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IEEE Transactions on Signal and Power Integrity 2025年 4卷 116-123页

作者： Li, Chaofeng Mousavi, Mehdi Mousavi, Seyed Mostafa Asadi, Reza Ye, Xiaoning Kim, DongHyun Missouri University of Science and Technology Electromagnetic Compatibility Laboratory RollaMO65401 United States Intel Corporation HillsboroOR95134 United States

The dielectric substrate of printed circuit boards (PCBs) generally consists of epoxy or polyurethane resin and fiberglass, which can be modeled as inhomogeneous dielectric layers (IDLs). IDLs are not homogeneous in the perpendicular direction of the layers’ interface, which means that they constitute an anisotropic material. Thus, the effective dielectric constant (Dk) for IDLs is direction dependent, i.e., mode dependent. In this study, the effective Dk values of IDLs are extracted for different modes using three commonly used full-wave simulation models: the transverse electric (TE), transverse magnetic (TM), and equivalent parallel-plate capacitor models. The results for the TE and TM modes showed a 10% discrepancy. The effective Dk of IDLs was efficiently estimated by the parallel-plate capacitor model based on the layers’ dielectric properties and thicknesses. Moreover, the analytical formulas of resonance frequency for a cylindrical cavity resonator filled with IDLs were derived to extract the effective Dk of the IDLs at different resonance modes, which could be used as a guideline of resonator methods for PCB material characterization. These results correlated with the results from the equivalent parallel capacitor model. Finally, the impact of IDL anisotropy on transmission line loss and time-domain reflectometry impedance was analyzed based on full-wave simulation. © 2022 IEEE.

关键词： Anisotropy

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Component Level EM Emission Assessment and Management for RF Desensitization

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IEEE Transactions on electromagnetic compatibility 2025年第2期67卷 578-586页

作者： Su, Xiangrui Huang, Wenchang Cho, Junghee Paek, Joonki Hwang, Chulsoon Missouri University of Science and Technology Electromagnetic Compatibility Laboratory RollaMO65409 United States Sk Hynix Inc. Solution Design & Integration Group Seongnam13558 Korea Republic of

Radio frequency (RF) desensitization is a common issue caused by high-speed components in modern electronic devices. Consequently, numerous studies have focused on characterizing and quantifying electromagnetic (EM) emission sources by using near field scanning to detect EM noise sources. However, before near field scanning, no predetermined threshold is available to quickly assess whether an EM noise source will pose RF desensitization risks in the receiving antenna. This article presents a method to optimize near field scanning settings through EM emission management analysis. Drawing on experience from numerous EM emission studies, we introduce an EM emission management procedure for two common noise sources: dipole-like noise sources and cavity noise sources. The scanning results of three practical examples are provided to validate the efficiency of the proposed EM emission management analysis. © 2025 IEEE.

关键词： Antennas

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Reinforcement-Learning-Based Optimization of Bonding Wires for EMI Mitigation

IEEE Transactions on Signal and Power Integrity

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IEEE Transactions on Signal and Power Integrity 2025年 4卷 124-131页

作者： Huang, Wenchang Ouyang, Muqi Sun, Yin Lee, Jongjoo Hwang, Chulsoon Missouri University of Science and Technology Electromagnetic Compatibility Laboratory RollaMO65401 United States Zhejiang Lab Hangzhou310000 China Giga-to-Tera Hwasung18468 Korea Republic of

Wire bonding as a metallic interconnection is widely used to transmit high-speed signals and supply power within the integrated circuit (IC) packages. However, bonding wires also effectively radiate power noise and the harmonics of the output signals, causing electromagnetic interference and radio frequency interference issues. In this study, a current-loop model using a transfer admittance matrix for estimating the equivalent radiation sources of an IC/package featuring bonding wires is proposed. Based on the proposed modeling method, a novel reinforcement learning algorithm is applied to optimize the configurations of signal, power, and ground bonding wires, mitigating the radiation from the IC/package. The proposed modeling method is validated experimentally by a self-designed IC with an inverter-type buffer based on a complementary metal-oxide-semiconductor 0.18-μm process, and a radio frequency victim antenna built on the same printed circuit board. From 720 to 900 MHz, the maximum difference between the proposed modeling method and the measurement results is only 2.3 dB. In addition, full-wave simulation is performed to evaluate the optimization results of the reinforcement learning algorithm, showing radiation mitigation of over 7 dB compared to the randomly selected bonding-wire configurations. © 2022 IEEE.

关键词： electromagnetic pulse

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System-Level Application of the Z-Directed Component (ZDC) for Power Integrity

IEEE Transactions on Signal and Power Integrity

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IEEE Transactions on Signal and Power Integrity 2025年 4卷 10-18页

作者： Vuppunutala, Pranay Zhu, Xiaolu Park, Junyong Hardin, Keith B. Kratzer, Zachary C. N. Fessler, John T. Zhao, Biyao Bai, Siqi Missouri University of Science and Technology Electromagnetic Compatibility Laboratory RollaMO65401 United States Dankook University Yongin16890 Korea Republic of Lexmark International Inc. LexingtonKY40550 United States

The design of the power distribution network (PDN) involves the careful placement of several decoupling capacitors around the integrated circuits (ICs) to mitigate the noise inherent with switching. A new technology capacitor, Z-directed component (ZDC), can target printed circuit board (PCB) component locations at the package balls of the IC through the PCB. A commercially available PCB PDN design, using a conventional surface mount technology (SMT) decoupling solution, was analyzed utilizing a commercially available simulation-based tool and validated by impedance measurements. The ZDC PDN performance in the system was predicted by substituting a ZDC capacitor model for selected SMT capacitors. The validation was carried out using two-port PDN measurements on the PCB. Finally, an equivalent circuit model is developed using cavity model and plane-pair partial element equivalent circuit techniques to represent the physics associated with current paths from all the decoupling capacitors to the IC. The simulation results from a commercial tool are corroborated with both the measurements and an equivalent circuit model. It is demonstrated that opting for ZDC as a decoupling solution can deliver significantly lower impedances as compared to the SMT solution for this design. Thus, the ZDC approach is a promising decoupling solution for future power integrity applications, enhancing the power integrity performance of the system, facilitating the use of cost-effective lower layer count PCBs for much higher speeds than adopting an SMT strategy. © 2022 IEEE.

关键词： Surface mount technology

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Terahertz nondestructive measurement of multilayer films via polarization modeling driven deep learning

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IEEE Sensors Journal 2025年第11期25卷 20388-20395页

作者： Ming, Ziwei Xiao, Long Yang, Le Ding, Hao Liu, Jinsong Yang, Zhengang Liu, Defeng Wang, Kejia Huazhong University of Science and Technology Wuhan National Laboratory for Optoelectronics Wuhan430074 China Sci. and Technol. on Electromagnetic Compatibility Lab. China Ship Development and Design Center Wuhan430064 China AVIC Beijing Changcheng Aeronautical Measurement and Control Technology Research Institute Beijing101111 China

In modern film application technology, according to the different characteristics of each layer of film, the structure of multilayer films is often used to improve the overall comprehensive performance of the films, but the loss of multilayer films in the long-term use process will affect the performance of the multilayer films, thus affecting the system involved in the films. Therefore, it is of great significance to measure the thickness and optical constants of each layer of multilayer films. The existing thin film measurement technology usually uses multi-wavelength wide spectrum measurement methods to measure the optical constants or thickness of the thin film, but the existing technology cannot measure the thickness and optical constants of each layer of the multilayer films at the same time. Here, utilizing the deep penetration and nondestructive nature of terahertz radiation, we present an integrated methodology combining photophysical modeling with deep neural network architecture. Through systematic experimental validation, our single-wavelength polarization measurement framework enables real-time, high precision determination of each layer thickness and optical constants within multilayer films structure. © 2001-2012 IEEE.

关键词： Multilayer films

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Two-dimensional curved-surface metamaterial structure in THz frequency band 7

Two-dimensional curved-surface metamaterial structure in THz...

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2017 7th IEEE International Symposium on Microwave, Antenna, Propagation, and EMC Technologies

作者： Ding-e Wen Mingliang Huang Ming Zhang Sheng Li Chan Qiao Science and Technology on Electromagnetic Compatibility Laboratory

ISBN: (纸本)9781509059300;9781509059294

In this paper, a dual-band metamaterial structure（MS） based on a two-dimensional（2D） curvedsurface substrate is simulated working in THz band. The simulated results showed some novel properties compared to the conventional planar MA. The curvedsurface MS appeared two resonant frequencies at 9.63 THz and 11.27 THz. With the transmissivity zero and the reflectivity approaching to zero, the incident plane wave is partly polarization converted and partly absorbed.

关键词： curved surface metamaterial THz

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A Well-designed Sensor Based on Split-ring Resonators at Microwave Frequencies 7

A Well-designed Sensor Based on Split-ring Resonators at Mic...

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2017 7th IEEE International Symposium on Microwave, Antenna, Propagation, and EMC Technologies

作者： Dong Jing Huang Mingliang Zhang Wei Science and technology on electromagnetic compatibility laboratory

ISBN: (纸本)9781509059300;9781509059294

In this paper, we introduce a new two-sided resonator based on the split-ring resonators to the permittivity measurement at microwave frequencies. The samples with specified thickness are placed on a well designed sensor, so that relatively large frequency offsets due to the samples can be detected to retrieve the permittivity. Analysis and simulations validate that by applying this method, permittivity can be linearly retrieved from the measured frequency offsets. The measurement setup can be conveniently calibrated with a given sample with known permittivity.

关键词： Frequency offsets permittivity measurement spiltring resonators

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Analysis of EMI reduction techniques on a PRBS generator board

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IEEE electromagnetic compatibility Magazine 2015年第1期4卷 67-74页

作者： Pilla, Viswa Li, Tianqi Pommerenke, David Vellore Institute of Technology Missouri University of Science and Technology United States Missouri University of Science and Technology Electromagnetic Compatibility Laboratory CupertinoCA United States Technical University Berlin Electromagnetic Compatibility Laboratory IEEE Transactions on EMC Germany

In this article, several EMI characterization and reduction techniques have been investigated and their effectiveness is demonstrated using the developed test boards. The sum and difference outputs of the hybrid (expressed in dBm), that is placed at the output of the TEM cell, are be used to make relative comparisons between the electric and magnetic far field emissions. This data is used to compare the effectiveness of the EMI reduction techniques. © 2012 IEEE.

关键词： electromagnetic compatibility

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Controlling system design of high speed stepping motor based on serial communication

Controlling system design of high speed stepping motor based...

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2011 4th IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2011

作者： Tan, Hui Huang, Mingliang Zhang, Qi Liu, Yi Science and Technology on Electromagnetic Compatibility Laboratory Wuhan China

ISBN: (纸本)9781424482665

This paper introduces a controlling system of high speed stepping motor which combines singlechip and serial communication. This system contains the upper machine which is a PC, and the lower machine which is a singlechip. The upper machine communicates with the lower machine through serial port. An accelerating process is required because corresponding pulse frequency of regulated rotating speed is much greater than startup frequency of stepping motor. Accelerating program is written by compiling language and transition time can be precise to microsecond, which assures stability of accelerating process. This paper compares transition time and stability between exponential accelerating curve and uniform accelerating curve. Transition time is shorter and accelerating process is more stable for exponential accelerating curve. © 2011 IEEE.

关键词： Stepping motors

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Investigation for suppressing radiant interference with plates

Investigation for suppressing radiant interference with plat...

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2011 4th IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2011

作者： Song, Dong-An Yi, Xueqin Science and Technology on Electromagnetic Compatibility Laboratory Wuhan China

Suppressing radiant interference with plates is a convenient and doable technology, especially in controlling mutual coupling of radar sidelobe. This paper has investigated shading mechanism of the plate. The Fresnel ... 详细信息

ISBN: (纸本)9781424482665

关键词： Plate metal

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