Effective development of virtual reality (VR) applications is heavily reliant on the evaluation of user experience (UX). However, traditional methods such as questionnaires have inherent limitations which hinder their...
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This paper presents a metaheuristic optimization-based approach for selecting a pre-determined number of measurement markers from the set of available markers that optimizes the performance of the recently introduced ...
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This paper proposes a measurement technique for an integrated complex filter. The proposed method is based on two measurement methods with integrated circuitry for calibration. It is accomplished by applying square wa...
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Ensuring the proper use of Personal Protective Equipment (PPE) is critical for safeguarding workers in high-risk environments, such as power distribution systems. This work presents an innovative approach to monitorin...
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One of the key emerging technologies in Industry 4.0 is the Digital Twin (DT). Although it promises increased efficiency, productivity, and innovation, its adoption faces challenges such as high investment costs and t...
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The evolution of manufacturing has led to Industry 5.0, where human creativity is integrated with advanced technology to achieve efficient and sustainable production. Given the high volume and diversity of assembly ta...
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The evolution of manufacturing has led to Industry 5.0, where human creativity is integrated with advanced technology to achieve efficient and sustainable production. Given the high volume and diversity of assembly tasks, operator assistance systems have become essential tools in the industry, leveraging augmented reality (AR) and other new technologies. This literature review specifically examines 19 papers on AR applications within the context of industrial assembly tasks. The review focuses on identifying the types of AR technologies utilized, the methodologies for implementing AR systems in assembly, and the primary limitations and challenges encountered. The findings indicate a growing field with promising applications in assembly, training, and maintenance, predominantly using AR glasses. Furthermore, a gap is identified indicating the absence of a standardized framework for AR-based assembly assistance systems. Future research should aim at creating a foundational framework for AR system implementation, thereby accelerating the adoption of innovative technologies in the industry.
One of the key emerging technologies in Industry 4.0 is the Digital Twin (DT). Although it promises increased efficiency, productivity, and innovation, its adoption faces challenges such as high investment costs and t...
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In this study, CdS thin films were produced in a quasi-closed volume using two different techniques (classical and cryogenic thermal evaporation techniques) between the 100–573 K substrate temperature, and t...
In this study, CdS thin films were produced in a quasi-closed volume using two different techniques (classical and cryogenic thermal evaporation techniques) between the 100–573 K substrate temperature, and their characteristic properties (structural, electrical, and optical properties) were investigated. While CdS thin films were produced at 373 K, 473 K, and 573 K substrate temperatures in the classical technique (hot), they were produced at 100–300 K substrate temperature range with 50 K steps in the cryogenic technique (cold). The X-Ray Diffraction (XRD) analysis showed that the CdS thin films grew in a hexagonal structure in the (002) plane at all substrate temperatures. According to the field emission scanning electron microscope (FESEM) images, the thin films produced at 200 K substrate temperature consisted of equally sized spherical grains. This situation shows that the soliton growth mechanism occurs at a substrate temperature of 200 K during the film production process with the cryogenic technique. Due to the characteristic properties of the soliton waves occurring on the substrate surface in the soliton growth mechanism (mass transport), the films grow in a tight-packed form. Therefore, the produced films consist of clusters of equal size, providing a homogeneous surface and a uniform thickness. In addition, Atomic Force Microscope (AFM) and optical analyses showed that the CdS thin film produced at 200 K substrate temperature had the smallest average surface roughness value (Ra) and the highest optical transmittance value. It was found that the energy band gap (2.37–2.47 eV) and resistivity (1.25 × 103–5.39 × 103 Ω-cm) values of CdS thin films increased with decreasing substrate temperature. The carrier density increased with decreasing substrate temperature (3.91 × 1017–1.73 × 1016 cm−3). Energy Dispersive Spectroscopy (EDS) analysis showed that the films grew stoichiometrically at substrate tempe
Industrial prognostics focuses on utilizing degradation signals to forecast and continually update the residual useful life of complex engineeringsystems. However, existing prognostic models for systems with multiple...
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Industrial prognostics focuses on utilizing degradation signals to forecast and continually update the residual useful life of complex engineeringsystems. However, existing prognostic models for systems with multiple failure modes face several challenges in real-world applications, including overlapping degradation signals from multiple components, the presence of unlabeled historical data, and the similarity of signals across different failure modes. To tackle these issues, this research introduces two prognostic models that integrate the mixture (log)-location-scale distribution with deep learning. This integration facilitates the modeling of overlapping degradation signals, eliminates the need for explicit failure mode identification, and utilizes deep learning to capture complex nonlinear relationships between degradation signals and residual useful lifetimes. Numerical studies validate the superior performance of these proposed models compared to existing methods.
Searching reads from unknown origins in a reference database and finding evolutionarily similar genomes is central to many applications. Quantifying the similarity by estimating the distance between each read and matc...
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