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The benefits of ultrashort optical pulses in optically interconnected systems

ieee journal OF selected topics IN QUANTUM ELECTRONICS 2003年第2期9卷 477-485页

作者： Keeler, GA Nelson, BE Agarwal, D Debaes, C Helman, NC Bhatnagar, A Miller, DAB Stanford Univ Ginzton Lab Dept Appl Phys & Elect Engn Stanford CA 94305 USA Free Univ Brussels Dept Appl Phys & Photon B-1050 Brussels Belgium

Many properties of an optically interconnected system can be improved through the use of a modelocked laser. The short pulse duration, high peak power, wide spectral bandwidth, and low timing jitter of such a laser lead to these benefits. Timing advantages include simplified synchronization across large chip areas, receiver latency reduction, and data resynchronization. Lower power dissipation may be achieved through improved receiver sensitivity. Additional applications of short optical pulses include time-division multiplexing, single-source wavelength-division multiplexing, and precise time-domain testing of circuits. Several of these concepts were investigated using a high-speed chip-to-chip optical interconnect demonstration link. The link employs a modelocked laser and surface-normal optoelectronic modulators that were flip-chip bonded to silicon CMOS circuits. This paper outlines experiments that were performed on or simulated for the link, and discusses the important benefits of ultrashort optical pulses for optical interconnection.

关键词： CMOS integrated circuits modelocked lasers optoelectronic devices optical interconnections optical pulses optical receivers synchronization wavelength division multiplexing

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Recent advances in high-density and large-scale AWG multi/demultiplexers with higher index-contrast silica-based PLCs

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ieee journal OF selected topics IN QUANTUM ELECTRONICS 2002年第6期8卷 1090-1101页

作者： Hibino, Y NTT Corp Photon Labs Kanagawa 2430198 Japan

This paper reviews recent progress on high-density and large-scale arrayed-waveguide-grating (AWG) multi/demultipIexers, which have been developed for wavelength division multiplexing (WDM)-based photonic networks. The AWG has been the key to the construction of flexible and large-capacity WDM networks. This is because, compared with conventional filters consisting of thin-film interference filters and microoptics, the AWG offers the advantages of low loss, high port counts,and mass productivity. To improve such characteristics further, low-loss,higher index-contrast (super-high Delta) planar lightwave circuits (PLCs) with a bending radius of 2 mm have recently been developed. It has been shown that these PLCs are effective for use in constructing a compact AWG module with 115 the volume of a conventional module and large-scale AWGs with 256 and 400 channels. Three techniques for low-loss fiber connection with spot-size converters have also been developed for the super-high Delta PLCs, and it has been confirmed that these techniques can be applied to the fabrication of AWG modules. Furthermore, two-stage tandem AWG-type multi/demultiplexers with more than 1000 channels have been demonstrated. This paper describes the progress that has been made on these high-density and large-scale AWGs, which are expected to contribute greatly to the construction of future photonic networks including optical add/drop multiplexing systems and optical crossconnect systems.

关键词： Large-scale systems Programmable control WDM networks Optical filters Optical fiber networks Wavelength division multiplexing Thin film circuits Interference Microoptics Optical losses

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Integrated detectors for embedded optical interconnections on electrical boards, modules, and integrated circuits

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ieee journal OF selected topics IN QUANTUM ELECTRONICS 2002年第6期8卷 1427-1434页

作者： Cho, SY Seo, SW Brooke, MA Jokerst, NM Georgia Inst Technol Sch Elect & Comp Engn Natl Sci Fdn Packaging Res Ctr Atlanta GA 30332 USA

Significant opportunities exist for optical interconnections at the board, module, and chip level if compact, low-loss, high-data-rate optical interconnections can be integrated into these electrical interconnection systems. To create such an integrated optoelectronic/electronic microsystem, mask-based alignment of the optical interconnection waveguide, optoelectronic active devices, and interface circuits is attractive from a packaging alignment standpoint. This paper describes an integration process for creating optical interconnections which can be integrated in a postprocessing format onto standard boards, modules, and integrated circuits. These optical interconnections utilize active thin-film optoelectronic components embedded in the waveguide/interconnection substrate, thus eliminating the need for optical beam turning elements and their alignment, and providing an electrical output on the substrate from an optical interconnection. These embedded optical interconnections are reported herein using BCB polymer optical waveguides with embedded InGaAs-based thin-film inverted metal-semiconductor-metal (I-NISM) pbotodetectors on an Si substrate. These interconnections have been fabricated and tested, and the coupled optical signal from the waveguide to the embedded photodetector was theoretically modeled at 56.4%, which was supported by an experimental estimate of 47.8%. The measured full-width at half maximum of the electrical pulse from the MSM photodetector embedded in the waveguide was 16.73 ps for an input 500-fs optical laser pulse.

关键词： embedded photodetector metal-semiconductor-metal optical interconnection

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Foreword

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journal of Electronic Packaging 2001年第4期123卷 321-322页

作者： Rencz , , Marta Lasance , , Clemens Micred Ltd. Budapest Philips Research Laboratories Eindhoven The Netherlands

Microelectronics thermal experts from four continents gathered in the fall of 2000 at the Sixth Therminic Workshop, Budapest, Hungary. THERMINIC is sponsored by the ieee Computer Society Test Technology Technical Council and TIMA Laboratory in cooperation with the ieee Components, Packaging, and Manufacturing Technology Society, and the European Test Technology Technical Committee. Previous THERMINIC Workshops have been held in Grenoble (1995), Budapest (1996), Cannes (1997 and 1998), Rome (1999). From the submissions, the Program Committee selected 38 contributions for oral presentation and 16 for poster presentation. The workshop had 88 participants from 15 countries. A formal Workshop Proceedings 1 is not published, but it is now a tradition that the most valuable papers of the Workshop appear in special issues or special sections of leading international journals. Because of the nature and scope of the workshop, three journals were chosen to have papers published, the Microelectronics journal , the ieee Transactions on Components and Packaging Technologies , and ASME journal of Electronic Packaging . The topics of the THERMINIC Workshops involve all of the thermal aspects from die to system level. A traditional topic is micro-electromechanical systems (MEMS), and the materials used in them including measurement, modeling, simulation, and application of thermal and electro-thermal effects. In 2000, many papers discussed thermal simulation and measurement, as well as thermal management and electro-thermal topics. From this rich choice, the papers that follow in this special section were selected for their value and interest to the journal of Electronic Packaging . The papers published here represent only a small portion of the total number of papers presented at the THERMINIC Workshop. Of the many within the scope of ASME JEP, these are felt to be the best. The paper by researchers from the Technical University Budapest and Micred Ltd. discusses a promising approa

关键词： thermal management (packaging) integrated circuit packaging Micromechanical devices micromechanical devices Packaging Modeling Thermal management Integrated circuit packaging integrated circuit modelling Integrated circuits Workshops (Work spaces)

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Ce/sup 3+/:LiCaAlF/sub 6/ crystal for high-gain or high-peak-power amplification of ultraviolet femtosecond pulses and new potential ultraviolet gain medium: Ce/sup 3+/:LiSr/sub 0.8/Ca/sub 0.2/AlF/sub 6/

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ieee journal of selected topics in Quantum Electronics 2001年第4期7卷 542-550页

作者： Z. Liu T. Kozeki Y. Suzuki N. Sarukura K. Shimamura T. Fukuda M. Hirano H. Hosono Hosono Transparent Electro-Active Materials Project ERATO Japan Science and Technology Corporation Kawasaki Japan Institute for Molecular Sciences Okazaki Japan University of Tohoku Sendai Japan University of Tokyo Kashiwa Japan

To develop high-peak-power ultrashort pulse laser systems in the ultraviolet region, a large Ce/sup 3+/:LiCaAlF/sub 6/ (Ce:LiCAF) crystal, a tunable ultraviolet laser medium with large saturation fluence and broad gain spectrum width, was grown successfully with a diameter of more than 70 mm. To demonstrate high small signal gain, a four-pass confocal amplifier with 60 dB gain and 54 /spl mu/J output energy was constructed. Chirped pulse amplification (CPA) in the ultraviolet region was demonstrated using Ce:LiCAF for higher energy extraction. A modified bow-tie-style four-pass amplifier pumped by 100-mJ 266-nm 10-Hz pulses from a Q-switched Nd:YAG laser had 370-times gain and delivered 6-mJ 290-nm pulses. After dispersion compensation, the output pulses can be compressed down to 115 fs. This is the first ultraviolet, all-solid-state high-peak-power CPA laser system using ultraviolet gain media, and this demonstration shows further scalability of the Ce:LiCAF CPA system. Additionally, a new gain medium, Ce/sup 3+/:LiSr/sub 0.8/Ca/sub 0.2/AlF/sub 6/, with longer fluorescence lifetime and sufficient gain spectrum width over 18 nm was grown to upgrade this system as a candidate for a final power amplifier gain module.

关键词： Pulse amplifiers Optical pulses Pump lasers Space vector pulse width modulation Tunable circuits and devices Gain Chirp Laser excitation Pulse compression methods Scalability

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Monolithic tunable diode lasers

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ieee journal OF selected topics IN QUANTUM ELECTRONICS 2000年第6期6卷 988-999页

作者： Coldren, LA Univ Calif Santa Barbara Dept Elect & Comp Engn Santa Barbara CA 93106 USA Agil Commun Santa Barbara CA 93117 USA

After over two decades of exploration, tunable diode lasers are beginning to find significant applications, driven largely by the huge demand for bandwidth that is guiding many developments in the optical fiber communication business today. In this paper, some of the history and key developments that have led to the technologies available today will be reviewed from the perspective of the author. After discussion of some of the early work, the focus will shift to widely tunable diode lasers, which would appear to be key enablers for future dense wavelength-division multiplexing and optical switching and networking systems. The distinguishing characteristics of the current technological alternatives will be summarized.

关键词： optical networking circuits photonic integrated circuits semiconductor lasers tunable lasers WDM

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Design and applications of silica-based planar lightwave circuits

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ieee journal OF selected topics IN QUANTUM ELECTRONICS 1999年第5期5卷 1227-1236页

作者： Kaneko, A Goh, T Yamada, H Tanaka, T Ogawa, I NTT Photon Labs Tokai Ibaraki 3191193 Japan

Planar lightwave circuits (PLC's) are waveguide devices that integrate fiber-matched optical waveguides on Silicon or glass substrate to provide an efficient means of interaction for the guided-wave optical signals. PLC's provide various important and functional devices for optical wavelength-division multiplexing, time-division-multiplexing systems, and subscriber networks. This paper reviews the recent progress and future prospects of PLC technologies including arrayed waveguide grating multiplexers, optical add-drop multiplexers and hybrid optoelectronics integration technologies.

关键词： arrayed-waveguide grating hybrid integration multi/demultiplexer silica waveguide

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TRANslucent smart pixel ARray (TRANSPAR) chips for high throughput networks and SIMD signal processing

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ieee journal OF selected topics IN QUANTUM ELECTRONICS 1999年第2期5卷 316-329页

作者： Chen, CH Hoanca, B Kuznia, CB Sawchuk, AA Wu, JM Univ So Calif INtegrated Media Syst Ctr Inst Signal & Image Proc Los Angeles CA 90089 USA

We present a novel architecture for an optical network, TRANslucent Smart Pixel ARray (TRANSPAR), having smart pixel devices which effectively function in an optically translucent manner. The network protocol is similar to carrier-sense multiple-access/collision-detection (CSMA/CD) commonly used in Ethernet, but adapted to a ring configuration using optical parallel packets in free space. The TRANSPAR devices also function as a fine-grain mesh-connected parallel pipeline array for image and video signal processing. We designed, fabricated, and are currently testing the TRANSPAR smart pixel devices and network node hardware, This paper presents the network architecture, tradeoffs, and design decisions, the testing results to date, and ends with considerations on practicality and future scalability.

关键词： cellular logic arrays CMOS integrated circuits integrated optoelectronics optical networks smart pixels

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Two-dimensional parallel pipeline smart pixel array cellular logic (SPARCL) processors - Chip design and system implementation

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ieee journal OF selected topics IN QUANTUM ELECTRONICS 1999年第2期5卷 376-386页

作者： Kunzia, CB Wu, JM Chen, CH Hoanca, B Cheng, L Weber, AG Sawchuk, AA Univ So Calif Inst Signal & Image Proc Los Angeles CA 90089 USA

We describe the chip design and system implementation of an optoelectronic parallel pipeline processing system composed of cascaded stages of smart pixel array cellular logic (SPARCL) processors interconnected with free-space digital optic channels. The SPARCL processing elements are arranged in a two-dimensional array, and each contains an independent optical input/output port and electrical nearest-neighbor local interconnections. The smart pixels are implemented using GaAs-GaAlAs multiple quantum-well diode arrays flip-chip bonded onto complementary metal-oxide-semiconductor circuitry through the Bell Labs Lucent Technologies/George Mason University optoelectronic VLSI foundry, This system provides efficient execution of single-instruction multiple-data algorithms on large data fields and images.

关键词： cellular logic arrays CMOS integrated circuits integrated optoelectronics optical interconnections smart pixels

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Optoelectronic-VLSI: Photonics integrated with VLSI circuits

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ieee journal OF selected topics IN QUANTUM ELECTRONICS 1998年第6期4卷 899-912页

作者： Krishnamoorthy, AV Goossen, KW AT&T Bell Labs Lucent Technol Holmdel NJ 07733 USA

Optoelectronic-VLSI (OE-VLSI) technology represents the intimate integration of photonic devices with silicon VLSI electronics. We review the motivations and status of emerging OE-VLSI technologies and examine the performance of OE-VLSI technology versus conventional wire-bonded OE packaging, The results suggest that OE-VLSI integration offers substantial power and speed improvements even when relatively small numbers of photonic devices are driven with commodity complementary metal-oxide-semiconductor logic technologies.

关键词： circuit modeling CMOS integrated circuits hip-chip devices integrated optoelectronics laser arrays optical arrays optical interconnections quantum-well devices VCSEL's

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