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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"
1419 条 记 录,以下是181-190 订阅
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Mechanical simulation and modeling for reliability of 6-in-1 power module
Mechanical simulation and modeling for reliability of 6-in-1...
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Electronic Components and Technology conference (ECTC)
作者: Rathin Mandal Kazunori Yamamoto Gongyue Tang Institute of Microelectronics A*STAR (Agency for Science Technology and Research) Singapore
numerical modeling and simulation of temperature cycling test (TCT) and power cycling test (PCT) are applied to the design reliability analysis for a proposed 6-in-1 power module (PM) package. The fatigue life for bot...
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An adaptive simulation framework for AMS-RF test quality
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INTEGRATION-THE VLSI JOURNAL 2020年 73卷 10-17页
作者: Gutierrez, Valentin Leger, Gildas Univ Seville Inst Microlectron Sevilla CSIC Av Amer Vespucio 28 Seville 41092 Spain
Ensuring the quality of a circuit implies ensuring the quality of test. Despite the fact that performance-based testing has been the golden standard for Analog, Mixed-Signal and RF test for decades, high-reliability m... 详细信息
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design of a real-time face detection architecture for heterogeneous systems-on-chips
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INTEGRATION-THE VLSI JOURNAL 2020年 74卷 1-10页
作者: Spagnolo, Fanny Perri, Stefania Corsonello, Pasquale Univ Calabria Dept Informat Modeling Elect & Syst Engn I-87036 Arcavacata Di Rende Italy Univ Calabria Dept Mech Energy & Management Engn I-87036 Arcavacata Di Rende Italy
Object detection represents one of the most important and challenging task in computer vision applications. Boosting-based approaches deal with computational intensive operations and they involve several sequential ta... 详细信息
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FEA simulation and modeling for fan-out package design
FEA simulation and modeling for fan-out package design
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Electronics Packaging Technology conference (EPTC)
作者: Rathin Mandal A-STAR Institute of Microelectronics
The fan-out package technology is introduced for package miniaturization, better electrical performance and lower cost. In this paper we are presenting wafer level warpage prediction followed by package stress and war... 详细信息
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Substrate design Optimization of Fine Pitch FCCSP for Molded Underfill Void Free Evaluation
Substrate Design Optimization of Fine Pitch FCCSP for Molded...
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Electronics Packaging Technology conference (EPTC)
作者: Freedman Yen Vito Lin Yu-Po Wang Cooperate R & D Siliconware Precision Industries Co. Ltd. Tantzu Taichung Taiwan
The microelectronics products of Flip Chip-Chip Scale Package (FCCSP) with more increasing challenges are faced to assure molding capability with rapid advances in flip chip technology such as decreasing stand-off hei... 详细信息
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Temperature Compensation on SRAM-Based Computation in Memory Array
Temperature Compensation on SRAM-Based Computation in Memory...
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International SoC design conference, ISOCC
作者: Qibang Zang Wang Ling Goh Fei Li Lu Lu Anh Tuan Do School of EEE Nanyang Technological University Singapore Institute of Microelectronics A*STAR Singapore
Compute in memory (CIM) is a promising solution for Edge AI applications. However, previous researches on CIM focus more on performance and power efficiency (TOPS/W) improvement, while less considerations on PVT effec... 详细信息
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Circuitry of Micro-Power JFET and CMOS Input Differential Stages for Op-Amps on Silicon and Wide-Band Semiconductors
Circuitry of Micro-Power JFET and CMOS Input Differential St...
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Siberian conference on Control and Communications (SIBCON)
作者: Vladislav Chumakov Nikolay Prokopenko Alexey Titov Don State Technical University Rostov-on-Don Russia Institute for Design Problems in Microelectronics of RAS Don State Technical University Rostov-on-Don Zelenograd Russia Southern Federal University Rostov-on-Don Russian Federation
The study presents an analysis of universal JFET and CMOS differential stages (DS) circuits. Such cascades provide a smaller range of transistor currents (10-100 $\mu$A) compared to classical cascades. The described D... 详细信息
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A robust and automated methodology for the analysis of Time-Dependent Variability at transistor level
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INTEGRATION-THE VLSI JOURNAL 2020年 72卷 13-20页
作者: Saraza-Canflanca, P. Diaz-Fortuny, J. Castro-Lopez, R. Roca, E. Martin-Martinez, J. Rodriguez, R. Nafria, M. Fernandez, F., V Univ Seville Inst Microelect Sevilla CSIC IMSECNM Seville Spain UAB Elect Engn Dept REDEC Grp Barcelona Spain
In the past few years, Time-Dependent Variability has become a subject of growing concern in CMOS technologies. In particular, phenomena such as Bias Temperature Instability, Hot-Carrier Injection and Random Telegraph... 详细信息
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modeling advanced spintronic based magnetoresistive memory
Modeling advanced spintronic based magnetoresistive memory
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International conference on Microwave & THz Technologies, Wireless Communications and OptoElectronics (IRPhE 2022)
作者: S. Fiorentini M. Bendra J. Ender T. Hadámek W. J. Loch N. P. Jθrstad R. Orio W. Goes S. Selberherr V. Sverdlov Christian Doppler Laboratory for Nonvolatile Magnetoresistive Memory and Logic at the Institute for Microelectronics TU Wien Austria Institute for Microelectronics TU Wien Austria Silvaco Europe Ltd. Cambridge United Kingdom
Spintronic based magnetoresistive memory shows an increasing potential in replacing conventional charge based memory for stand-alone and embedded applications. Accurate simulation tools, providing a comprehensive eval... 详细信息
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Multidomain modeling for Reliability Evaluation of Devices and Microsystems Using Verilog-A
Multidomain Modeling for Reliability Evaluation of Devices a...
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International conference on Mixed design of Integrated Circuits and Systems (MIXDES)
作者: Jean-Baptiste Kammerer Maroua Garci Achraf Kaï d Fabrice Roqueta Fabien Pr&#x00E9 galdiny Luc H&#x00E9 brard ICube Strasbourg France STMicroelectronics Tours France
With the continuous increase in integration density, the dissipated power density has reached a critical level and thermal issues are now a major concern. Currently, evaluating the thermal behavior of a chip is genera... 详细信息
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