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Integrated Temperature and Stress sensors in Fan-Out Wafer-Level Packaging to Better Achieve the Third-Generation Reliability of Electronic Systems

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IEEE TRANSACTIONS ON RELIABILITY 2025年

作者： Cao, Linwei Wang, Yuexing Liu, Kun Zhang, Xiangou Deng, Shuairong Zhou, Quanfeng Sun, Xiangyu Zhang, Wanli China Acad Engn Phys Inst Elect Engn Mianyang 621999 Peoples R China China Acad Engn Phys Microsyst & Terahertz Res Ctr Chengdu 610200 Peoples R China Univ Elect Sci & Technol China Sch Elect Sci & Engn State Key Lab Elect Thin Films & Integrated Device Chengdu 610054 Peoples R China

To satisfy the developmental requirements of applications, such as autonomous driving, high-performance computing, and the Internet of Things (IoT), the integration density, performance, and reliability tradeoff of electronic systems are posing numerous challenges. Prognostics and health management (PHM) using multiple types of sensors can address reliability problems and enhance the functional safety of electronic systems. However, the limited integration density of conventional electronic packaging indicates that functional chips can only replace sensor chips for physical quantity monitoring, without simultaneous functional degradation monitoring and fault identification. This study proposed an integration method that is compatible with front and rear processes to integrate temperature and stress sensors into the power-driven module, that is, fan-out wafer-level packaging technology. First, the temperature and stress sensors are calibrated using a microloading platform and sensitivity consistency is ensured. Second, the temperature inside the module under various working conditions is evaluated using the data obtained by temperature sensors. The stress data inside the micromodule under mechanical loading are obtained through stress sensors. The proposed method can realize in situ monitoring inside advanced packaging and provide considerable data for PHM research.

关键词： Temperature sensors Stress sensors Temperature measurement Silicon Monitoring Consumer electronics sensor systems Piezoresistive devices Piezoresistance Embedded sensor fan-out wafer-level packaging (FOWLP) prognostics and health management (PHM) reliability

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Improved Accuracy of Track-Based integration of Radar and Vision sensors

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IEEE sensors JOURNAL 2025年第10期25卷 17881-17891页

作者： Kwak, Seungheon Chae, Younghwan Choi, Minyoung Park, Kyutae Kim, Myoungha Lim, Hae-Seung Lee, Jae-Eun Lee, Seongwook Chung Ang Univ Coll ICT Engn Sch Elect & Elect Engn Seoul 06974 South Korea Bitsensing Inc Radar Signal Proc Seongnam Si 13105 Gyeonggi Do South Korea

This article proposes a method for integrating the camera and radar data using nonlinear homography transformations. The lens distortion effects of a camera cause differences in object positions to have a nonlinear relationship with pixel differences in the captured image. Therefore, accurate sensor integration is impossible when using linear homography transformations to represent camera track information on the radar coordinate plane or vice versa. Thus, this article proposes a method to integrate the camera-estimated track with the radar track by applying lateral and longitudinal corrections. For lateral corrections, the reference point of the camera track is adjusted from the bottom center of the bounding box to a position that reflects the angle between the vanishing point and the target. For longitudinal corrections, a nonlinear homography transformation is used to address the accuracy degradation caused by lens distortion. Using experimental data, we demonstrate that track matching accuracy significantly improved from an initial root mean square error of 0.92-0.45 m after applying two separate correction steps in each direction, highlighting the effectiveness of the correction process in enhancing sensor accuracy.

关键词： Camera homography transformation image transformation radar sensor integration Camera homography transformation image transformation radar sensor integration

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Machine learning approaches for improving integration of advanced sensors on legacy aircraft

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SYSTEMS ENGINEERING 2023年第6期26卷 800-813页

作者： Dennis, Zachary Holzer, Thomas George Washington Univ Sch Engn & Appl Sci Engn Management & Syst Engn Dept Washington DC 20052 USA

Rapid integration of advanced sensors onto legacy military aircraft is critical for maintaining technological advantage in warfighting domains. integration of these sensors is accomplished through upgrade programs that often fail during integration due to defect discovery and interoperability issues. Existing Department of Defense initiatives related to open architectures have improved sensor integration but have not eliminated the need for custom interface software to account for behavioral disparities across different sensors. The subject research proposes that reinforcement machine learning algorithms can be applied to aircraft sensor interfaces during integration and verifies effectiveness by training and testing Greedy, Q-Learning, Deep Q-Learning, Double Deep Q-Learning, and Instance-Based Learning algorithms against modeled Global Positioning System (GPS), Optical, Light Detection and Ranging (LIDAR), and Infrared sensor functions. The results are useful to open architecture standards management groups, sensor vendors, and systems and software engineers who are developing strategies and designs to accelerate subsystem integration timelines by reducing failures discovered during integration.

关键词： Instance-Based Learning integration neural networks Q-Learning reinforcement learning sensors

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Integrating metrological principles into the Internet of Things: a digital maturity model for sensor network metrology

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TM-TECHNISCHES MESSEN 2024年第1期91卷 17-31页

作者： Eichstaedt, Sascha Gruber, Maximilian Vedurmudi, Anupam Prasad Phys Tech Bundesanstalt Metrol Digital Transformat Abbestr 2-12 D-10587 Berlin Germany

The development and integration of metrological processes to address complex, large-scale systems of interconnected measuring instruments, i.e., sensor networks, has been a topic of increasing importance in the last decade. Initial developments in sensor network metrology include, e.g., metrological treatment of sensors with digital-only output, measurement uncertainty evaluation for time series data, and the digital representation of metrological information of such sensors. In principle, modern digital technologies allow for a fully automated operation of even rather complex sensor networks. However, the integration of metrological principles to provide confidence in the measurement results in such networks is still at its beginning. In this contribution we consider a recently published structured approach to assess digital maturity based on the level of machine-readability and machine-actionability. We apply this approach to sensor networks, define the different levels of digital maturity, and discuss potential steps for further evolving the integration of metrological principles for the Internet of Things (IoT).

关键词： sensor network metrology Internet of Things uncertainty ontology digital calibration certificate artificial intelligence

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Optical Tactile Sensing for Aerial Multicontact Interaction: Design, integration, and Evaluation

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IEEE TRANSACTIONS ON ROBOTICS 2025年 41卷 364-377页

作者： Aucone, Emanuele Sferrazza, Carmelo Gregor, Manuel D'Andrea, Raffaello Mintchev, Stefano Swiss Fed Inst Technol Environm Robot Lab Dept Environm Syst Sci CH-8092 Zurich Switzerland Swiss Fed Inst Forest Snow & Landscape Res WSL CH-8903 Birmensdorf Switzerland Univ Calif Berkeley Robot Learning Lab Berkeley CA 94704 USA Swiss Fed Inst Technol Inst Dynam Syst & Control Dept Mech & Proc Engn CH-8092 Zurich Switzerland

Distributed tactile sensing for multiforce detection is crucial for various aerial robot interaction tasks. However, current contact sensing solutions on drones only exploit single end-effector sensors and cannot provide distributed multicontact sensing. Designed to be easily mounted at the bottom of a drone, we propose an optical tactile sensor that features a large and curved soft-sensing surface, a hollow structure and a new illumination system. Even when spaced only 2 cm apart, multiple contacts can be detected simultaneously using our software pipeline, which provides real-world quantities of 3-D contact locations (mm) and 3-D force vectors (N), with an accuracy of 1.5 mm and 0.17 N, respectively. We demonstrate the sensor's applicability and reliability onboard and in real time with two demos related to, first, the estimation of the compliance of different perches and subsequent realignment and landing on the stiffer one, and second, the mapping of sparse obstacles. The implementation of our distributed tactile sensor represents a significant step toward attaining the full potential of drones as versatile robots capable of interacting with and navigating within complex environments.

关键词： sensors Robot sensing systems Drones Tactile sensors Robots Optical sensors Force Optical feedback sensor arrays Navigation Aerial robots: applications physical interactions by touching system-level integration of tactile sensors in robots tactile sensors design

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sensors integration for structural health monitoring in composite pressure vessels: A review

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COMPOSITE STRUCTURES 2025年 351卷

作者： Meemary, Bilal Vasiukov, Dmytro Deleglise-Lagardere, Mylene Chaki, Salim Univ Lille Inst Mines Telecom Ctr Mat & Proc IMT Nord Europe F-59000 Lille France

Filament-wound Composite Pressure Vessels (CPVs) are employed largely for gas or fluid storage under pressure in aerospace, automotive and naval industries. Composite vessels are subjected to harsh conditions such as critical loadings, extreme temperatures, and bursting;therefore, a permanent in-situ and online monitoring approach for the structural integrity of the vessels is essential. Hence, this review paper focuses on the description of the most trending used sensors such as piezoelectric (PZT and PVDF), piezoresistive (BP and MXene) and fiber optic (SOFO (R), OBR and FBG) sensors, for developing a Structural Health Monitoring (SHM) approach to create self-sensing composite pressure vessels. The novelty of this review paper lies in providing an overview of existing works covering the integration of sensors in composite vessels, including sensor types, localization, and their impact on composite integrity. Particularly, an analysis of the literature is provided concerning the sensor's integration and especially their monitored parameters, layout design and arrangement in CPVs. Additionally, the interaction between the host composite material and sensors is analyzed to understand how to integrate sensors with the minimum possible defects that alter the mechanical performance of composite vessels. Lastly, a discussion of a CPV's SHM system is provided to offer researchers a foundation for upcoming experimental work.

关键词： Composite pressure vessels Filament winding process Structural health monitoring Embedded sensors Composite degradation

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One-Dimensional Implantable sensors for Accurately Monitoring Physiological and Biochemical Signals

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Research 2024年第4期2024卷 42-57页

作者： Qianming Li Wen Wang Haotian Yin Kuangyi Zou Yiding Jiao Ye Zhang National Laboratory of Solid State Microstructures Jiangsu Key Laboratory of Artificial Functional MaterialsChemistry and Biomedicine Innovation CenterCollaborative Innovation Center of Advanced MicrostructuresCollege of Engineering and Applied SciencesNanjing UniversityNanjing 210023China

In recent years,one-dimensional(1D)implantable sensors have received considerable attention and rapid development in the biomedical field due to their unique structural characteristics and high integration *** sensors can be implanted into the human body with minimal invasiveness,facilitating real-time and accurate monitoring of various physiological and pathological *** review examines the latest advancements in 1D implantable sensors,focusing on the material design of sensors,device integration,implantation methods,and the construction of the stable sensor–tissue ***,a comprehensive overview is provided regarding the applications and future research directions for 1D implantable sensors with an ultimate aim to promote their utilization in personalized healthcare and precision medicine.

关键词： integration implantation directions

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An Artificial Intelligence‑Assisted Flexible and Wearable Mechanoluminescent Strain sensor System

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Nano-Micro Letters 2025年第3期17卷 217-231页

作者： Yan Dong Wenzheng An Zihu Wang Dongzhi Zhang College of Control Science and Engineering China University of Petroleum(East China)Qingdao 266580People’s Republic of China

The complex wiring,bulky data collection devices,and difficulty in fast and on-site data interpretation significantly limit the practical application of flexible strain sensors as wearable *** tackle these challenges,this work develops an artificial intelligenceassisted,wireless,flexible,and wearable mechanoluminescent strain sensor system(AIFWMLS)by integration of deep learning neural network-based color data processing system(CDPS)with a sandwich-structured flexible mechanoluminescent sensor(SFLC)*** SFLC film shows remarkable and robust mechanoluminescent performance with a simple structure for easy *** CDPS system can rapidly and accurately extract and interpret the color of the SFLC film to strain values with auto-correction of errors caused by the varying color temperature,which significantly improves the accuracy of the predicted strain.A smart glove mechanoluminescent sensor system demonstrates the great potential of the AIFWMLS system in human gesture ***,the versatile SFLC film can also serve as a encryption *** integration of deep learning neural network-based artificial intelligence and SFLC film provides a promising strategy to break the“color to strain value”bottleneck that hinders the practical application of flexible colorimetric strain sensors,which could promote the development of wearable and flexible strain sensors from laboratory research to consumer markets.

关键词： Mechanoluminescent Strain sensor Flexible Deep learning Wireless

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High-Resolution CMOS Tactile-Proximity sensor Array: Design, Fabrication, and Performance Evaluation

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IEEE sensors JOURNAL 2024年第16期24卷 25468-25475页

作者： Wang, Yu-Chiao Lu, Michael S. -C. Natl Tsing Hua Univ Dept Elect Engn Hsinchu 300044 Taiwan Natl Tsing Hua Univ Inst Elect Engn Hsinchu 300044 Taiwan

Integrated circuit technologies provide an ideal platform for multisensor integration by leveraging well-established electronic processes. However, the integration of a large tactile sensor array with proximity sensing has not been extensively studied. In this article, we investigate the sensing capabilities of a 32 x 32 piezoresistive tactile sensor array with capacitive proximity sensing implemented using a complementary metal-oxide-semiconductor (CMOS) process. Capacitive electrodes, separated by 175 mu m, are conveniently implemented on top of the tactile pixels, each measuring 140 x 140 m(2), using metallization layers. The sensing structures were fabricated using a wet metal etch, followed by an anisotropic silicon etch. In our experiments, the tactile sensors exhibited an average sensitivity of -0.084%/kPa with a resolution of 58 Pa. The proximity sensing displayed a detection range of approximately 0.9 mm, with a resolution better than 1 mu m. These results demonstrate the significant potential of CMOS tactile-proximity sensors for applications requiring sensitive detection.

关键词： sensors Tactile sensors Metals Etching sensor arrays Electrodes Silicon Capacitive sensors complementary metal-oxide-semiconductor (CMOS) piezoresistive sensors

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Hybrid sensor integration in wearable devices for improved cardiovascular health monitoring

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JOURNAL OF SCIENCE-ADVANCED MATERIALS AND DEVICES 2025年第2期10卷

作者： Khan, Bangul Khan, Wasimullah Masrur, Muhammad Hasan Khalid, Rana Talha Awais, Muhammad Khan, Bilawal Khoo, Bee Luan Abdullah, Saad City Univ Hong Kong Dept Biomed Engn Hong Kong Peoples R China Hong Kong Ctr Cerebro Cardiovasc Hlth Engn COCHE Hong Kong Peoples R China Riphah Int Univ Dept Biomed Engn Lahore Pakistan City Univ Hong Kong Dept Mat Sci & Engn Kowloon Hong Kong Peoples R China City Univ Hong Kong Futian Shenzhen Res Inst Hong Kong Peoples R China Malardalen Univ Sch Innovat Design & Engn Div Intelligent Future Technol POB 883 S-72126 Vasteras Sweden

Cardiovascular diseases (CVDs) remain the leading causes of global morbidity and mortality, underscoring the urgent need for advanced, non-invasive monitoring technologies. This review explores the integration of hybrid magnetic and optical sensors in wearable devices aimed at transforming cardiovascular health monitoring. Magnetic sensors, known for their strong signal capture and resistance to ambient light interference, complement optical sensors like photoplethysmography (PPG), which provide vital hemodynamic data, including blood volume changes and pulse rates. Combining these technologies improves monitoring systems' overall signal integrity, accuracy, and reliability. We critically evaluate current integration strategies, highlighting advanced multi-sensor data fusion techniques that enhance temporal resolution and enrich physiological data interpretation. Additionally, this review addresses the challenges in developing hybrid sensor systems, such as calibration accuracy, real-time data analytics, power optimization, and user-friendly design. Looking forward, we propose research directions focused on refining sensor integration frameworks to enable early detection and personalized management of CVDs. The synergy between magnetic and optical sensors significantly advances next-generation wearable diagnostics, greatly improving patient care and health outcomes. This review provides a comprehensive overview of the transformative potential of hybrid sensor technology in cardiovascular monitoring.

关键词： Cardiovascular diseases (CVDs) Wearable sensors Magnetic sensors Optical sensors Hybrid sensors Health management

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