作者：
PAVIO, AMPAVIO, JSCHAPMAN, JEBOGGAN, GHTexas Instruments Incorporated
P.O. Box 655474 Dallas. Texas 75265 Jeanne Pavio is the Manager of the Microwave Advanced Packaging Group at Texas Instruments where she has been cmployed since 1980. She received the BA degree in 1971 and the MS in 1972
both from the University of Connecticut. Her experience base has included the fabrication and assembly of thick and thin film hybrids. At the Texas Instruments Hybrid Microelectronics Laboratory Jeanne implemented nitrogenfireable thick film for ceramic application in surface-mount technology and hybrids. For the last six years she has focused on the automated assembly and packaging of GaAs Monolithic Microwave Integrated Circuits and devices. This has encompassed development of fluxless furnace reflow and void-free vacuum reflow of GaAs components as well as development of automated wirebonding to GaAs Microwave Hybrids. She was instrumental in directly applying this technology to active phased array module production. Her efforts presently involve the implementation of high-volume techniques and automation for insertion of MMIC technology in a cost-effective highvolume environment. She has authored numerous papers involving hybrid fabrication and assembly technology and in particular involving automated assembly and packaging of GaAs MMIC devices. James E. Chapman
Jr. was born in Dallas Texas in 1943. He received the BS and MS degrees in Electrical Engineering from Southern Methodist University (SMU) in 1966 and 1968 respectively. During this time he was associated with the Semiconductor Group of Texas Instruments Incorporated as an undergraduate engineering cooperative student working with various silicon products and processes. Mr. Chapman is currently a Senior Member of the Technical Staff assigned to the Microwave Technology and Products Division of the Defense Systems and Electronics Group. In this position he is currently technical director of the Technology Development for Solid-state Phased-Arrays (TDSSPA) Program. This program is a task-ordere
The application of computer-aided manufacturing (CAM) techniques to the assembly and test of a low-cost, high-volume X-band Radar T/R module will be investigated by highlighting the differences between low frequency a...
详细信息
The application of computer-aided manufacturing (CAM) techniques to the assembly and test of a low-cost, high-volume X-band Radar T/R module will be investigated by highlighting the differences between low frequency and microwave CAM methods, focusing on the difficulties of automated testing, evaluation, and circuit tuning. The problems encountered when implementing high-precision automated assembly and test methods, which include wire-bonding, soldering, piece-part placement, thin wafer GaAs probing, and a novel implementation of a microwave circuit laser-tuning technique will also be discussed. These CAM techniques, combined with integrated MMIC technology, are then used to illustrate a manufacturing philosophy targeted toward high-volume microwave module production.
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