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24th European Microelectronics and Packaging Conference, EMPC 2023

作者： Yin, Ran Morath, Helmuth P. E. Hoyer, Christian Nieweglowski, Krzysztof Meier, Karsten Wagner, Jens Ellinger, Frank Bock, Karlheinz Institute of Electronic Packaging Technology Technische Universität Dresden Germany Chair of Circuit Design and Network Theory Dresden Germany Technische Universität Chair of Circuit Design and Network Theory Department of Electrical and Computer Engineering Dresden Germany Institute of Electronic Packaging Technology Department of Electrical and Computer Engineering Technische Universität Dresden Germany

ISBN: (纸本)9780956808691

This work studies the effect of thinning down chips with transmission line structures for flexible embedding technology. Test chips with 90 Ω grounded coplanar waveguide (G-CPW) transmission lines have been designed and manufactured to characterize the high-frequency performance before and after embedding in sheet molding compound (SMC), and thinning down from 300 μm to 20 μm, Molding first technology enables single-die or multiple-die thinning with the embedding material while being held in the exact position, where the subsequent fan-out copper (Cu) redistribution layer (RDL) structuring realizes the direct contacts to the embedded chip, followed by semi-Additive manufacturing of traces. The embedded and thinned chips are characterized by S-parameter measurements in the frequency range from 20 MHz to 65 GHz using a vector network analyzer (VNA). The results show the feasibility of the examined embedding and thinning processes which are suitable for millimeter wave (mmWave) components as shown by the example of a G-CPW transmission line without degrading its RF performance in terms of characteristic impedance and attenuation. © 2023 IMAPS-Europe.

关键词： Millimeter waves

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Characterization of Embedded and Thinned RF Chips

Characterization of Embedded and Thinned RF Chips

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European Microelectronics and Packaging Conference, EMPC

作者： Ran Yin Helmuth P. E. Morath Christian Hoyer Krzysztof Nieweglowski Karsten Meier Jens Wagner Frank Ellinger Karlheinz Bock Centre for Tactile Internet with Human-in-the-Loop (CeTI) Institute of Electronic Packaging Technology Technische Universität Dresden Germany Centre for Tactile Internet with Human-in-the-Loop (CeTI) Chair of Circuit Design and Network Theory Technische Universität Dresden Germany Department of Electrical and Computer Engineering Chair of Circuit Design and Network Theory Technische Universität Dresden Germany Department of Electrical and Computer Engineering Institute of Electronic Packaging Technology Technische Universität Dresden Germany

This work studies the effect of thinning down chips with transmission line structures for flexible embedding technology. Test chips with 90 Ω grounded coplanar waveguide (G-CPW) transmission lines have been designed and manufactured to characterize the high-frequency performance before and after embedding in sheet molding compound (SMC), and thinning down from 300 µm to 20 µm, Molding first technology enables single-die or multiple-die thinning with the embedding material while being held in the exact position, where the subsequent fan-out copper (Cu) redistribution layer (RDL) structuring realizes the direct contacts to the embedded chip, followed by semi-additive manufacturing of traces. The embedded and thinned chips are characterized by S-parameter measurements in the frequency range from 20 MHz to 65 GHz using a vector network analyzer (VNA). The results show the feasibility of the examined embedding and thinning processes which are suitable for millimeter wave (mmWave) components as shown by the example of a G-CPW transmission line without degrading its RF performance in terms of characteristic impedance and attenuation.

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Near-field communications:characteristics,technologies,and engineering

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Frontiers of Information Technology & electronic engineering 2024年第12期25卷 1580-1626页

作者： Yajun ZHAO Linglong DAI Jianhua ZHANG Ran JI Mengnan JIAN Hao XUE Hongkang YU Yunqi SUN Yu LU Zidong WU Zhuo XU Jinke LI Haiyang MIAO Zhiqiang YUAN Pan TANG Jiayu SHEN Tierui GONG Haixia LIU Jiaqi HAN Qiang FENG Zhi CHEN Lingxiang LI Gang YANG Yong ZENG Cunhua PAN Wang LIU Kangda ZHI Weidong HU Yuanwei LIU Xidong MU Chau YUEN Mérouane DEBBAH Chongwen HUANG Long LI Ping ZHANG State Key Laboratory of Mobile Network and Mobile Multimedia Technology Shenzhen 518055China ZTE Corporation Beijing 100192China Department of Electronic Engineering Tsinghua UniversityBeijing 100084China State Key Laboratory of Networking and Switching Technology Beijing University of Posts and TelecommunicationsBeijing 100876China College of Information Science and Electronic Engineering Zhejiang UniversityHangzhou 310007China Key Laboratory of High Speed Circuit Design and EMC of Ministry of Education School of Electronic EngineeringXidian UniversityXi’an 710071China Collaborative Innovation Center of Information Sensing and Understanding Xidian UniversityXi’an 710071China National Key Laboratory of Wireless Communications University of Electronic Science and Technology of ChinaChengdu 611731China National Mobile Communications Research Laboratory Southeast UniversityNanjing 210096China Purple Mountain Laboratories Nanjing 211111China School of Electrical Engineering and Computer Science Technical University of BerlinBerlin 10623Germany School of Integrated Circuits and Electronics Beijing Institute of TechnologyBeijing 100081China Department of Electrical and Electronic Engineering The University of Hong KongHong KongChina Centre for Wireless Innovation(CWI) School of ElectronicsElectrical Engineering and Computer ScienceQueen’s University BelfastBelfast BT39DTUK School of Electrical and Electronic Engineering Nanyang Technological UniversitySingapore 639798Singapore KU 6G Research Center Khalifa University of Science and TechnologyAbu DhabiUnited Arab Emirates

Near-field technology is increasingly recognized due to its transformative potential in communication systems,establishing it as a critical enabler for sixth-generation(6G)telecommunication *** paper presents a comprehensive survey of recent advancements in near-field technology ***,we explore the near-field propagation fundamentals by detailing definitions,transmission characteristics,and performance ***,we investigate various near-field channel models—deterministic,stochastic,and electromagnetic information theory based models,and review the latest progress in near-field channel testing,highlighting practical performance and *** evolving channel models,traditional mechanisms such as channel estimation,beamtraining,and codebook design require redesign and optimization to align with near-field propagation *** then introduce innovative beam designs enabled by near-field technologies,focusing on non-diffractive beams(such as Bessel and Airy)and orbital angular momentum(OAM)beams,addressing both hardware architectures and signal processing frameworks,showcasing their revolutionary potential in near-field communication ***,we highlight progress in both engineering and standardization,covering the primary 6G spectrum allocation,enabling technologies for near-field propagation,and network deployment ***,we conclude by identifying promising future research directions for near-field technology development that could significantly impact system *** comprehensive review provides a detailed understanding of the current state and potential of near-field technologies.

关键词： 6G Near-field technology Channel model Codebook Non-diffractive beams Orbital angular momentum engineering and standardization

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Energy-Efficient Transceivers for Ultra-Highspeed computer Board-to-Board Communication

Energy-Efficient Transceivers for Ultra-Highspeed Computer B...

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IEEE International Conference on Ubiquitous Wireless Broadband, ICUWB 2015

作者： Jenning, Michael Klein, Bernhard Hahnel, Ronny Plettemeier, Dirk Fritsche, David Tretter, Gregor Carta, Corrado Ellinger, Frank Nardmann, Tobias Schroter, Michael Nieweglowski, Krzysztof Bock, Karlheinz Israel, Johannes Fischer, Andreas Ul Hassan, Najeeb Landau, Lukas Dörpinghaus, Meik Fettweis, Gerhard Department for RF Engineering Faculty of Electrical and Computer Engineering Technische Universität Dresden Germany Department for Circuit Design and Network Theory Faculty of Electrical and Computer Engineering Technische Universität Dresden Germany Department for Electron Devices and Integrated Circuits Faculty of Electrical and Computer Engineering Technische Universität Dresden Germany Electronic Packaging Lab Faculty of Electrical and Computer Engineering Technische Universität Dresden Germany Department of Numerical Optimization Department of Mathematics Technische Universität Dresden Germany Vodafone Department Mobile Communications Systems Faculty of Electrical and Computer Engineering Technische Universität Dresden Germany

ISBN: (纸本)9781467365550

Enabling the vast computational and throughput requirements of future high performance computer systems and data centers requires innovative approaches. In this paper, we will focus on the communication between computer boards. One alternative to the bottleneck presented by copper wire based cable-bound communication is the deployment of wireless links between nodes consisting of processors and memory on different boards in a system. In this paper, we present an interdisciplinary approach that targets an integrated wireless transceiver for short-range ultra-high speed computer board-to-board communication. Based on our achieved results and current developments, we will also estimate energy consumption of such a transceiver. © 2015 IEEE.

关键词： Energy utilization

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Reliability study and failure analysis of fine pitch solder bumped flip chip on low-cost printed circuit board substrate

Reliability study and failure analysis of fine pitch solder ...

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electronic Components and Technology Conference (ECTC)

作者： Guo-Wei Xiao P.C.H. Chan A. Teng P.S.W. Lee M.M.F. Yuen Department of Electrical and Electronic Engineering Hong Kong University of Science and Technology Hong Kong China Computer Aided Design & Manufacturing Facility Hong Kong University of Science and Technology Hong Kong China Department of Mechanical Engineering Hong Kong University of Science and Technology Hong Kong China

ISBN: (纸本)0780370384

The design and proper selection of low-cost printed circuit board (PCB) is essential to the reliability and formation of solder joints for the fine-pitch solder-bumped flip-chip on board (FCOB) technology. By nature low-cost PCBs don't have the precision in patterns like the fine-pitch solder-bumped flip-chip technology. In this study, eutectic solder bumps (63Sn/37Pb) were electroplated on the test-chips with various pad pitches and chip sizes. Several types of low-cost PCB designs were evaluated for the fine-pitch solder-bumped flip-chip. The effects of different PCB designs on the formation and shapes of solder joints were studied. The location and formation of voids in the underfill depend on the design and properties of the PCB. The alignment accuracy of the solder mask opening area and the copper pad on the PCB is very critical for the reliability of FCOB technology. The acceptable mis-registration on the low-cost PCB decreases as the chip size increases. Scanning acoustic microscope (SAM), X-ray imaging system, cross-sectioning, scanning electron microscopy (SEM) were used to evaluate and inspect the samples after the thermal cycling test and temperature-humidity test. The solder joint failure modes after thermal tests were studied.

关键词： Failure analysis Flip chip Soldering electronic packaging thermal management Printed circuits Scanning electron microscopy Acoustic testing System testing Bonding Silicon

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Study on failure mode of solder bump fabricated using eutectic solder electroplating process

Study on failure mode of solder bump fabricated using eutect...

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International Symposium on electronic Materials and Packaging

作者： Guo-wei Xiao P.C.H. Chan A. Teng Jian Cai M.M.F. Yuen Department of Electrical and Electronic Engineering Hong Kong University of Science and Technology Hong Kong China Computer Aided Design & Manufacturing Facility Hong Kong University of Science and Technology Hong Kong China Department of Mechanical Engineering Hong Kong University of Science and Technology Hong Kong China

ISBN: (纸本)0780366549

The electroplating-based flip chip process has many advantages over other solder bumping methods, where the bump fabrication process can affect the reliability of solder joints. In this paper, the effect of the UBM and electroplating process of the solder bump on the shear strength of the solder bump is studied, as well as the relationship between the shear test failure mode and solder bump fabrication process. It is reported that the Cu surface roughness is affected by the Cu plating current density and the appropriate current density is in a range from 10/spl sim/40 mA/cm/sup 2/. The solder bump plating process temperature should be within 30-35/spl deg/C. It is observed that the growth kinetics of intermetallic compound formation are affected by the Cu stud structure. The ratio of Cu/sub 3/Sn to the total Cu-Sn IMC layer thickness was from 0.5 to 0.15 with various Cu microstructures at 150/spl deg/C during thermal aging tests. The activation energy was in the range of 0.78 eV to 1.14 eV. Five shear test failure modes are analyzed which are related to the electroplating process.

关键词： Testing Fabrication Current density Flip chip Soldering Rough surfaces Surface roughness Temperature Kinetic theory Intermetallic

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Structure verification on photolithographic masks based on tolerance criteria by cellular neural networks

Structure verification on photolithographic masks based on t...

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IEEE International Workshop on Cellular Nanoscale Networks and their Applications, (CNNA)

作者： S. Schwarz A. Pohl W. Mathis Theory and Computer Aided Design of Electronic Circuit Department of Electrical Engineering University of Wuppertal Wuppertal Germany Bergische Universitat Wuppertal Wuppertal Nordrhein-Westfalen DE

First of all, the problem of structure verification is introduced with respect to tolerance criteria and their verifications. After that, the basic principle of a verification method for cellular neural networks is motivated by means of local restrictions. Then their solution is presented on the basis of local operators which are only designed with the help of local restrictions of the design rules of the mask structures and their tolerance zones. After that, the result of the successful use of the method is demonstrated on manufacturing and calibration masks. Finally, the debate discusses the competitive position of the method with reference to two standard methods. Last of all, the summary indicates future improvements.

关键词： Cellular neural networks Neural networks Manufacturing Inspection Image processing Cellular networks computer networks electronic circuits Calibration Lithography

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Analysis of nonreciprocal mode-conversion properties of magnetooptic channel waveguides using the finite element method

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electronicS AND COMMUNICATIONS IN JAPAN PART II-electronicS 1996年第10期79卷 32-39页

作者： Zhuang, XP Koshiba, M Tsuji, Y Faculty of Engineering Hokkaido University Sapporo Japan 060 Graduated from the Department of Communication Engineering Guellin Electronic Institute China in 1986. She received her M.S. degree from Hokkaido University in 1991 and was admitted to the doctoral program. She has been engaged in research on the optimum design of magnetooptic waveguides for nonreciprocal optical devices. Graduated in 1971 from the Department of Electronic Engineering Hokkaido University where he received his M.S. degree in 1973 and his Dr. of Eng. degree in 1976. In 1976 he became a Lecturer in the Department of Electronic Engineering Kitami Institute of Technology where he was promoted to Associate Professor in 1977. In 1979 he became an Associate Professor at Hokkaido University where he was promoted to Professor in 1987. He has been engaged in research on optical and wave electronics. In 1987 he received a Best Paper Award. He is the author ofFundamentals of Finite Element Method of Optics and Waves(Morigkata Publ.)Optical Waveguide Analysis(Asakura Publ.)Optical Waveguide Analysis(McGraw-Hill Book Co.) andOptical Waveguide Theory by the Finite Element Method(KTK Scientific Publishing/Kulwer Academic Publishers). He is also co-author of one book and has written chapters in six other books. He is a member of the Institute of Television Engineers of Japan the Institute of Electrical Engineers of Japan the Japan Society for Simulation Technology the Japan Society for Computational Methods in Engineering and the Japan Society of Applied Magnetics and Mechanics. He is also an IEEE Senior Member. Graduated in 1991 from me Department of Electronic Engineering Hokkaido University where he received his M.S. degree in 1993. He is currently in the doctoral program. He has been engaged in research on quantum wave phenomena and computer-aided design of optical and quantum effect devices.

To evaluate nonreciprocal mode conversion characteristics in a magnetooptic channel waveguide, a finite element analysis based on the scalar wave approximation is formulated for the first time. A simple iterative calculation method is conceived for solution of the nonlinear eigenvalue equations finally obtained in which the two polarizations are coupled. Specifically, the maximum isolation ratio in the mode-conversion-type magnetooptic rib guide was evaluated and the validity of the method is confirmed by comparison with published experimental results.

关键词： nonreciprocal optical devices magnetooptic waveguide nonreciprocal mode conversion finite element method numerical analysis

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NEURAL-NETWORK APPROACH TO THE SOLUTION OF LINEAR COMPLEMENTARITY-PROBLEMS

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INTERNATIONAL JOURNAL OF NUMERICAL MODELLING-electronic NETWORKS DEVICES AND FIELDS 1995年第6期8卷 431-445页

作者： OSOWSKI, S Institute of the Theory of Electrical Engineering and Electrical Measurements Technical University Warsaw Poland Stanislaw Osowski was born in Poland in 1948. He received the Dipl. Ing. Dr. Ing. and Dr Ing. Habil. degrees from the Technical University of Warsaw Poland in 1972 1975 and 1981 respectively all in electrical engineering. At present he is a professor at the Institue of Theory of Electrical Engineering and Electrical Measurements Technical University of Warsaw. His research and teaching interests are in the area of neural networks optimization techniques and computer-aided circuit analysis and design.

The paper presents the application of nonlinear neural optimization networks to solve the linear complementarity problem. Two different approaches are presented and investigated: one leading to linear and the second t... 详细信息

关键词： Neural networks

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CONCURRENT LARGE-SIGNAL SIMULATION OF AN ACTIVE MICROSTRIP ANTENNA

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INTERNATIONAL JOURNAL OF NUMERICAL MODELLING-electronic NETWORKS DEVICES AND FIELDS 1995年第1期8卷 3-12页

作者： MCDOWALL, DS FUSCO, VF High Frequency Electronics Laboratory. Department of Electrical and Electronic Engineering The Queen's University of Belfast Ashby Building Stranmillis Road Belfast BT9 5AH U.K. D. Stewart McDowall was born in Dublin Republic of Ireland in 1967. He received the M. Eng. degree in Electrical and Electronic Engineering from the Queen's University of Belfast in 1990. In the same year he was presented with a Distinction Award from the Departmnet of Education of Northern Ireland and he is currently pursuing his Ph.D. in the Microwave Research Group at Q.U.B. His principal research area is the electromagnetic field mapping of microwave systems using concurrent programming. He is an Associate Member of the Institute of Electrical Engineers. Vincent F. Fusco was educated at the Queens's University of Belfast where he obtained the degree of Ph.D. in 1982. He has worked as a research engineer on short-range radar and radio telemetry systems. Currently he is a reader in Microwave Communications in the School of Electrical engineering and Computer Science the Queen's University of Belfast. His current research interests include non-linear microwave circuit simulatino and concurrent programming techniques for electromagnetic field problems with particular emphasis on EMC applications. He has published numerous research papers in these areas. He is the author of the bookMicrowave Circuits Analysis and Computer Aided Design Prentice-Hall 1987. Dr Fusco is a Chartered Electrical Engineer and a Member of the Institute of Electrical Engineers.

This paper details the use of a circuit-based EM modelling technique combined with a harmonic balance simulator used to model the radiation from the microstrip bodies comprising an active antenna circuit. The modelling approach adopted for the planar bodies in the circuit will be shown to allow the use of concurrent algorithms in order to reduce overall computational time.

关键词： Microstrip antennas

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