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检索条件"机构=The Science and Technology on Monolithic Integrated Circuits and Modules Laboratory"
211 条 记 录,以下是211-220 订阅
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COMPUTER-AIDED MANUFACTURING OF ADVANCED MICROWAVE modules
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INTERNATIONAL JOURNAL OF MICROWAVE AND MILLIMETER-WAVE COMPUTER-AIDED ENGINEERING 1991年 第1期1卷 90-111页
作者: PAVIO, AM PAVIO, JS CHAPMAN, JE BOGGAN, GH Texas Instruments Incorporated P.O. Box 655474 Dallas. Texas 75265 Jeanne Pavio is the Manager of the Microwave Advanced Packaging Group at Texas Instruments where she has been cmployed since 1980. She received the BA degree in 1971 and the MS in 1972 both from the University of Connecticut. Her experience base has included the fabrication and assembly of thick and thin film hybrids. At the Texas Instruments Hybrid Microelectronics Laboratory Jeanne implemented nitrogenfireable thick film for ceramic application in surface-mount technology and hybrids. For the last six years she has focused on the automated assembly and packaging of GaAs Monolithic Microwave Integrated Circuits and devices. This has encompassed development of fluxless furnace reflow and void-free vacuum reflow of GaAs components as well as development of automated wirebonding to GaAs Microwave Hybrids. She was instrumental in directly applying this technology to active phased array module production. Her efforts presently involve the implementation of high-volume techniques and automation for insertion of MMIC technology in a cost-effective highvolume environment. She has authored numerous papers involving hybrid fabrication and assembly technology and in particular involving automated assembly and packaging of GaAs MMIC devices. James E. Chapman Jr. was born in Dallas Texas in 1943. He received the BS and MS degrees in Electrical Engineering from Southern Methodist University (SMU) in 1966 and 1968 respectively. During this time he was associated with the Semiconductor Group of Texas Instruments Incorporated as an undergraduate engineering cooperative student working with various silicon products and processes. Mr. Chapman is currently a Senior Member of the Technical Staff assigned to the Microwave Technology and Products Division of the Defense Systems and Electronics Group. In this position he is currently technical director of the Technology Development for Solid-state Phased-Arrays (TDSSPA) Program. This program is a task-ordere
The application of computer-aided manufacturing (CAM) techniques to the assembly and test of a low-cost, high-volume X-band Radar T/R module will be investigated by highlighting the differences between low frequency a... 详细信息
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