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11th conference on ph.d. research in microelectronics and electronics, PRIME 2015

ISBN: (纸本)9781479982295

The proceedings contain 98 papers. The topics discussed include: techniques for maximizing input handling and improving linearity of gain interpolating VGAs;a low voltage operational amplifier cell with extended input common mode range for high voltage current sensing applications;reliability analysis of comparators;integrated differential three-level high-voltage pulser output stage for CMUTs;communication energy constrained spare core on NoC;Optimized electrochemical detection of anti-cancer drug by carbon nanotubes or gold nanoparticles;WarmPie: a bare-bones implementation of message passing interface for embedded many-cores;design of a high gain organic comparator for use in low-cost smart sensor systems;variable latency speculative Han-Carlson adders topologies;and effective control strategy for photovoltaic cascaded h-bridge inverters developed on FPGA platform.

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design of microstrip transition to substrate integrated waveguide fed slot antenna for 60 GHz applications 2nd

Design of microstrip transition to substrate integrated wave...

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2nd International conference on Micro-electronics, Electromagnetics and Telecommunications, ICMEET 2016

作者： Nanda Kumar, M. Shanmuganantham, T. Department of Electronics Engineering Pondicherry University Puducherry India

ISBN: (纸本)9789811042799

Substrate integrated waveguide is a good candidate for implementing millimeter wave applications. This paper presents microstrip transition to substrate integrated waveguide fed slot antenna for 60 GHz applications, which is developed by Rogers RT/duroid 5880 with a dielectric constant of 2.2, substrate height of 0.381 mm and metallization thickness is 0.025 mm. The simulation results show that reflection coefficient, VSWR, gain, radiation efficiency, and radiation pattern. Obtained 3.1 GHz impedance bandwidth with respect to −10 dB reflection coefficient and also preserve 44.28% bandwidth over 57–64 GHz band. © Springer Nature Singapore Pte Ltd. 2018.

关键词： Printed circuit boards

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Board 65: Work in progress: Growing and sustaining a successful collaboration of programs developing and implementing experimental centric pedagogy 126

Board 65: Work in progress: Growing and sustaining a success...

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126th ASEE Annual conference and Exposition: Charged Up for the Next 125 Years, ASEE 2019

作者： Scott, Craig J. Aybar, Joi d. Abraham, Shiny Albin, Sacharia Andrei, Petru Attia, John Okyere Chouikha, Mohamed F. Bernadin, Shonda L. Connor, Kenneth A. dabipi, Ibibia K. Eldek, Abdelnasser A. Geddis, demetris James-Okeke, Petronella A. Kelly, John Carey Leigh-Mack, Pamela Morales, Juan C. Ndoye, Mandoye Nyarko, Kofi Oni, Ben O. Quinones, Stella A. Reece, Michel A. Zhang, Lei Zein-Sabatto, Saleh Morgan State University United States Seattle University United States Norfolk State University United States Florida A&M University Florida State University United States Prairie View A&M University United States Rensselaer Polytechnic Institute United States University of Maryland Eastern Shore United States Jackson State University United States Hampton University United States North Carolina A&T State University United States Virginia State University United States Department of Mechanical Engineering Universidad del Turabo PO Box 3030 Gurabo00778 Puerto Rico Tuskegee University United States University of Texas El Paso United States Tennessee State University United States

To date, this process has yielded a fully chartered 501(c)(3) non-profit organization and a successfully funded REU-RET Mega-Site: research Experiences for Undergraduates and Teachers in Smart and Connected Cities. The collaboration between the now 16 institutions within the ECP community will have a positive long-term impact on the development of new cooperative efforts in technical research, engineering education research and curriculum development for minority-serving institutions and is expected to have a significant impact on the retention and graduation of engineering students. © American Society for Engineering Education, 2019

关键词： Curricula

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Numerical approach of biological tissues/thin layer sensor interface behavior quantification

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AIP conference Proceedings 2020年第1期2293卷

作者： Marwa Sawan Hilal Reda Nadine Saad Georges Nassar Mohammad Hammoud 1Ph.D student Institute of Electronics Microelectronics and Nanotechnology Opto-Acousto-Electronic Department University Polytechnic Hauts-De-France Valenciennes France 2Faculty of Engineering Lebanese University Hadath Campus Lebanon 3Faculty of Science Lebanese University Fanar Campus Lebanon 4Lecturer Institute of Electronics Microelectronics and Nanotechnology Opto-Acousto-Electronic Department University Polytechnic Hauts-De-France Valenciennes France 5SDM Research Group International University of Beirut BIU Beirut Lebanon

In this paper, we investigate the behavior of biological tissues coupled to a substrate (sensor) based on a numerical model taking into account the relationship between strain/stress components at the interface. Based on this study, the most appropriate biomechanical factors are understood and quantified in order to optimize the sensor/biological tissue interface conditions. A micromechanical description based on a mathematical formulation has been developed to evaluate the biomechanical behavior provided by a 20 viscoelastic model of Kelvin-Voigt. Based on the results, it appears that the model can be used effectively to characterize in-vivo the dynamic properties of soft tissues in order to adapt the biophysical properties of flexible sensors dedicated to optimal adhesion.

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Inkjet-Printed Patch Antennas for Wireless Chip-to-Chip Communication on Flexible Substrates 13

Inkjet-Printed Patch Antennas for Wireless Chip-to-Chip Comm...

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13th conference on ph.d. research in microelectronics and electronics (PRIME) / International conference on Synthesis, Modeling, Analysis and Simulation Methods and Application to Circuit design (SMACd)

作者： Hirmer, Quirin Albrecht, Andreas Bobinger, Marco Loch, Marius Haider, Michael Russer, Johannes A. Becherer, Markus Lugli, Paolo Tech Univ Munich Inst Nanoelect Arcisstr 21 D-80333 Munich Germany Free Univ Bozen Bolzano Univ Pl 1 I-39100 Bolzano Bolzano Italy

ISBN: (纸本)9781509065080

Printed electronics become more and more relevant for applications in wearable electronics and sensors. Inkjet printing of silver nano-particles can be done at very low cost with a reasonably high precision and conductivity. In this paper, we investigate flexible patch antennas for wireless chip-to-chip communication scenarios, rapidly prototyped using an inkjet printing process. A patch antenna with a return loss of almost -20 dB at a resonance frequency of 2.09 GHz that agrees well with the conducted simulations is presented.

关键词： Substrates Printing Ink Silver Permittivity Patch antennas

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Guest Editorial for IRSP 2018 conference

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IEEE TRANSACTIONS ON dEVICE ANd MATERIALS RELIABILITY 2018年第4期18卷 487-489页

作者： Budiman, Arief Suriadi Gan, Chee Lip Pey, Kin-Leong Sukharev, Valeriy Thomas, Olivier Singapore Univ Technol & Design Engn Prod Dev Singapore 487372 Singapore Nanyang Technol Univ Sch Mat Sci & Engn Singapore Singapore Singapore Univ Technol & Design Singapore 487372 Singapore Mentor Design To Silicon Calibre Fremont CA 94538 USA Aix Marseille Univ Inst Mat Microelect & Nanosci Provence F-13397 Marseille France

Stress is always an important factor in designing next generations of electronics devices and systems. It certainly has been paramount for the success of the microelectronics industry and the next generations of 3d Integrated Circuits (IC) design and packaging technologies. The papers presented in this special section were presented at the IRSP 2018 conference.

关键词： Special issues and sections Stress control Strain control Mechanical variables control Micromechanical devices Integrated circuits Packaging

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Influence of Layout and Technology Parameters on the Thermal Behavior of InGaP/GaAs HBTs 13

Influence of Layout and Technology Parameters on the Thermal...

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13th conference on ph.d. research in microelectronics and electronics (PRIME)

作者： Catalano, A. P. Magnani, A. d'Alessandro, V. Codecasa, L. Zampardi, P. J. Moser, B. Rinaldi, N. Univ Federico II Dept Elect Engn & Informat Technol Naples Italy Politecn Milan Dept Elect Informat & Bioengn Milan Italy Qorvo Inc Newbury Pk CA USA Qorvo Inc Thorndike Rd Greensboro NC USA

This paper presents an extensive analysis aimed at quantifying the impact of all the key layout and technology parameters on the thermal behavior of InGaP/GaAs HBTs. The investigation is conducted by resorting to accu... 详细信息

ISBN: (纸本)9781509065080

关键词： design Of Experiments (dOE) finite-element method (FEM) heterojunction bipolar transistor (HBT) thermal resistance

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Compact Monolithic Spiral Quadrature Coupler design 13

Compact Monolithic Spiral Quadrature Coupler Design

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13th conference on ph.d. research in microelectronics and electronics (PRIME)

作者： Tabarani, Filipe Schumacher, Hermann Ulm Univ Inst Electron Devices & Circuits D-89081 Ulm Germany

ISBN: (纸本)9781509065080

The design and performance of two compact monolithic spiral quadrature couplers are presented, employing a novel configuration of mutually coupled coils. The first, designed at 20.35 GHz, occupies 131 x 142 mu m and achieves 0.5 dB fractional bandwidth of 19%, with phase error and intrinsic loss below 2.6 degrees and 0.92 dB, respectively. The second, designed at 30.15 GHz with 5.24 dB coupling coefficient, measures 122 x 132 mu m and achieves 0.5 dB fractional bandwidth of 30% with a phase difference between 93 and 103 degrees. The insertion loss is smaller than 0.93 dB.

关键词： MMIC directional Couplers Passive Circuits K-band Ka-band 90 degrees hybrid

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A Comparison of Simulation Strategies for Estimating phase Noise in Oscillators 13

A Comparison of Simulation Strategies for Estimating Phase N...

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13th conference on ph.d. research in microelectronics and electronics (PRIME)

作者： Galeone, Salvatore Kennedy, Michael Peter Amrita e-Learning Research Lab (AERL) Amrita University India

ISBN: (纸本)9781509065080

This paper compares three simulation methods to simulate the Gamma(t) functions used in the PPV theory. The first method consists in a modified version of procedure used for the simulation of the Gamma(t) functions in the sense of ISF, the second and the third are based on non-linear analysis and allow directy to calculate the Gamma(t) in the sense of PPV. despite the approaches are not formally equivalent they turn out to be equally "effective" for practical purposes. The equivalence of the three methods is confirmed with two examples: a Van der Pol oscillator and a ring oscillator. It is then proposed the use one of those methods as the faster in terms of simulation time, providing designers with a very powerful, fast and easy procedure to identify and separate contributors to phase noise in oscillators.

关键词： Noise upconversion PPV ISF

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Coincidence in SPAd-Based Time-of-Flight Sensors 13

Coincidence in SPAD-Based Time-of-Flight Sensors

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13th conference on ph.d. research in microelectronics and electronics (PRIME)

作者： Beer, Maik Schrey, Olaf M. Hosticka, Bedrich J. Kokozinski, Rainer Fraunhofer Inst Microelect Circuits & Syst IMS Finkenstr 61 D-47057 Duisburg Germany Univ Duisburg Essen Dept Elect Components & Circuits Bismarkstr 81 D-47057 Duisburg Germany

ISBN: (纸本)9781509065080

High ambient illumination reduces the range and target detection reliability in light-based 3d sensors. Raising the optical power of the artificial illumination source to overcome the influence of high ambient light is often not possible for systems with flash illumination due to eye safety constraints. The high timing resolution of single-photon avalanche diodes enables the search for photon concurrences in incident photon streams. In this paper a theoretical analysis of coincidence and its benefits for 3d sensors with single-photon avalanche diodes is presented.

关键词： photon coincidence single-photon avalanche diode (SPAd) time-of-flight (TOF) range imaging

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