An Intrinsic Circuit Model for Multiple Vias in an Irregular Plate Pair Through Rigorous Electromagnetic Analysis

作     者：Zhang, Yao-Jiang Fan, Jun 

作者机构：Missouri Univ Sci & Technol Electromagnet Compatibil Lab Dept Elect & Comp Engn Rolla MO 65409 USA 

出 版 物：《IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES》 (IEEE Trans. Microwave Theory Tech.)

年 卷 期：2010年第58卷第8期

页      面：2251-2265页

核心收录：

学科分类：0808[工学-电气工程] 08[工学] 

主　　题：Intrinsic via circuit model parallel-plate modes physics-based via circuit model segmentation technique signal and power integrity 

摘      要：An irregular plate pair with multiple vias is analyzed by the segmentation method that divides the plate pair into a plate domain and via domains. In the via domains, all the parallel-plate modes are considered, while in the plate domain, only the propagating modes are included to account for the coupling among vias and the reflection from plate edges. Boundary conditions at both vias and plate edges are enforced and all parasitic components of via circuit are expressed analytically in terms of parallel-plate modes. The work presented in this paper indicates that a previous physics-based via circuit model from intuition is a low-frequency approximation. Analytical and numerical simulations, as well as measurements, have been used to validate the intrinsic via circuit model.