RapidIO is an open standard that provides high-performance interconnect for chip-to-chip, board-to-board, and chassis-to-chassis communications. In this paper, we present an executable RapidIO interconnect in which an...
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RapidIO is an open standard that provides high-performance interconnect for chip-to-chip, board-to-board, and chassis-to-chassis communications. In this paper, we present an executable RapidIO interconnect in which an improved Buffer structure based on flow control is put forward. It helps to provide a smooth data flow, strong built-in error detection and error recovery mechanisms. It is tested to increase utilization and lower packet latency. And it can be applied to reliable and high speed embedded system communications.
A study of two major types of LDMOS-SCR electrostatic discharge protection devices for 60V SOI BCD technology is presented. The difference of the P-anode implant positions influences the triggering mechanism of the tw...
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A study of two major types of LDMOS-SCR electrostatic discharge protection devices for 60V SOI BCD technology is presented. The difference of the P-anode implant positions influences the triggering mechanism of the two types of devices. The relationship between I-V behavior under ESD and the device parameter is studied. Heat dissipation capability of the device is also presented.
RapidIO is an emerging high-performance and point-to-point packetized interconnection technology. In this paper, the design of the logical core based on safety arbitration mechanisms is described in detail. The packin...
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RapidIO is an emerging high-performance and point-to-point packetized interconnection technology. In this paper, the design of the logical core based on safety arbitration mechanisms is described in detail. The packing and unpacking of I/O Logical, Message Passing and Globally Shared Memory transactions are achieved. Excellent average data transfer rates, up to 7.8 bytes per cycle are reached in certain transactions with 256-byte data payloads, meanwhile the data efficiencies are more than 95%. Moreover, maintenance read transactions targeted at local capability and status registers can be executed in a lower latency compared with the reference design.
In summary, a novel RRAM with the structure of Cu/Si x O y N z /W was first fabricated and its characteristics are thoroughly investigated. The new device exhibited low switching voltages and low reset currents, demon...
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In summary, a novel RRAM with the structure of Cu/Si x O y N z /W was first fabricated and its characteristics are thoroughly investigated. The new device exhibited low switching voltages and low reset currents, demonstrating its potential for low-power applications. Repeatable unipolar resistive switching characteristics in terms of high off/on resistance ratio and good retention capability were observed. The switching mechanism of the device was analyzed and can be explained by the formation and rupture of vacancy filaments.
We calculate valence band structures and transport property of HfO 2 gate dielectric surrounded Ge (110) nanowire with a radial force at the boundary of the insulator. The radial force pushes the valence subbands dow...
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ISBN:
(纸本)9781424435432;9781424435449
We calculate valence band structures and transport property of HfO 2 gate dielectric surrounded Ge (110) nanowire with a radial force at the boundary of the insulator. The radial force pushes the valence subbands downwards. Most of hole effective masses of top five subbands decrease and densities of states' peaks move down as the force increases. The hole mobility in Ge (110) NW significantly increases with higher force values.
This paper presents a novel mixed-voltage I/O buffer without an extra dual-oxide CMOS *** mixed-voltage I/O buffer with a simplified circuit scheme can overcome the problems of leakage current and gateoxide reliabilit...
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This paper presents a novel mixed-voltage I/O buffer without an extra dual-oxide CMOS *** mixed-voltage I/O buffer with a simplified circuit scheme can overcome the problems of leakage current and gateoxide reliability that the conventional CMOS I/O buffer *** design is realized in a 0.13-μm CMOS process and the simulation results show a good performance increased by ~34% with respect to the product of power consumption and speed.
This paper describes an 8-bit 125 MHz low-power CMOS fully-folding analog-to-digital converter (ADC) A novel mixed-averaging distributed T/H circuit is proposed to improve the accuracy. Folding circuits are not only...
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This paper describes an 8-bit 125 MHz low-power CMOS fully-folding analog-to-digital converter (ADC) A novel mixed-averaging distributed T/H circuit is proposed to improve the accuracy. Folding circuits are not only used in the fine converter but also in the coarse one and in the bit synchronization block to reduce the number of comparators for low power. This ADC is implemented in 0.5μm CMOS technology and occupies a die area of 2 × 1.5 mm^2. The measured differential nonlinearity and integral nonlinearity are 0.6 LSB/-0.8 LSB and 0.9 LSB/-1.2 LSB, respectively. The ADC exhibits 44.3 dB of signal-to-noise plus distortion ratio and 53.5 dB of spurious-free dynamic range for 1 MHz input sine-wave. The power dissipation is 138 mW at a sampling rate of 125 MHz at a 5 V supply.
A novel voltage controlled oscillator (VCO) sub-band selection circuit to achieve fast phase locked loop (PLL) calibration is presented, which reduces the calibration time by measuring the period difference direct...
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A novel voltage controlled oscillator (VCO) sub-band selection circuit to achieve fast phase locked loop (PLL) calibration is presented, which reduces the calibration time by measuring the period difference directly and accomplishing an efficient search for an optimum VCO sub-band. The sub-band selection circuit was implemented in a 0.18 μm CMOS logic process with a PLL using an 8 sub-band VCO. The measured calibration time is less than 3 μs in a VCO frequency range from 600 MHz to 2 GHz. The proposed circuit consumes 0.64 mA at most.
A novel nano-scale lateral double-gate tunneling field effect transistor (LDG-TFET) is proposed in this paper and its performance is shown through two dimensional device numerical simulations. The study result demonst...
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ISBN:
(纸本)9781424435432
A novel nano-scale lateral double-gate tunneling field effect transistor (LDG-TFET) is proposed in this paper and its performance is shown through two dimensional device numerical simulations. The study result demonstrates that this new tunneling transistor allows for the steeper sub-threshold swings, e.g. below 60 mV/Dec, the super low supply voltage, e.g. operable at VDD <0.2V and the high ratio between the turn-on and turn-off current for the availability of high-k/metal stack materials. This tunneling field effect transistor may be integrated with present CMOS process and architecture with some specific applications such as memories because of the low turn-off current and when the delay is truly determined by interconnects because of its high turn-on/turn off ratio, which are important for next generation of micro-power and ultra-low integrated circuits.
A CMOS ASIC has been designed and implemented for readout and control of MEMS vibratory gyroscopes. A low noise design is achieved by using the technique of sinusoidal chopper stabilization with a chopping frequency o...
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ISBN:
(纸本)9781424457977
A CMOS ASIC has been designed and implemented for readout and control of MEMS vibratory gyroscopes. A low noise design is achieved by using the technique of sinusoidal chopper stabilization with a chopping frequency of 2MHz, which will effectively suppress the low frequency noise. A closed loop control method in driving mode is presented. The Chip is fabricated in a 0.35μm standard CMOS process with an area of 2.5×2.5mm2. The test is performed with a vibratory gyroscope on the condition of closed-loop control, and the measurement result shows a detecting resolution of 6aF in 100Hz bandwidth from a single 5V supply.
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