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检索条件"机构=Logic Technology Development Group"
38 条 记 录,以下是1-10 订阅
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The high-k solution
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IEEE SPECTRUM 2007年 第10期44卷 29-35页
作者: Bohr, Mark T. Chau, Robert S. Ghani, Tahir Mistry, Kaizad Process architecture and integration Intel Transistor Transistor technology and integration Logic and technology development group
The article reports on Intel's latest Core 2 microprocessors, also known as Penryn. This latest innovation from Intel is based on a 45-nanometer CMOS process technology. It is expected to run cooler and faster tha... 详细信息
来源: 评论
Enhancing microprocessor immunity to power supply noise with clock/data compensation
Enhancing microprocessor immunity to power supply noise with...
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2005 Symposium on VLSI Circuits
作者: Rahal-Arabi, Tawfik Taylor, Greg Barkatullah, Javed Wong, Keng L. Ma, Matthew Logic Technology Development Desktop Platforms Group Intel Corporation
This paper demonstrates an alternative to the conventional wisdom that microprocessors require a flat impedance spectrum across a broad range of frequencies in order to deliver maximum operating frequency. Delivering ... 详细信息
来源: 评论
History-effect-conscious SPICE model extraction for PD-SOI technology
History-effect-conscious SPICE model extraction for PD-SOI t...
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2004 IEEE International SOI Conference, Proceedings
作者: Goo, Jung-Suk An, Judy Xilin Thuruthiyil, Ciby Ly, Tran Chen, Qiang Radwin, Martin Wu, Zhi-Yuan Lee, Michael S.L. Zamudio, Luis Yonemura, James Assad, Farzin Pelella, Mario M. Icel, Ali B. Logic Technology Development Group Advanced Micro Devices Sunnyvale CA 94088-3453
The explicit fitting guidelines for AC and DC characteristics specifically focussed on accurate modeling of the history effects in PD-SOI-CMOS circuits were discussed. The measured data showed a saturated slope in the... 详细信息
来源: 评论
2nd generation embedded DRAM with 4X lower self refresh power in 22nm Tri-Gate CMOS technology
2nd generation embedded DRAM with 4X lower self refresh powe...
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28th IEEE Symposium on VLSI Circuits, VLSIC 2014
作者: Meterelliyoz, Mesut Al-Amoody, Fuad H. Arslan, Umut Hamzaoglu, Fatih Hood, Luke Lal, Manoj Miller, Jeffrey L. Ramasundar, Anand Soltman, Dan Wan, Ifar Wang, Yih Zhang, Kevin Logic Technology Development Intel Corporation Hillsboro OR United States Platform Engineering Group Intel Corporation Hillsboro OR United States
2nd generation 1Gbit 2GHz Embedded DRAM (eDRAM) with 4X lower self refresh power compared to prior generation is developed in 22nm Tri-Gate CMOS technology. Retention time has been improved by 3X (300us@95°C) by ... 详细信息
来源: 评论
Enhancing microprocessor immunity to power supply noise with clock/data compensation
Enhancing microprocessor immunity to power supply noise with...
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Symposium on VLSI Circuits
作者: T. Rahal-Arabi G. Taylor J. Barkatullah K.L. Wong M. Ma Logic Technology Development / Desktop Platforms Group Intel Corporation USA
This paper demonstrates an alternative to the conventional wisdom that microprocessors require a flat impedance spectrum across a broad range of frequencies in order to deliver maximum operating frequency. Delivering ... 详细信息
来源: 评论
Enhanced thermal management for future processors
Enhanced thermal management for future processors
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Symposium on VLSI Circuits
作者: M. Ma S.H. Gunther B. Greiner N. Wolff C. Deutschle T. Arabi Logic Technology Development/ Desktop Products Group Intel Corporation USA
An enhanced thermal management mechanism that reduces power by scaling frequency and voltage in response to excessive temperatures is presented. The voltage transition process is done transparently to the execution of... 详细信息
来源: 评论
development and validation of an electromagnetic distributed power grid model for the 90nm Pentium/spl reg/ 4 processor
Development and validation of an electromagnetic distributed...
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Symposium on VLSI Circuits
作者: T. Rahal-Arabi Gang Ji M. Ma A. Muhtaroglu G. Taylor Logic Technology Development Microprocessor Design Group Intel Corporation Hillsboro OR USA
In this paper, we show that it is necessary to include the distributed effects of the power grid to accurately model the power supply noise for high frequency microprocessors. We show that high frequency resonances ca... 详细信息
来源: 评论
Low-voltage metal-fuse technology featuring a 1.6V-programmable 1T1R bit cell with an integrated 1V charge pump in 22nm tri-gate process  29
Low-voltage metal-fuse technology featuring a 1.6V-programma...
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29th Annual Symposium on VLSI Circuits, VLSI Circuits 2015
作者: Kulkarni, S.H. Chen, Z. Srinivasan, B. Pedersen, B. Bhattacharya, U. Zhang, K. Advanced Design Logic Technology Development Intel Corporation HillsboroOR United States NVM Solutions Group Intel Corporation HillsboroOR United States Custom Foundry Intel Corporation HillsboroOR United States
This work introduces the first high-volume manufacturable metal-fuse technology in a 22nm tri-gate high-k metal-gate CMOS process. A high-density array featuring a 16.4μm2 1T1R bit cell is presented that delivers a r... 详细信息
来源: 评论
Material Modeling in Semiconductor Process Applications
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Journal of Microelectronic Manufacturing 2020年 第4期3卷 40-50页
作者: Boris A.Voinov Patrick H.Keys Stephen M.Cea Ananth P.Kaushik Mark A.Stettler Logic Technology Development Intel CorporationHillsboro ORUSA95124 Nonvolatile Memory Solutions Group Intel CorporationSanta ClaraCaliforniaUSA95054 Logic Technology Development Intel CorporationNizhniy NovgorodRussian Federation603024
During the past decade,significant progress has been achieved in the application of material modeling to aid technology development in semiconductor manufacturing companies such as *** this paper,we review examples of... 详细信息
来源: 评论
Measurement and analysis of laser transmission through solid-propellant rocket motor exhaust plumes
Measurement and analysis of laser transmission through solid...
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AIAA 28th Thermophysics Conference, 1993
作者: Murphy, P.J. Reed, R.A. Cox, D.B. Wilcher, G.A. Watkins, W.A. Truesdale, R. Simmons, M.A. Roberds, D.W. Opti-Logic Corporation TullahomaTN37388 United States Sverdrup Technology Inc. AEDC Group Arnold Engineering Development Center Arnold Air Force Base TN37389 United States
The size distribution of aluminum oxide droplets and particles in rocket exhausts is needed for the prediction of two-phase motor performance losses and plume radiative heating. Current estimates of size are based upo... 详细信息
来源: 评论