Low Temperature Sintering Mechanism of MOD-Assisted Ag Paste for Power Electronics: Experiment and Molecular Dynamic Study

作     者：Liu, Li Ma, Haojie Chen, Chuantong Xu, Zixuan Zou, Yiwen Nong, Liting Xu, Xiyu Wang, Xuanguo Chen, Zhiwen 

作者机构：School of Materials Science and Engineering Wuhan University of Technology Hubei Wuhan China The Institute of Technological Science Wuhan University Hubei Wuhan China State Key Laboratory of Advanced Welding and Joining Harbin Institute of Technology Heilong Jiang Harbin China Flexible 3D System Integration Laboratory SANKEN Osaka University Osaka Japan Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration Wuhan University Hubei Wuhan China 

出 版 物：《SSRN》 

年 卷 期：2024年

核心收录：

摘      要：This study investigates the low-temperature sintering of micro-silver pastes enhanced with metal organic decomposition (MOD) additives including propylamine, octylamine and 1,2-propylenediamine, focusing on their thermal properties, decomposition mechanisms, and sintering behaviors. The results show that all MOD additives decompose below 200°C, making them suitable for low-temperature sintering. Among them, the propylamine-based MOD (MOD 1) performs the best by yielding smaller silver particles (105.34 nm) with minimal residue. Molecular dynamics (MD) simulations reveal that MOD 1 decomposes by releasing gases (H₂, CH₄, C₂H₄) and forming silver complexes, which promotes the silver particle aggregation and Ag-C bond formation. Additionally, four types of silver particles in spherical and flaky forms were further studied. It was found that flaky micro-sized particles exhibited better sintering performance than spherical submicron particles with reduced porosity, lower resistivity, and higher shear strength. These findings highlight the superior performance of MOD 1 in enhancing its sintering properties of silver pastes, showing great potential in the low-temperature sintering for power electronics. © 2024, The Authors. All rights reserved.