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IEEE SPECTRUM 2007年第10期44卷 29-35页

作者： Bohr, Mark T. Chau, Robert S. Ghani, Tahir Mistry, Kaizad Process architecture and integration Intel Transistor Transistor technology and integration Logic and technology development group

The article reports on Intel's latest Core 2 microprocessors, also known as Penryn. This latest innovation from Intel is based on a 45-nanometer CMOS process technology. It is expected to run cooler and faster than previous microprocessors. The development of the Penryn was accomplished through a major breakthrough on the way the gate stack was manufactured. Intel developers experienced a shortage of atoms when the transistor's gate oxide reached a thickness of only 5 atoms. They developed the high-k plus metal gate transistors to address the limitations they faced with the silicon dioxide insulators. Penryn processors can have as much as 820 million transistors, versions of which can be used for different devices including mobile, desktop, server applications, and workstations.

关键词： MICROPROCESSORS TRANSISTORS SILICA METAL insulator semiconductors ATOMS NANOSTRUCTURED materials TECHNOlogicAL innovations COMPUTERS

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Enhancing microprocessor immunity to power supply noise with clock/data compensation

Enhancing microprocessor immunity to power supply noise with...

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2005 Symposium on VLSI Circuits

作者： Rahal-Arabi, Tawfik Taylor, Greg Barkatullah, Javed Wong, Keng L. Ma, Matthew Logic Technology Development Desktop Platforms Group Intel Corporation

ISBN: (纸本)490078401X

This paper demonstrates an alternative to the conventional wisdom that microprocessors require a flat impedance spectrum across a broad range of frequencies in order to deliver maximum operating frequency. Delivering this impedance requires large amounts of on-die capacitance. We show that proper co-design of the clock and power distribution networks can relax this requirement, saving the area and leakage power needed for on-die decoupling. Measurements made on a 130 nm processor demonstrate the approach.

关键词： Microprocessor chips

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History-effect-conscious SPICE model extraction for PD-SOI technology

History-effect-conscious SPICE model extraction for PD-SOI t...

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2004 IEEE International SOI Conference, Proceedings

作者： Goo, Jung-Suk An, Judy Xilin Thuruthiyil, Ciby Ly, Tran Chen, Qiang Radwin, Martin Wu, Zhi-Yuan Lee, Michael S.L. Zamudio, Luis Yonemura, James Assad, Farzin Pelella, Mario M. Icel, Ali B. Logic Technology Development Group Advanced Micro Devices Sunnyvale CA 94088-3453

The explicit fitting guidelines for AC and DC characteristics specifically focussed on accurate modeling of the history effects in PD-SOI-CMOS circuits were discussed. The measured data showed a saturated slope in the negative-bias range and it was an artifact of high resistance and partial depletion of the thin-body. The VDD dependence of the history-effect were different since the log-scale slope of the dashed-line was 45% higher than that of the solid-line in the low-bias forward region. Analysis shows that the fitting strategy raised the level of the history-effect by about 5% and also enhanced the voltage dependence.

关键词： Electric network analysis

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2nd generation embedded DRAM with 4X lower self refresh power in 22nm Tri-Gate CMOS technology

2nd generation embedded DRAM with 4X lower self refresh powe...

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28th IEEE Symposium on VLSI Circuits, VLSIC 2014

作者： Meterelliyoz, Mesut Al-Amoody, Fuad H. Arslan, Umut Hamzaoglu, Fatih Hood, Luke Lal, Manoj Miller, Jeffrey L. Ramasundar, Anand Soltman, Dan Wan, Ifar Wang, Yih Zhang, Kevin Logic Technology Development Intel Corporation Hillsboro OR United States Platform Engineering Group Intel Corporation Hillsboro OR United States

ISBN: (纸本)9781479933273

2nd generation 1Gbit 2GHz Embedded DRAM (eDRAM) with 4X lower self refresh power compared to prior generation is developed in 22nm Tri-Gate CMOS technology. Retention time has been improved by 3X (300us@95°C) by process and design optimizations. Source synchronous clocking is integrated in the design to reduce clock power without penalizing bandwidth. Charge pump power is reduced by 4X by employing comparator based regulation. Temperature controlled refresh enables minimum refresh power at all temperature conditions. © 2014 IEEE.

关键词： Clocks

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Enhancing microprocessor immunity to power supply noise with clock/data compensation

Enhancing microprocessor immunity to power supply noise with...

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Symposium on VLSI Circuits

作者： T. Rahal-Arabi G. Taylor J. Barkatullah K.L. Wong M. Ma Logic Technology Development / Desktop Platforms Group Intel Corporation USA

关键词： Microprocessors Power supplies Clocks Impedance Frequency Circuit noise Capacitance Voltage Electricity supply industry logic

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Enhanced thermal management for future processors

Enhanced thermal management for future processors

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Symposium on VLSI Circuits

作者： M. Ma S.H. Gunther B. Greiner N. Wolff C. Deutschle T. Arabi Logic Technology Development/ Desktop Products Group Intel Corporation USA

An enhanced thermal management mechanism that reduces power by scaling frequency and voltage in response to excessive temperatures is presented. The voltage transition process is done transparently to the execution of applications. The enhanced mechanism achieves an /spl sim/50% power reduction while limiting the performance impact to only /spl sim/20% for the duration of the thermal event. The approach allows the processor to meet its performance and reliability goals without additional thermal solution costs.

关键词： Thermal management Voltage Frequency Temperature sensors Energy consumption logic Energy management Costs Power generation Clocks

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development and validation of an electromagnetic distributed power grid model for the 90nm Pentium/spl reg/ 4 processor

Development and validation of an electromagnetic distributed...

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Symposium on VLSI Circuits

作者： T. Rahal-Arabi Gang Ji M. Ma A. Muhtaroglu G. Taylor Logic Technology Development Microprocessor Design Group Intel Corporation Hillsboro OR USA

In this paper, we show that it is necessary to include the distributed effects of the power grid to accurately model the power supply noise for high frequency microprocessors. We show that high frequency resonances can be entirely missed if such effects are not modeled. Finally we prove the theory with experimental validation on the 90 nm Pentium/spl reg/ 4 microprocessor.

关键词： Power grids Electromagnetic modeling Inductance Frequency Capacitance Microprocessors Integrated circuit interconnections Predictive models Electric resistance Packaging

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Low-voltage metal-fuse technology featuring a 1.6V-programmable 1T1R bit cell with an integrated 1V charge pump in 22nm tri-gate process 29

Low-voltage metal-fuse technology featuring a 1.6V-programma...

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29th Annual Symposium on VLSI Circuits, VLSI Circuits 2015

作者： Kulkarni, S.H. Chen, Z. Srinivasan, B. Pedersen, B. Bhattacharya, U. Zhang, K. Advanced Design Logic Technology Development Intel Corporation HillsboroOR United States NVM Solutions Group Intel Corporation HillsboroOR United States Custom Foundry Intel Corporation HillsboroOR United States

ISBN: (纸本)9784863485020

This work introduces the first high-volume manufacturable metal-fuse technology in a 22nm tri-gate high-k metal-gate CMOS process. A high-density array featuring a 16.4μm2 1T1R bit cell is presented that delivers a record low program voltage of 1.6V. This low-voltage operability allows the array to be coupled with logic-voltage power delivery circuits. A charge pump voltage doubler operating on a 1V voltage rail is demonstrated in this paper with healthy fusing yield. © 2015 JSAP.

关键词： Metals

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Material Modeling in Semiconductor Process Applications

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Journal of Microelectronic Manufacturing 2020年第4期3卷 40-50页

作者： Boris A.Voinov Patrick H.Keys Stephen M.Cea Ananth P.Kaushik Mark A.Stettler Logic Technology Development Intel CorporationHillsboro ORUSA95124 Nonvolatile Memory Solutions Group Intel CorporationSanta ClaraCaliforniaUSA95054 Logic Technology Development Intel CorporationNizhniy NovgorodRussian Federation603024

During the past decade,significant progress has been achieved in the application of material modeling to aid technology development in semiconductor manufacturing companies such as *** this paper,we review examples of applications involving a complex set of material modeling tools and methodologies and share our perspective of the future of the *** are given illustrating the landscape of useful physical models and approaches along with commentary addressing tool relevance and simulation efficiency *** the scope of this paper precludes providing in-depth details,references to more focused publications are ***,we outline how to approach constructing a general infrastructure for supporting TCAD material modeling applications.

关键词： TCAD atomistic modeling density functional theory molecular dynamics kinetic Monte Carlo.

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Measurement and analysis of laser transmission through solid-propellant rocket motor exhaust plumes

Measurement and analysis of laser transmission through solid...

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AIAA 28th Thermophysics Conference, 1993

作者： Murphy, P.J. Reed, R.A. Cox, D.B. Wilcher, G.A. Watkins, W.A. Truesdale, R. Simmons, M.A. Roberds, D.W. Opti-Logic Corporation TullahomaTN37388 United States Sverdrup Technology Inc. AEDC Group Arnold Engineering Development Center Arnold Air Force Base TN37389 United States

The size distribution of aluminum oxide droplets and particles in rocket exhausts is needed for the prediction of two-phase motor performance losses and plume radiative heating. Current estimates of size are based upon particle samples collected from the far-field plume and are possibly biased due to aerodynamic effects. We have therefore attempted to provide an independent measure of rocket exhaust particle size using nonintrusive laser diagnostics. Laser measurements were performed near the nozzle exit plane of several solid-propellant rocket motors with thrusts ranging from 6,500 to 35,000 Ibf. Specifically, the transmissions of the exhaust plumes were measured at laser wavelengths of 0.337, 0.515, 0.532,1.06,3.39, and 10.6 pm. Estimates of the mean particle size were obtained from these data in two different ways. The first method used a simple flow-field model to incorporate the known mass flow rate and plume diameter into the solution. The second method used only the wavelength dependence of the transmission and required no assumptions whatsoever about the plume flow field. Results from these two methods were in fair agreement and also did not differ greatly from sizes determined by far-field particle collections. The spatial distribution of aluminum oxide particles within the exhaust plume was also investigated with multipath transmission measurements, and a detailed exit plane profile of the exhaust particle opacity was retrieved for one large orbital insertion motor. © 1993 by the American institute of Aeronautics and Astronautics, Inc.

关键词： Rockets

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