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作者机构:Hangzhou Institute of Technology and School of MicroelectronicsXidian University Zhejiang Lab College of Integrated CircuitsZhejiang University Key Laboratory of Microelectronics Devices and Integrated TechnologyInstitute of MicroelectronicsChinese Academy of Sciences
出 版 物:《Science China(Information Sciences)》 (中国科学:信息科学(英文版))
年 卷 期:2025年第68卷第2期
页 面:395-396页
核心收录:
学科分类:080903[工学-微电子学与固体电子学] 0809[工学-电子科学与技术(可授工学、理学学位)] 08[工学] 080501[工学-材料物理与化学] 0805[工学-材料科学与工程(可授工学、理学学位)] 080502[工学-材料学] 081201[工学-计算机系统结构] 0812[工学-计算机科学与技术(可授工学、理学学位)]
基 金:supported in part by National Key R&D Program of China (Grant No.2023YFB4402303) National Natural Science Foundation of China (Grant Nos. 62204228, 62204229, 62204226, 62025402,91964202)
主 题:Ferroelectric devices
摘 要:HfO2-based ferroelectric field-effect transistor(Fe FET) has become a promising solution for next-generation embedded non-volatile memory(NVM) owing to its complementary metal-oxide-semiconductor(CMOS) compatibility,small footprint, high performance, and non-destructive readout [1]. Recent research of HfO2-based Fe FET has focused on the device operation mechanisms as well as reliability issues such as the interplay between polarization switching and charge trapping/detrapping [2], read-after-write latency [3] and endurance degradation [4].