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Integrated Temperature and Stress Sensors in Fan-Out Wafer-Level Packaging to Better Achieve the Third-Generation Reliability of Electronic Systems

作     者:Cao, Linwei Wang, Yuexing Liu, Kun Zhang, Xiangou Deng, Shuairong Zhou, Quanfeng Sun, Xiangyu Zhang, Wanli 

作者机构:China Acad Engn Phys Inst Elect Engn Mianyang 621999 Peoples R China China Acad Engn Phys Microsyst & Terahertz Res Ctr Chengdu 610200 Peoples R China Univ Elect Sci & Technol China Sch Elect Sci & Engn State Key Lab Elect Thin Films & Integrated Device Chengdu 610054 Peoples R China 

出 版 物:《IEEE TRANSACTIONS ON RELIABILITY》 (IEEE Trans Reliab)

年 卷 期:2025年

核心收录:

学科分类:0808[工学-电气工程] 08[工学] 0835[工学-软件工程] 0812[工学-计算机科学与技术(可授工学、理学学位)] 

基  金:Natural Science Foundation of China 

主  题:Temperature sensors Stress Sensors Temperature measurement Silicon Monitoring Consumer electronics Sensor systems Piezoresistive devices Piezoresistance Embedded sensor fan-out wafer-level packaging (FOWLP) prognostics and health management (PHM) reliability 

摘      要:To satisfy the developmental requirements of applications, such as autonomous driving, high-performance computing, and the Internet of Things (IoT), the integration density, performance, and reliability tradeoff of electronic systems are posing numerous challenges. Prognostics and health management (PHM) using multiple types of sensors can address reliability problems and enhance the functional safety of electronic systems. However, the limited integration density of conventional electronic packaging indicates that functional chips can only replace sensor chips for physical quantity monitoring, without simultaneous functional degradation monitoring and fault identification. This study proposed an integration method that is compatible with front and rear processes to integrate temperature and stress sensors into the power-driven module, that is, fan-out wafer-level packaging technology. First, the temperature and stress sensors are calibrated using a microloading platform and sensitivity consistency is ensured. Second, the temperature inside the module under various working conditions is evaluated using the data obtained by temperature sensors. The stress data inside the micromodule under mechanical loading are obtained through stress sensors. The proposed method can realize in situ monitoring inside advanced packaging and provide considerable data for PHM research.

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