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检索条件"任意字段=Design, Modeling, and Simulation in Microelectronics"
1687 条 记 录,以下是1551-1560 订阅
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PROBLEM-ORIENTED modeling OF MICROTRANSDUCERS - STATE-OF-THE-ART AND FUTURE CHALLENGES
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SENSORS AND ACTUATORS A-PHYSICAL 1994年 第1-3期41卷 279-283页
作者: WACHUTKA, G Physical Eletronics Laboratory Swiss Federal Institute of Technology ETH-H&ouml nggerberg HPT CH-8093 Zurich Switzerland
The development and production of well-performing and inexpensive microsensors, actuators or complete microsystems are largely determined by intricate trade-off considerations. Optimum performance requires a judicious... 详细信息
来源: 评论
Electromagnetic modeling of passive structures in wideband microelectronics
Electromagnetic modeling of passive structures in wideband m...
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作者: Zhu, Xiaojun The University of Wisconsin - Milwaukee
学位级别:Ph.D.
With the rapid development of solid state technology, the clock speed and integration density of very large integration (VLSI) chips and multichip modules (MCMs) have been increasing steadily. The clock rate has incre...
来源: 评论
GATEWAYS - A TECHNIQUE FOR ADDING EVENT-DRIVEN BEHAVIOR TO COMPILED simulationS
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IEEE TRANSACTIONS ON COMPUTER-AIDED design OF INTEGRATED CIRCUITS AND SYSTEMS 1994年 第3期13卷 338-352页
作者: MAURER, PM LEE, YS Department of Computer Science and Engineering University of South Florida Tampa FL USA
The gateway technique is a method for switching segments of code into and out of the instruction stream. When added to the straight-line code generated by a compiled simulator, gateways can be used to enhance the perf... 详细信息
来源: 评论
A HYBRID DEVICE SIMULATOR THAT COMBINES MONTE-CARLO AND DRIFT-DIFFUSION ANALYSIS
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IEEE TRANSACTIONS ON COMPUTER-AIDED design OF INTEGRATED CIRCUITS AND SYSTEMS 1994年 第2期13卷 201-210页
作者: KOSINA, H SELBERHERR, S Institute for Microelectronics Technical University of of Vienna Vienna Austria
A hybrid simulator suitable for modeling small semiconductor devices has been developed in which Monte Carlo and drift-diffusion models are combined. In critical device regions, the position-dependent coefficients of ... 详细信息
来源: 评论
Electromagnetic modeling of passive structures in wideband microelectronics
Electromagnetic modeling of passive structures in wideband m...
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作者: Zhu, Xiaojun University of Wisconsin-Milwaukee
学位级别:博士
With the rapid development of solid state technology, the clock speed and integration density of very large integration (VLSI) chips and multichip modules (MCMs) have been increasing steadily. The clock rate has incre...
来源: 评论
modeling techniques to support system level simulation and a top-down development methodology
Modeling techniques to support system level simulation and a...
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Proceedings of the 1994 International Verilog HDL Conference
作者: Gravenstein, Martin Ford Microelectronics Inc Colorado Springs United States
This document describes several effective Verilog coding techniques which, by increasing simulation performance, enables a seamless migration of a large scale electronic system through a wide range of abstraction for ... 详细信息
来源: 评论
ASIC IMPLEMENTATION OF RECURSIVE SCALED DISCRETE COSINE TRANSFORM ALGORITHM
ASIC IMPLEMENTATION OF RECURSIVE SCALED DISCRETE COSINE TRAN...
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Conference on Digital Video Compression on Personal Computers: Algorithms and Technologies
作者: ON, BN NARASIMHAN, S HUANG, VKL NATL UNIV SINGAPORE INST MICROELECTRSINGAPORE 0511SINGAPORE
A program to implement the Recursive Scaled Discrete Cosine Transform (DCT) algorithm as proposed by H. S. Hou has been undertaken at the Institute of microelectronics. Implementation of the design was done using top-... 详细信息
来源: 评论
VISTA/spl minus/the data level
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IEEE Transactions on Computer-Aided design of Integrated Circuits and Systems 1994年 第1期13卷 72-81页
作者: F. Fasching W. Tuppa S. Selberherr Institute for Microelectronics Technical University of of Vienna Vienna Austria
In order to meet the requirements of advanced process and device design, a new generation of technology CAD (TCAD) simulation frameworks is emerging. These are based on a data level providing a common data interchange... 详细信息
来源: 评论
Manufacturing cost analysis for electronic packaging
Manufacturing cost analysis for electronic packaging
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International Conference on the Economics of design, Test, and Manufacturing
作者: S. L. Marallo J. R. Dieffenbach IBIS Associates Inc. Wellesley MA USA
来源: 评论
modeling techniques to support system level simulation and a top-down development methodology
Modeling techniques to support system level simulation and a...
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IEEE International Conference on Verilog HDL
作者: M. Gravenstein Ford Electronics Division Ford Microelectronics Inc. Colorado Springs CO USA
This paper describes several effective Verilog coding techniques which, by increasing simulation performance, enable a seamless migration of a large scale electronic system through a wide range of abstraction for both... 详细信息
来源: 评论