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Analytical Prediction of Crosstalk Among vias in Multilayer Printed circuit Boards

IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY 2012年第2期54卷 413-420页

作者： Wu, Songping Fan, Jun Cisco Syst Inc San Jose CA 95134 USA Missouri Univ Sci & Technol EMC Lab Rolla MO 65401 USA

Crosstalk among vias is a significant problem in highspeed multilayer printed circuit boards (PCBs), deteriorating signal quality and increasing jitter, especially when circuit density is high. In this paper, a two-step via crosstalk evaluation procedure is proposed. A fast approach for crosstalk estimation is developed for net screening as the first step. Then, more accurate but more time-consuming modeling can be performed for critical nets or the problematic nets identified in the screening. The main contribution of this study includes the analytical prediction of crosstalk among vias based on an infinite parallel-plane assumption. Its effectiveness and efficiency to predict the trends in the crosstalk among vias in practical PCB designs are demonstrated.

关键词： physics-based via circuit model printed circuit board (PCB) signal integrity via crosstalk via models

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An Intrinsic circuit model for Multiple vias in an Irregular Plate Pair Through Rigorous Electromagnetic Analysis

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IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES 2010年第8期58卷 2251-2265页

作者： Zhang, Yao-Jiang Fan, Jun Missouri Univ Sci & Technol Electromagnet Compatibil Lab Dept Elect & Comp Engn Rolla MO 65409 USA

An irregular plate pair with multiple vias is analyzed by the segmentation method that divides the plate pair into a plate domain and via domains. In the via domains, all the parallel-plate modes are considered, while in the plate domain, only the propagating modes are included to account for the coupling among vias and the reflection from plate edges. Boundary conditions at both vias and plate edges are enforced and all parasitic components of via circuit are expressed analytically in terms of parallel-plate modes. The work presented in this paper indicates that a previous physics-based via circuit model from intuition is a low-frequency approximation. Analytical and numerical simulations, as well as measurements, have been used to validate the intrinsic via circuit model.

关键词： Intrinsic via circuit model parallel-plate modes physics-based via circuit model segmentation technique signal and power integrity

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Recent Development of via models: Hybrid circuit and Field Analysis

Recent Development of Via Models: Hybrid Circuit and Field A...

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IEEE Electrical Design of Advanced Package and Systems Symposium

作者： Zhang, Yao-Jiang Fan, Jun Missouri Univ Sci & Technol EMC Lab Rolla MO 65401 USA

ISBN: (纸本)9781424490684

via-plate interaction can be modeled as lumped circuits for vias and a two-dimensional field problem for the plate domain. The accuracy of the improved intrinsic via model and the conventional physics-based via model is investigated by comparing them with either analytical formula or numerical simulations for a via in a circular plate pair with various edge boundary conditions. It is found that the intrinsic via model matches very well with both the analytical formula and numerical solutions in all the examples studied. However, the physics-based via model is only an acceptable approximation at low frequencies and its accuracy is not dependent on the plate size but on the via itself. It is observed that the physics-based via model is more accurate for a plate par with smaller plate separations.

关键词： Hybrid circuit and field analysis intrinsic via circuit model physics-based via circuit model via-plate interactions

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