Printable,flexible ceramic fiber paper based on electrospinning

作     者：Yong-Shuai Xie Yuan Cheng Yang Lyu Rui Li Jie-Cai Han Yong-Shuai Xie;Yuan Cheng;Yang Lyu;Rui Li;Jie-Cai Han

作者机构：National Key Laboratory of Science and Technology on Advanced Composites in Special EnvironmentsHarbin Institute of TechnologyHarbin 150001China State Key Laboratory of Intelligent Manufacturing Equipment and TechnologyHuazhong University of Science and TechnologyWuhan 430074China 

出 版 物：《Rare Metals》 (稀有金属（英文版）)

年 卷 期：2024年第43卷第6期

页      面：2739-2746页

核心收录：

学科分类：082903[工学-林产化学加工工程] 08[工学] 0829[工学-林业工程] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 082201[工学-制浆造纸工程] 0822[工学-轻工技术与工程] 

基　　金：financially supported by the National Natural Science Foundation of China(Nos.52202090 and 52102093) China Postdoctoral Science Foundation(No.2021M690817) Heilongjiang Provincial Postdoctoral Science Foundation(Nos.LBH-Z21050 and LBH-Z20144) the State Key Laboratory of Intelligent Manufacturing Equipment and Technology(No.IMETKF2023004) 

主　　题：Ceramic fiber paper High temperature Inkjet printing Flexible electronic 

摘      要：Based on the fact that it is challenging for the polymer flexible circuit substrates to meet the requirements of serving in high-temperature environments,this work proposed the idea of using printable ceramic fiber paper as a high-temperature flexible circuit substrate.A ceramic fiber paper with all ceramic components had been developed via electrospinning,solving the problems of low strength and severe strength drop at high temperatures of traditional ceramic fiber *** tensile strength of the prepared ceramic fiber paper is 2.63 MPa,and the reliable service temperature is 1200℃.Its bulk density is about 1.5 times that of traditional ceramic fiber *** can be printed with patterns by commercial inkjet printers like ordinary printing paper and has excellent *** feasibility of ceramic fiber paper as a flexible circuit substrate was verified by constructing a simple *** the fiber paper is significantly bent,the circuit still forms a complete path,which proves that it has a strong application potential for high-temperature flexible circuit substrate and is expected to promote the development of flexible electronic devices serving at extreme high-temperature environments.