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Localization and tracking in known large environments using portable real-time 3d sensors

COMPUTER VISION ANd IMAGE UNdERSTANdING 2016年 149卷 197-208页

作者： Sanchez, Carlos Taddei, Pierluigi Ceriani, Simone Wolfart, Erik Sequeira, Vitor Commiss European Communities Joint Res Ctr Inst Transuranium Elements Via Enrico Fermi 2749 I-21020 Ispra VA Italy

Ego-motion estimation and localization in large environments are key components in any assistive technology for real-time user orientation and navigation. We consider the case where a large known environment is explored without a priori assumptions on the initial location. In particular we propose a framework that uses a single portable 3d sensor to solve the place recognition problem and continuously tracks its position even when leaving the known area or when significant changes occur in the observed environment. We cast the place recognition step as a classification problem and propose an efficient search space reduction considering only navigable areas where the user can be localized. Classification hypotheses are then discarded exploiting temporal consistency w.r.t. a relative tracker that exploits only the sensor input data. The solution uses a compact classifier whose representation scales well with the map size. After being localized, the user is continuously tracked exploiting the known environment using an efficient data structure that provides constant access time for nearest neighbor searches and that can be streamed to keep only the local region close to the last known position in memory. Robust results are achieved by performing a geometrically stable selection of points, efficiently filtering outliers and integrating the relative tracker based on previous observations. We experimentally show that such a framework provides good localization results and that it scales well with the environment map size yielding real-time performance for both place recognition and tracking. (C) 2015 The Authors. Published by Elsevier Inc.

关键词： Place recognition Ego-motion 3d sensors

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INFN-FBK developments of 3d sensors for High-Luminosity LHC

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NUCLEAR INSTRUMENTS & METHOdS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS dETECTORS ANd ASSOCIATEd EQUIPMENT 2019年 924卷 73-77页

作者： Oide, H. Alimonti, G. Boscardin, M. dalla Betta, G. -F. darbo, G. Ficorella, F. Fumagalli, E. Gariano, G. Gaudiello, A. Gemme, C. Meschini, M. Messineo, A. Mendicino, R. Ronchin, S. Rovani, A. Ruscino, E. Sultan, d. M. S. Zorzi, N. Vazquez Furelos, d. INFN Sez Genova Genoa Italy INFN Sez Milano Milan Italy FBK Trento Italy TIFPA INFN Trento Italy Univ Trento Trento Italy Univ Genoa Genoa Italy Univ Pisa Pisa Italy INFN Sez Firenze Florence Italy IFAE Barcelona Barcelona Spain Univ Geneva Geneva Switzerland

3d type of pixel sensors is a promising option for the innermost pixel layer at the High-Luminosity LHC. However, the required very high hit-rate capabilities, finer pixel granularity, extreme radiation hardness and reduced material budget call for a downscale of the pixel size as compared to existing 3d sensors, involving smaller pitch (e.g. 50 x 50 or 25 x 100 mu m(2)), shorter inter-electrode spacing (similar to 30 mu m), narrower electrodes (similar to 6 mu m diameter), and reduced active thickness (similar to 100-150 mu m). Within a joint R&d effort with INFN, FBK has produced a new generation of 3d pixel sensors with these challenging features. In this talk preliminary results from the electrical and functional characterisation of the first prototypes are reported, included their behaviour after large radiation fluence, close to the ones expected in the High Luminosity LHC environment. Prospects for the next prototypes are also presented.

关键词： HL-LHC Silicon pixel detector 3d sensors FBK INFN Rd53

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development of double-Sided Full-Passing-Column 3d sensors at FBK

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IEEE TRANSACTIONS ON NUCLEAR SCIENCE 2013年第3期60卷 2357-2366页

作者： Giacomini, Gabriele Bagolini, Alvise Boscardin, Maurizio dalla Betta, Gian-Franco Mattedi, Francesca Povoli, Marco Vianello, Elisa Zorzi, Nicola Fdn Bruno Kessler Ctr Mat & Microsistemi FBK CMM I-38123 Povo TN Italy Ist Nazl Fis Nucl Sez Padova Grp Collegato Trento I-38123 Povo TN Italy Univ Trent Dipartimento Ingn Ind I-38123 Povo TN Italy FBK CMM Grenoble France

We report on the main design and technological characteristics related to the latest 3d sensor process developments at Fondazione Bruno Kessler (FBK, Trento, Italy). With respect to the previous version of this technology, which involved columnar electrodes of both doping types etched from both wafer sides and stopping at a short distance from the opposite surface, passing-through columns are now available. This feature ensures better performance, but also a higher reproducibility, which is of concern in medium volume productions. In particular, this R&d project was aimed at establishing a suitable technology for the production of 3d pixel sensors to be installed into the ATLAS Insertable B-Layer. An additional benefit is the feasibility of slim edges, which consist of a multiple ohmic column termination with an overall size as low as 100 mu m. Eight batches with two different wafer layouts have been fabricated using this approach, and including several design options, among them the ATLAS 3d sensor prototypes compatible with the new read-out chip FE-I4.

关键词： Electrical characterization fabrication technology silicon radiation detectors slim edge TCAd simulations 3d sensors

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Vertically Integrated System with Microfabricated 3d sensors and CO2 Microchannel Cooling

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FRONTIERS IN PHYSICS 2021年 9卷

作者： da Via, Cinzia Petagna, Paolo Romagnoli, Giulia Hellenschmidt, desiree Munoz-Sanchez, Francisca dann, Nicholas Univ Manchester Dept Phys & Astron Manchester Lancs England SUNY Stony Brook Dept Phys & Astron Stony Brook NY 11794 USA CERN European Council Nucl Res Geneva Switzerland

The growing demand for miniaturized radiation-tolerant detection systems with fast responses and high-power budgets has increased the necessity for smart and efficient cooling solutions. Several groups have been successfully implementing silicon microfabrication to process superficial microchannels to circulate coolants, in particular, in high-energy physics experiments, where the combination of low material budget to reduce noise generated by multiple scattering events and high radiation fluences is required. In this study, we report tests performed on an 885-mu m-thick vertically integrated system. The system consists of a layer of microfabricated silicon channels for temperature management integrated to radiation-tolerant microfabricated 3d sensors, with electrodes penetrating perpendicularly to the silicon bulk, bump-bonded to an ATLAS FE-I4 pixel readout chip of 100 mu m thickness, 2 x 2 cm(2), and 26,880 pixels (each measuring 250 x 50 mu m(2)). The system's electrical and temperature characterization under CO2 cooling as well as the response to minimum ionizing particles from radioactive sources and particle beams before and after 2.8 x10(15) n(eq) cm(-2) proton irradiation will be discussed.

关键词： 3d sensors micro-channel cooling CO2 vertical integration pixel detectors radiation hardness LHC upgrade

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Characterizing 3d sensors using the 3d modulation transfer function

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MEASUREMENT SCIENCE ANd TECHNOLOGY 2018年第3期29卷 035103-035103页

作者： Kellner, Timo Breitbarth, Andreas Zhang, Chen Notni, Gunther Tech Univ Ilmenau Grp Qual Assurance & Ind Image Proc Gustav Kirchhoff Pl 2 D-98693 Ilmenau Germany Fraunhofer Inst Appl Opt & Precis Engn IOF Albert Einstein Str 7 D-07745 Jena Germany

The fields of optical 3d measurement system applications are continuously expanding and becoming more and more diverse. To evaluate appropriate systems for various measurement tasks, comparable parameters are necessary, whereas the 3d modulation transfer function (3d-MTF) has been established as a further criterion. Its aim is the determination of the system response between the measurement of a straight, sharp-edged cube and its opposite ideal calculated one. Within the scope of this work simulations and practical investigations regarding the 3d-MTF's influences and its main issues are specifically investigated. Therefore, different determined edge radii representing the high-frequency spectra lead to various decreasing 3d-MTF characteristics. Furthermore, rising sampling frequencies improve its maximum transfer value to a saturation point in dependence of the radius. To approve these results of previous simulations, three fringe projection scanners were selected to determine the diversity. As the best 3d-MTF characteristic, a saturated transfer value of H-3d(f(N),(3d)) = 0.79 has been identified at a sufficient sampling frequency, which is reached at four times the Nyquist limit. This high 3d resolution can mainly be achieved due to an improved camera projector interaction. Additionally, too small sampling ratios lead to uncertainties in the edge function determination, while higher ratios do not show major improvements. In conclusion, the 3d-MTF algorithm has thus been practically verified and its repeatability as well as its robustness have been confirmed.

关键词： 3d-MTF modulation transfer function 3d resolution 3d sensors sensor characterisation fringe projection filter wheel camera

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Characterisation of Glasgow/CNM double-Sided 3d sensors

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Physics Procedia 2012年 37卷 1016-1023页

作者： Aaron Mac Raighne K. Akiba J.P. Balbuena R. Bates M. van Beuzekom J. Buytaert P. Collins M. Crossley R. dumps L. Eklund C. Fleta A. Gallas M. Gersabeck V.V. Gligorov M. John M. Köhler M. Lozano d. Maneuski U. Parzefall d. Quirion G. Stewart School of Physics Dublin Institute of Technology Kevin Street Dublin 8 Ireland Nationaal Instituut Voor Subatomaire Fysica Amsterdam Netherlands Instituto de Microelectrónica de Barcelona IMB-CNM-CSIC Barcelona Spain SUPA School of Physics and Astronomy University of Glasgow Scotland U.K CERN CH-1211 Genéve 23 Switzerland Facultad de Fisica University of Santiago de Compostela Santiago de Compostela Spain Department of Physics University of Oxford Oxford U.K Physikalisches Institut Universitt Freiburg Germany

3d detectors are proposed as an alternative to planar silicon technology to withstand the high radiation environments in planned future high energy physics experiments. Here we review the characterization of double-sided 3d detectors designed and built at CNM and the University of Glasgow. A non-irradiated sensor is characterized in a pion test-beamutilizing the Timepix telescope. The charge collection and detection efficiency across the unit pixel are shown. Area of inefficiency can be found at the columnar electrodes at perpendicular angles of beam incidence while the pixels are shown to be fully efficient at angles greater than ten degrees. A reduction in charge sharing compared to the planar technology is also demonstrated. Charge collection studies on irradiated devices with a Sr-90 source show higher charge collection efficiency for 3d over planar sensors at significantly lower applied bias. The sub-pixel response is probed by a micro-focused laser beam demonstrating areas of charge multiplication at high bias voltages.

关键词： 3d sensors high energy physics detectors radiation-hardness silicon detectors

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State-of-The-Art and Applications of 3d Imaging sensors in Industry, Cultural Heritage, Medicine, and Criminal Investigation

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sensors 2009年第1期9卷 568-601页

作者： Sansoni, Giovanna Trebeschi, Marco docchio, Franco Univ Brescia Optoelect Labs I-25123 Brescia Italy

3d imaging sensors for the acquisition of three dimensional (3d) shapes have created, in recent years, a considerable degree of interest for a number of applications. The miniaturization and integration of the optical and electronic components used to build them have played a crucial role in the achievement of compactness, robustness and flexibility of the sensors. Today, several 3d sensors are available on the market, even in combination with other sensors in a "sensor fusion" approach. An importance equal to that of physical miniaturization has the portability of the measurements, via suitable interfaces, into software environments designed for their elaboration, e. g., CAd-CAM systems, virtual renders, and rapid prototyping tools. In this paper, following an overview of the state-of-art of 3d imaging sensors, a number of significant examples of their use are presented, with particular reference to industry, heritage, medicine, and criminal investigation applications.

关键词： 3d sensors surface quality control reverse engineering optical triangulation crime scene investigation heritage restoration virtual reality

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Increased Speed: 3d Silicon sensors;Fast Current Amplifiers

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IEEE TRANSACTIONS ON NUCLEAR SCIENCE 2011年第2期58卷 404-417页

作者： Parker, Sherwood Kok, Angela Kenney, Christopher Jarron, Pierre Hasi, Jasmine despeisse, Matthieu da Via, Cinzia Anelli, Giovanni Univ Hawaii Lawrence Berkeley Lab Berkeley CA 94720 USA SINTEF MinaLab N-0314 Oslo Norway SLAC Natl Accelerator Lab Menlo Pk CA 94025 USA CERN CH-1211 Geneva 23 Switzerland Ecole Polytech Fed Lausanne Inst Microengn IMT Photovolta & Thin Film Elect Lab CH-2000 Neuchatel Switzerland Univ Manchester Dept Phys & Astron Manchester MI3 9PL Lancs England

The authors describe techniques to make fast, sub-nanosecond time resolution solid-state detector systems using sensors with 3d electrodes, current amplifiers, constant-fraction comparators or fast wave-form recorders... 详细信息

关键词： Fast pulses short time resolution silicon detectors solid-state detectors speed 3d sensors

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3d silicon sensors: design, large area production and quality assurance for the ATLAS IBL pixel detector upgrade

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NUCLEAR INSTRUMENTS & METHOdS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS dETECTORS ANd ASSOCIATEd EQUIPMENT 2012年 694卷 321-330页

作者： da Via, Cinzia Boscardin, Maurizio dalla Betta, Gian-Franco darbo, Giovanni Fleta, Celeste Gemme, Claudia Grenier, Philippe Grinstein, Sebastian Hansen, Thor-Erik Hasi, Jasmine Kenney, Chris Kok, Angela Parker, Sherwood Pellegrini, Giulio Vianello, Elisa Zorzi, Nicola Univ Trento DISI I-38123 Trento Italy INFN I-38123 Trento Italy Univ Manchester Sch Phys & Astron Manchester M13 9PL Lancs England FBK CMM Fdn Bruno Kessler I-38123 Trento Italy INFN Sez Genova I-14146 Genoa Italy CSIC CNM IMB Ctr Nacl Microelect E-08193 Barcelona Spain SLAC Natl Accelerator Lab Menlo Pk CA 94025 USA IFAE E-08193 Bellaterra Barcelona Spain Univ Autonoma Barcelona E-08193 Bellaterra Barcelona Spain SINTEF MiNaLab N-0314 Oslo Norway Univ Hawaii Lawrence Berkeley Natl Lab Berkeley CA 94720 USA

3d silicon sensors, where electrodes penetrate the silicon substrate fully or partially, have successfully been fabricated in different processing facilities in Europe and USA. The key to 3d fabrication is the use of plasma micro-machining to etch narrow deep vertical openings allowing dopants to be diffused in and form electrodes of pin junctions. Similar openings can be used at the sensor's edge to reduce the perimeter's dead volume to as low as similar to 4 mu m. Since 2009 four industrial partners of the 3d ATLAS R&d Collaboration started a joint effort aimed at one common design and compatible processing strategy for the production of 3d sensors for the LHC Upgrade and in particular for the ATLAS pixel Insertable B-Layer (IBL). In this project, aimed for installation in 2013, a new layer will be inserted as close as 3.4 cm from the proton beams inside the existing pixel layers of the ATLAS experiment. The detector proximity to the interaction point will therefore require new radiation hard technologies for both sensors and front end electronics. The latter, called FE-I4, is processed at IBM and is the biggest front end of this kind ever designed with a surface of similar to 4 cm(2). The performance of 3d devices from several wafers was evaluated before and after bump-bonding. Key design aspects, device fabrication plans and quality assurance tests during the 3d sensors prototyping phase are discussed in this paper. (C) 2012 CERN. Published by Elsevier B.V. All rights reserved.

关键词： Silicon sensors 3d sensors Radiation hard detectors ATLAS upgrade

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Hybrid detectors of Neutrons Based on 3d Silicon sensors with Polysiloxane Converter

Hybrid Detectors of Neutrons Based on 3D Silicon Sensors wit...

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60th IEEE Nuclear Science Symposium (NSS) / Medical Imaging Conference (MIC) / 20th International Workshop on Room-Temperature Semiconductor X-ray and Gamma-ray detectors

作者： dalla Betta, Gian-Franco Boscardin, Maurizio Carturan, Sara Cinausero, Marco Collazuol, Gianmaria dalla Palma, Matteo Giacomini, Gabriele Gramegna, Fabiana Granja, Carlos Marchi, Tommaso Mendicino, Roberto Perillo, Ennio Povoli, Marco Quaranta, Alberto Ronchin, Sabina Slavicek, Tomas Stefanik, Milan Vacik, Jiri Zorzi, Nicola Univ Trento INFN Padova Grp Collegato Trento Via Sommarive 14 I-38123 Trento Italy INFN Lab Nazl Legnaro I-35020 Legnaro Italy Czech Tech Univ Inst Expt & Appl Phys CR-12800 Prague Czech Republic Acad Sci Czech Republ Inst Phys Nucl CR-25068 Prague Czech Republic

ISBN: (纸本)9781479905348

We report on the first prototypes of hybrid detectors for neutrons from the INFN HYdE project. devices consist of 3d silicon sensors coupled to PolySiloxane-based converters. The sensor design and fabrication technology are presented, along with initial results from the functional characterization of the devices in response to radioactive sources and neutron beams of different energies.

关键词： 3d sensors Solid-state neutron detectors Fabrication technology Polysiloxane

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