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Finite Element Analysis of Subsurface Damage of Optical Glass after Grinding

Journal of Physics: Conference Series 2021年第2期1802卷

作者： Wei Su Wenhao Luo Xianshan Dong Renhuai Liu MOE Key lab of Disaster Forecast and Control in Engineering Guangzhou 510632 China Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou 510610 China School of Mechanics and Construction Engineering Jinan University Guangzhou 510632 China

The interaction between abrasive particles and optical element surface can result in various forms of subsurface damage while removing the material. In order to obtain the stress distribution during optical glass grinding, the finite element analysis of optical glass grinding is carried out by using ANSYS software. The stress distribution of optical glass was obtained by establishing the grinding model of consolidated abrasive and free abrasive. The simulation results show that different abrasives have different damage degrees to the glass surface, which provides a useful reference for improving the quality of optical material processing technology.

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Residual Stress Analysis of Laser Welding Between Output Needle and Helix

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Journal of Physics: Conference Series 2021年第2期1802卷

In order to obtain the welding stress of the output needle and helix, a finite element model is established and the mesh at the weld is refined to evaluate the welding residual stress. ANSYS parameter design language is used to simulate the motion load of welding heat source. Based on the exact calculation of the temperature field, the corresponding thermal units are converted into structural units to calculate the welding residual stress. Finally, the thermal stress distribution curve and residual stress distribution trend are obtained after post-treatment.

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Computer Transient Simulation for Dual In-Line Package through Finite Element Analysis and ANASYS Software

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Journal of Physics: Conference Series 2021年第1期2033卷

作者： Wei Su Wenhao Luo Xianshan Dong Si Chen Agam Tomar Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou China MOE Key lab of Disaster Forecast and Control in Engineering Guangzhou China School of Mechanics and Construction Engineering Jinan University Guangzhou China Faculty of Engineering and Mathematical Sciences University of Western Australia

The reliability of the DIP package is studied by numerical simulation. Firstly, the DIP package, fixture and metal steel are modeled. Based on this, variable thickness papers are laid on the sample. According to the experiment, corresponding excitation and boundary condition are set. Then, the transient analysis result of DIP package is obtained through numerical simulation. The results show the relation of different thickness papers and acceleration-time curve, which provides a beneficial reference for the optimization of DIP packing.

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Wave Soldering Coupled Thermal-mechanical Simulation of Multi-layer Ceramic Capacitors

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IOP Conference Series: Earth and Environmental Science 2021年第4期632卷

作者： Wei Su Wenhao Luo Junkui Li Renhuai Liu MOE Key lab of Disaster Forecast and Control in Engineering Guangzhou 510632 China. Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou 510610 China. School of Mechanics and Construction Engineering Jinan University Guangzhou 510632 China

In this paper, the thermal-mechanical coupling finite element analysis of MLCC wave soldering with heat conduction and heat convection is calculated, and the steady-state temperature field and transient temperature field as well as the stress distribution of MLCC are obtained. Using the finite element analysis method of indirect thermal-mechanical coupling, the stress analysis is carried out with the temperature field as the boundary condition, and the thermal-structural coupling model is established. By analyzing the thermal stress of MLCC, the weak parts sensitive to thermal stress are determined, which provides a useful reference for solving the reliability problem of MLCC wave soldering.

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Harmonic Response Analysis for Ball Grid Array Package Using Computer Finite Element Simulation

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Journal of Physics: Conference Series 2021年第1期2033卷

BGA package is selected as the research object in this paper. Workbench (finite elemental analysis tool in ANSYS) is used for harmonic response analysis. The author lays several paper sheets on the sample and builds the finite element model of clamp, ceramic and metal plate. Then, the model analysis is carried out. Based on this, it is converted to harmonic response analysis. According to the results, the author has found that there is no relation between the number of paper sheets and acceleration-frequency result. It promotes the development of electronic packaging reliability.

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Numerical Simulation of Random Vibration Analysis for Ball Grid Array Package

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IOP Conference Series: Earth and Environmental Science 2021年第3期769卷

作者： Wenhao Luo Wei Su Xianshan Dong Zhenhua Nie Agam Tomar MOE Key lab of Disaster Forecast and Control in Engineering Guangzhou China School of Mechanics and Construction Engineering Jinan University Guangzhou China Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou China Faculty of Engineering and Mathematical Sciences University of Western Australia Perth Australia

This paper uses ANSYS Workbench (a finite element analysis software) to simulate BGA ceramic packing. The author models fixture, ceramic and metal steel. Then different thickness papers are laid on the BGA product. By random vibration analysis, the natural frequency and mode of the sample are obtained. According the results, the author discusses the relationship between different thickness papers and PSD-frequency curve. It provides a benefit instruction for the design of BGA packing.

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A unified and explicit approach for accurately characterizing the hardening-softening behavior of metals with a tension-compression strength asymmetry

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IOP Conference Series: Materials Science and engineering 2020年第1期770卷

作者： H F Xi L Zhan S Y Wang Z H Xu H Xiao School of Mechanics & Construction Engineering and MOE Lab for Disaster Forecast & Control in Engineering Jinan University 510632 Guangzhou China State Key Laboratory for Strength and Vibration of Mechanical Structures Xi'an Jiaotong University 710049 Xi'an China

A unified and explicit approach is proposed for accurately characterizing a complex hardening-softening behavior of metals with a tension-compression strength asymmetry. The proposed approach provides an explicit determining of the yield strength as plastic work function and contains the following three procedures: (i) a mode invariant is introduced to express the yield strength as a sum of two uncoupled parts for the tension and the compression case; (ii) a new expression for the plastic work is derived explicitly in terms of the uniaxial stress-strain function and, then, the yield strength function can be determined jointly from the just-mentioned two functions with the axial strain as parametric variable; and, finally, (iii) the axial stress-strain function is presented for representing the hardening-softening features. With these procedures, test data over the entire hardening-softening range can be fitted independently for the tension and the compression cases by directly treating the uniaxial stress-strain function. As such, tedious trial-and-error procedures are bypassed in identifying numerous unknown parameters. Numerical examples show that accurate simulations may be achieved with the proposed approach.

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An explicit simulation of arbitrarily-shaped pseudo-elastic hysteresis loops in shape-memory alloys

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IOP Conference Series: Materials Science and engineering 2020年第1期770卷

作者： S Y Wang L Zhan Z H Xu H F Xi H Xiao School of Mechanics & Construction Engineering and MOE Lab for Disaster Forecast & Control in Engineering Jinan University 510632 Guangzhou China State Key Laboratory for Strength and Vibration of Mechanical Structures Xi'an Jiaotong University 710049 Xi'an China

A new and explicit approach is proposed for accurately simulating pseudo-elastic hysteresis loops of any shape in shape-memory alloys (SMAs). For this purpose, new finite strain elastoplastic J2-flow equations are established for modeling finite strain behavior of SMAs. A stress-strain loop of any given shape in each uniaxial loading-unloading cycle is derived exactly from these equations. Then, a new technique is further introduced toward integrating usual piecewise linear splines into a single smooth interpolating function in a unified form. With the proposed equations and technique, test data for SMA hysteresis loops of any shape may be automatically fitted with high accuracy based on a single-parameter identification.

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An explicit high-efficiency algorithm for simulating high-cycle fatigue behavior of metals

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IOP Conference Series: Materials Science and engineering 2020年第1期770卷

作者： S Y Wang L Zhan Z H Xu H F Xi H Xiao School of Mechanics & Construction Engineering and MOE Lab for Disaster Forecast & Control in Engineering Jinan University West Huangpu Avenue 601 510632 Guangzhou China State Key Laboratory for Strength and Vibration of Mechanical Structures Xi'an Jiaotong University 710049 Xi'an China

This article presents a direct and efficient algorithm for simulating high-cycle fatigue failure effects within the framework of a recently proposed elastoplastic model, in which fatigue failure effects of metals are incorporated as inherent constitutive features. Toward bypassing very time-consuming procedures in conducting numerical integrations of the elastoplastic rate equations for extremely large number of loading cycles, from the new model it is possible to derive an explicit expression for the fatigue life directly in terms of the stress amplitude. Numerical examples show that the new algorithm thus established is much more efficient than usual direct numerical procedures and that is particularly the case in simulating fatigue failure effects with very high cycle number.

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A unified simulation of low-to-high cycle fatigue failure effects for metals with efficient algorithm

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IOP Conference Series: Materials Science and engineering 2020年第1期770卷

作者： L Zhan S Wang Z H Xu H F Xi H Xiao School of Mechanics & Construction Engineering and MOE Lab for Disaster Forecast & Control in Engineering Jinan University West Huangpu Avenue 601 510632 Guangzhou China State Key Laboratory for Strength and Vibration of Mechanical Structures Xi'an Jiaotong University 710049 Xi'an China

Within the framework of a recently established elastoplasticity model incorporating fatigue failure effects into inherent response features, a new and efficient algorithm is proposed to simultaneously treat fatigue failure effects from low to high cycle cases. From the new model it is possible to derive an explicit algorithm with which the accumulated plastic work is directly calculated by means of a recursive scheme, thus bypassing very time-consuming procedures in carrying out numerical integrations of the elastoplastic rate equations for a large number of loading-unloading cycles. Comparisons of simulation results with fatigue failure data from low to high cycle cases are presented to demonstrate the efficacy of the new algorithm.

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