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International Conference on (ICEPT) electronic Packaging technology

作者： Zezheng Li Bin Zhou Si Chen Tong An Fei Qin Chen Liang Beijing University of Technology Beijing China Science and technology on reliability physics and application of electronic component laboratory Guangzhou China National New Energy Vehicle Technology Innovation Center Beijing China

ISBN: (数字)9781728150642

ISBN: (纸本)9781728150659

In this paper, a three-dimensional model of Ceramic Column Grid Array (CCGA) package is established by finite element method, and the reliability of copper pillar bumps under the five manufacturing processes of copper pillar plating, solder joint welding, underfill filling, thermal paste filling and cover sealing is analyzed. Finally, this paper provides guidance for the optimization of fabrication process based on the results of finite element simulation. The results show that the stress and strain values of the solder joints are relatively large due to the higher reflow temperature; relatively large warpage values are generated when the filler and the thermal paste are filled; at the end of the fabrication process, the stress accumulation (von Mises stress) of the copper pillar bumps at the four corners of the package is maximized, and most likely to fail.

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Wave Soldering Coupled Thermal-mechanical Simulation of Multi-layer Ceramic Capacitors

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IOP Conference Series: Earth and Environmental science 2021年第4期632卷

作者： Wei Su Wenhao Luo Junkui Li Renhuai Liu MOE Key lab of Disaster Forecast and Control in Engineering Guangzhou 510632 China. Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou 510610 China. School of Mechanics and Construction Engineering Jinan University Guangzhou 510632 China

In this paper, the thermal-mechanical coupling finite element analysis of MLCC wave soldering with heat conduction and heat convection is calculated, and the steady-state temperature field and transient temperature field as well as the stress distribution of MLCC are obtained. Using the finite element analysis method of indirect thermal-mechanical coupling, the stress analysis is carried out with the temperature field as the boundary condition, and the thermal-structural coupling model is established. By analyzing the thermal stress of MLCC, the weak parts sensitive to thermal stress are determined, which provides a useful reference for solving the reliability problem of MLCC wave soldering.

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Harmonic Response Analysis for Ball Grid Array Package Using Computer Finite Element Simulation

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Journal of physics: Conference Series 2021年第1期2033卷

作者： Wei Su Wenhao Luo Xianshan Dong Si Chen Agam Tomar Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou China MOE Key lab of Disaster Forecast and Control in Engineering Guangzhou China School of Mechanics and Construction Engineering Jinan University Guangzhou China Faculty of Engineering and Mathematical Sciences University of Western Australia

BGA package is selected as the research object in this paper. Workbench (finite elemental analysis tool in ANSYS) is used for harmonic response analysis. The author lays several paper sheets on the sample and builds the finite element model of clamp, ceramic and metal plate. Then, the model analysis is carried out. Based on this, it is converted to harmonic response analysis. According to the results, the author has found that there is no relation between the number of paper sheets and acceleration-frequency result. It promotes the development of electronic packaging reliability.

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Computer Transient Simulation for Dual In-Line Package through Finite Element Analysis and ANASYS Software

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Journal of physics: Conference Series 2021年第1期2033卷

The reliability of the DIP package is studied by numerical simulation. Firstly, the DIP package, fixture and metal steel are modeled. Based on this, variable thickness papers are laid on the sample. According to the experiment, corresponding excitation and boundary condition are set. Then, the transient analysis result of DIP package is obtained through numerical simulation. The results show the relation of different thickness papers and acceleration-time curve, which provides a beneficial reference for the optimization of DIP packing.

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Research on the Test Method of Output Hot Standing Wave of High Power TWT

Research on the Test Method of Output Hot Standing Wave of H...

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International Conference on Vacuum electronics

作者： Xin'ai Liu Feng Zou Gang Wang Guoxing Miao FangFang Song Key Laboratory of Science and Technology on High Power Microwave Sources and Technologies Chinese Academic of Sciences Beijing China University of Chinese Academy of Sciences Beijing China Science and Technology Reliability Physics and Application Technology of Electronic Component Laboratory Guangzhou China

In this paper, the measurement principle of TWT output hot standing wave is analyzed, and the test method of hot standing wave based on vector network analyzer (VNA) is put forward. The feasibility of this method is preliminarily proved by analyzing and comparing the test results of the TWT output cold standing wave, and the output hot standing wave of L band TWT is measured in saturated and small signal states.

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Harmonic components measurement of TWT with rectangular waveguide output structure

Harmonic components measurement of TWT with rectangular wave...

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International Conference on Vacuum electronics

作者： Feng Zou Xin'ai Liu Gang Wang Guoxing Miao FangFang Song University of Chinese Academy of Sciences Beijing China Key Laboratory of Science and Technology on High Power Microwave Sources and Technologies Chinese Academic of Sciences Beijing China Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory Guangzhou China

The results of output harmonic components measurements show great disagreement where rectangular waveguide is used as output port in hundred watts CW-TWT operating above X-band. Typical error of X-band TWT is larger than 12dB. This paper advanced a quasi-direct measurement method using signal spectrum analyzer (SSA), which measured harmonic components under pulse mode. The error is less than 3.5dB and can be improved by applying matched coax-waveguide convertor.

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Numerical Simulation of Random Vibration Analysis for Ball Grid Array Package

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IOP Conference Series: Earth and Environmental science 2021年第3期769卷

作者： Wenhao Luo Wei Su Xianshan Dong Zhenhua Nie Agam Tomar MOE Key lab of Disaster Forecast and Control in Engineering Guangzhou China School of Mechanics and Construction Engineering Jinan University Guangzhou China Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou China Faculty of Engineering and Mathematical Sciences University of Western Australia Perth Australia

This paper uses ANSYS Workbench (a finite element analysis software) to simulate BGA ceramic packing. The author models fixture, ceramic and metal steel. Then different thickness papers are laid on the BGA product. By random vibration analysis, the natural frequency and mode of the sample are obtained. According the results, the author discusses the relationship between different thickness papers and PSD-frequency curve. It provides a benefit instruction for the design of BGA packing.

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Investigations on the Short-Circuit Degradation and its Mechanism of 1.2-KV 19-A SiC power MOSFETs

Investigations on the Short-Circuit Degradation and its Mech...

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International Symposium on Physical & Failure Analysis of Integrated Circuits

作者： J. L. Wang Y. Q. Chen Z. Y. He Y. F. En X. B. Xu Y. Huang K. W. Geng School of Electronic and Information Engineering South China University of Technology Guangzhou Guangdong China Science and Technology on Reliability Physics and Application of Electronic Component Laboratory No.5 Electronics Research Institute of the Ministry of Industry and Information Technology Guangzhou Guangdong China

To provide a guideline for converter design and fault protection, the failure mechanism and reliability of silicon carbide (SiC) power MOSFETs needs to be further investigated. In this paper, the failure mechanism during short-circuit (SC) of commercial 1.2-KV/19-A SiC power MOSFETs was investigated. After the SC tests, the I ds of the device decreased significantly. Moreover, it was found that the V th and I gs increased obviously. The results demonstrated that negative charges were captured by the gate oxide and accumulated during the SC tests, which is eventually causes degradation of the gate oxide. The results of this study may be useful in the design and application of SiC power MOSFETs.

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Effect of Cryogenic Storage on reliability of the BGA Interconnect Solder Joint

Effect of Cryogenic Storage on Reliability of the BGA Interc...

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2018 International Conference on Advanced electronic Materials, Computers and Materials Engineering, AEMCME 2018

作者： Fu, Xing En, Yunfei Ma, Bin Yao, Ruohe Zhou, Bin Huang, Yun School of Electronics and Information South China University of Technology Guangzhou510006 China Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Guangzhou510610 China China Electronic Products Reliability and Environmental Testing Institute Guangzhou510610 China

The inhibitory effect of cryogenic factor on the migration rate of Cu atoms resulted in the formation of granular Cu6Sn5. The cryogenic temperature greatly reduced the active ability of atoms and vacancies leading to the even dispersion of lead atoms. The mismatch in the thermal expansion coefficient between the IMCs and the solder matrix promoted the propagation of tiny cracks. The thicker IMCs induced larger residual stresses and serious mismatch, resulting in the generation of microcracks and peeling. © Published under licence by IOP Publishing Ltd.

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An R-SIFT Image Matching Intelligent Algorithm Applied to Hardware Trojan Detection

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Journal of physics: Conference Series 2021年第1期1927卷

作者： Chen Sun Pujiang Liang Lingling Li Jingjing Ma Licheng Jiao Fang Liu Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Guangzhou 511370 China Key Laboratory of Intelligent Perception and Image Understanding of Ministry of Education International Research Center for Intelligent Perception and Computation Joint International Research Laboratory of Intelligent Perception and Computation School of Artificial Intelligence Xidian University Xi'an 710071 China

Malicious modification, deletion or addition of some modules in the integrated circuits (ICs) will cause the chip to be attacked, which is called Hardware Trojans (HTs). Reverse engineering (RE) is a classic destructive method and widely used in HTs detection. However, RE is very time-consuming and error prone. In this paper, based on RE, we propose the R-SIFT algorithm to match image and reformulate the Trojan detection problem as change detection problem. For the R-SIFT algorithm, the ratio of exponentially weighted averages (Roewa) operator is introduced into the scale-invariant feature transform (SIFT) algorithm. Experiments show that the proposed method has 7 to 56 times more matching points than the original SIFT can be effectively applied to HTs detection.

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