Ji Yu Qin Yichun Shen Wei Chen Ai-Qun Liu Limin Xiao Advanced Fiber Devices and Systems Group Key Laboratory of Micro and Nano Photonic Structures(MoE)Key Laboratory for Information Science of Electromagnetic Waves(MoE)Shanghai Engineering Research Center of Ultra-Precision Optical ManufacturingSchool of Information Science and TechnologyFudan UniversityShanghaiChina Zhongtian Technology Advanced Materials Co. Ltd.NantongJiangsuChina Key laboratory of Specialty Fiber Optics and Optical Access Networks Joint International Research Laboratory of Specialty Fiber Optics and Advanced CommunicationShanghai University.ShanghaiChina Department of Electrical and Electronic Engineering The Hong Kong Polytechnic UniversityHong KongChina

Miniaturized fiber-optic magnetic field sensors have attracted considerable interest owing to their superiorities in anti-electromagnetic interference and ***,the intrinsic thermodynamic properties of the material make temperature cross-sensitivity a challenging problem in terms of sensing accuracy and *** this study,an ultracompact multicore fiber(MCF)tip sensor was designed to discriminatively measure the magnetic field and temperature,which was subsequently evaluated *** novel 3D printed sensing component consists of a bowl-shaped microcantilever and a polymer microfluid-infiltrated microcavity on the end-facet of an MCF,acting as two miniaturized Fabry-Perot *** magnetic sensitivity of the microcantilever was implemented by incorporating an iron micro ball into the microcantilever,and the microfluid-infiltrated microcavity enhanced the capability of highly sensitive temperature *** this tiny fiber-facet device in the two channels of an MCF allows discriminative measurements of the magnetic field and temperature by determining the sensitivity coefficient matrix of two *** device exhibited a high magnetic field intensity sensitivity,approximately 1805.6 pm/mT with a fast response time of~213 ms and a high temperature sensitivity of 160.3 pm/℃.Moreover,the sensor had a low condition number of 11.28,indicating high reliability in two-parameter *** proposed 3D printed MCF-tip probes,which detect multiple signals through multiple channels within a single fiber,can provide an ultracompact,sensitive,and reliable scheme for discriminative *** bowl-shaped microcantilever also provides a useful platform for incorporating microstructures with functional materials,extending multi-parameter sensing scenarios and promoting the application of MCFs.

关键词： Two-photon polymerization Multicore fiber-tip sensor Magnetic field sensing Discriminative sensing

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Dust particle surface potential in an argonhelium plasma using the(r,q)-distribution function

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Communications in Theoretical Physics 2024年第9期76卷 141-148页

作者： Bahaaudin M Raffah A A Abid Abdullah Khan Amin Esmaeili Yas Al-Hadeethi M N S Qureshi Department of Physics Faculty of SciencesKing Abdulaziz UniversityJeddah 21589Saudi Arabia Lithography in Devices Fabrication and Development Research Group Deanship of Scientific ResearchKing Abdulaziz UniversityJeddah 21589Saudi Arabia Joint Laboratory of Plasma Application Technology Institute of Advanced TechnologyUniversity of Science and Technology of ChinaHefei230026China CAS Key Laboratory of Geospace Environment University of Science and Technology of ChinaHefei230026China Department of Physics Zhejiang Normal UniversityJinhua321005China Department of Physics Graduate School of ScienceTokyo Metropolitan UniversityMinami-Osawa 1-1Hachioji City192-0397Japan Department of Physics GC UniversityLahore 54000Pakistan

In this paper,the dust particle surface potential for argon-helium plasma is evaluated analytically and numerically in the context of negatively charged dust particles by employing a power-law(r,q)-distribution *** studies have reported the argon-helium plasma and conducted a brief theoretical and experimental *** deepen our understanding further,this study aims to analyze the argon-helium plasma comprehensively using the same pattern but with the(r,q)-distribution *** this purpose,the current balance equations are derived for electron,helium and argon ions,when these charge species attain the quasineutrality *** numerically examined the currents of plasma species for a broad range of effective distribution function parameters r and *** is revealed that the surface potential of dust particles is significantly affected by the parameters r and q,helium ion-to-electron temperature ratio,argon ion-to-electron temperature ratio,and helium ion to argon ion number density *** incorporating the multi-ion(argon-helium)species,the significance of low-temperature nonMaxwellian dusty(complex)plasma is briefly examined.

关键词： dusty plasma dust charge potential plasma physics helium argon plasma r q distribution function non-Maxwellian distribution

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